Micro-fine processing system of femtosecond laser for material surface modification

Abstract

The invention discloses a micro-fine processing system for the surface modification of materials using femto-second laser, comprising a femto-second laser, a micro-light path system, a high-precision three-dimensional working platform and a control system host machine, wherein the femto-second laser acquires an emitted laser beam to focus and irradiate onto processed components on the three-dimensional working platform through the micro-light path system; the micro-light path system comprises a microscope for the observation of processing, a light batch system with a CCD monitor imaging unit,and the three-dimensional working platform is connected with the control system host machine in a control way. The micro-fine processing system uses the femto-second laser as a processing light source to precisely process the surface modification of material through the characteristics of unique ultra-short duration and ultra-strong peak power of the femto-second laser, the cooperation of the optical system and the high-precision three-dimensional working platform and the control of a software program in order to achieve the ultra-precise processing in the sub-micron level for no presence of heat affected zone during the processing and to provide a useful tool for automobile industry, semiconductor, communication industry, and the like needing the high-precision processing.

Description

technical field [0001] The invention belongs to the technical field of optical fine processing systems, and relates to a micro fine processing system for modifying the surface of a material by a femtosecond laser. Background technique [0002] Research on laser surface treatment technology began in the 1960s, but it was not until the early 1970s that high-power lasers were developed that this technology was practically applied, and developed rapidly in the following decades. Laser surface treatment technology is a high-tech that integrates modern physics, chemistry, computer, material science and advanced manufacturing technology. It forms a treatment layer with a certain thickness on the surface of the material by means of laser processing. It can improve the mechanical properties, metallurgical properties and physical properties of the material surface, thereby improving a series of properties such as wear resistance, corrosion resistance and fatigue resistance of the part...

AI Technical Summary

Problems solved by technology

Although the YAG laser with YAG crystal as the substrate has matured and been widely used in technology and technology since its appearance, this processing technology still has the following disadvantages: (1). During the interaction between the laser and the material, heat Diffusion makes the material around the processing area absorb energy continuously, and the energy acting on material removal decreases, thereby reducing the processing efficiency; (2). Thermal diffusion reduces the temperature of the focal point, so that the temperature of the focal point cannot far exceed the melting point of the material. It can continuously deposit energy and complete the removal of materials by boiling and vaporization; (3). During laser processing, heat diffuses around the focus, and the processing area is larger than the size of the focus, resulting in melting and other phenomena at the edge of the process. In this way, it is impossible to obtain workpieces with strict dimensions and high precision, which reduces the precision of micromachining; (4). The heat diffused during laser processing propagates through the heat-affected zone, generating mechanical stress, resulting in mechanical cracks, and affecting the surrounding materials in the processing area. cause adverse effects

From the actual use effect, the use of excimer lasers is good in processing holes of the same shape and repeatability, but the overall efficiency is not high, only about 1% of the pulse energy acts on the processing surface, while other About 99% of the light energy is lost in the template, so its output power is small and the processing efficiency is low

In addition, the cross-section of the excimer laser beam is a large rectangle with poor spatial quality, which severely limits the focusing of the beam, making it necessary to use a mask in the microprocessing process, and the excimer laser must use toxic gases , and the replacement, storage and adjustment process of special gas is very troublesome

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