Preparation of coating type cerium oxide / silicon oxide compound abrasive

Abstract

The invention belongs to the field of preparation of ultrafine compound powder, and relates to a novel method for preparing a coated type cerium oxide / silicon oxide compounded abrasive. The method comprises the following steps: firstly, using cerium nitrate hexahydrate, acetylacetone, citric acid, n-propanol and anhydrous ethanol as raw materials to prepare a cerium colloidal sol; secondly, steeping silicon oxide powder into the cerium colloidal sol, and keeping stand the mixture after dispersing the mixture through ultrasound and mechanical agitation; and thirdly, using a centrifugal method to separate the silicon oxide of which the surface is coated with the cerium colloidal sol, drying and grinding the silicon oxide in an air drying box, and then calcining the silicon oxide to obtain the coated type cerium oxide / silicon oxide compounded abrasive. The method can further prepare the coated type cerium oxide / silicon oxide compounded abrasive with different particle sizes and coating quantities by preparing the cerium colloidal sols with different cerium ion concentrations and selecting the silicon oxide powder with different particle sizes as an inner core. The method has the advantages of good coating effect, comparatively simple process, and good experimental repeatability. Besides, the method can be applied to preparing coated structure compounded abrasive of which the surface is coated with nanometer cerium oxide particles by using other powder as the inner core.

Description

technical field [0001] The invention belongs to the field of preparation of ultrafine composite powder, relates to a novel preparation method of coated cerium oxide / silicon oxide composite abrasive, and more specifically belongs to the field of preparation technology of polishing media for ultra-precision polishing. Background technique [0002] With the rapid development of the semiconductor industry, VLSI is developing in the direction of increasing integration, increasing wafer diameter, reducing feature size, increasing power consumption, and increasing the number of interconnection layers. Therefore, the chemical mechanical polishing (CMP) process The dependence on technology is also increasing. The CMP slurry is mainly composed of abrasives, pH regulators and surfactants. Abrasives, as polishing media, play an extremely important role in the removal process of CMP materials. The properties of abrasives themselves, such as the shape, particle size and particle size of a...

AI Technical Summary

Problems solved by technology

At present, the above-mentioned preparation methods all use liquid phase precipitation, and the preparation process is relatively complicated. The coating of cerium oxide particles on the surface of silicon oxide is not uniform enough, and the coating amount of cerium oxide particles cannot be conveniently controlled, and the precursor of cerium is easy to Nucleation alone, resulting in the inability to fully obtain the ceria / silicon oxide composite powder with a coating structure

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