Method for preparing protective film playing a role in protecting glass micro-fluidic chips in etching process

A protective effect and protective film technology, which is applied in the direction of producing decorative surface effects, microstructure technology, microstructure devices, etc., can solve the requirements of inability to achieve deep etching, increase the cost of microfluidic chips, and cannot withstand Affected by problems such as hydrofluoric acid corrosion, the effects of reduced production costs, improved quality, and enhanced protection are achieved.

Inactive Publication Date: 2011-05-04
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is difficult to obtain high-depth microchannels by using glass to make microfluidic chips, because the production of high-depth microchannels requires long-term etching of the glass surface, and the photoresist and chromium layers cannot withstand long-term hydrofluoric acid. Corrosion
Although some photoresists have slightly better performance, they cannot meet the requirements of deep etching, and these photoresists are expensive, which greatly increases the cost of making microfluidic chips

Method used

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  • Method for preparing protective film playing a role in protecting glass micro-fluidic chips in etching process
  • Method for preparing protective film playing a role in protecting glass micro-fluidic chips in etching process
  • Method for preparing protective film playing a role in protecting glass micro-fluidic chips in etching process

Examples

Experimental program
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Effect test

Embodiment 1

[0038] See Figure 3B .

[0039] (1) At first on the clean common float glass substrate, chrome-plated sacrificial layer with the method for vapor deposition;

[0040] (2) Utilize spin coater, on the glass substrate that is plated with chromium sacrificial layer that step (1) obtains, spin coat one deck to contain the positive photoresist photoresist resist of novolac resin; Wherein, spin coater is earlier with 400 Spin coating at the speed of rpm for 10 seconds; then spin coating at 2000 rpm for 20 seconds; volatilize the organic solvent in the positive photoresist containing novolak resin at 110°C (baking glue) for 10 minutes , to obtain a positive photoresist protective film containing a novolac resin with a smooth surface;

[0041] (3) Contact exposure under ultraviolet light (mainly 365nm) with photomask, the figure of mask is copied to step (2) be coated with the chromium sacrificial layer that is coated with the positive photoresist that contains novolac resin On the...

Embodiment 2

[0052] After completing step (4) in Example 1, use at least one of the group consisting of oxalic acid, maleic acid and its anhydride, acetic acid, trichloroacetic acid, benzenesulfonic acid, tartaric acid, citric acid, racemic malic acid It is 2 that the pH of the aqueous solution of formaldehyde that is 15% or the aqueous glutaraldehyde solution that mass concentration is 2% is adjusted mass concentration, then at room temperature the glass substrate obtained in step (4) in Example 1 is soaked in above-mentioned pH that is 2 Formaldehyde aqueous solution or glutaraldehyde aqueous solution for 10 minutes, make formaldehyde molecules or glutaraldehyde molecules infiltrate in the middle of the positive photoresist matrix containing novolac resin; rinse the soaked glass substrate with distilled water, adjust the oven temperature, At 100°C, formaldehyde or glutaraldehyde cross-links with the novolac resin component in the novolac resin-containing positive photoresist, keeps this t...

Embodiment 3

[0056]After completing step (4) in Example 1, use at least one of the group consisting of oxalic acid, maleic acid and its anhydride, acetic acid, trichloroacetic acid, benzenesulfonic acid, tartaric acid, citric acid, racemic malic acid The pH of the 18% formaldehyde aqueous solution or the 6% glutaraldehyde aqueous solution is adjusted to be 2.8 in mass concentration, and then the glass substrate obtained in step (4) in Example 1 is soaked in the above-mentioned pH of 2.8 at room temperature. Formaldehyde aqueous solution or glutaraldehyde aqueous solution for 15 minutes, make formaldehyde molecules or glutaraldehyde molecules infiltrate in the middle of the positive photoresist matrix containing novolac resin; rinse the soaked glass substrate with distilled water, adjust the oven temperature, At 110°C, formaldehyde or glutaraldehyde cross-links with the novolac resin component in the novolac resin-containing positive photoresist, keeps this temperature for 15 minutes, and fi...

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Abstract

The invention relates to a method for preparing protective film playing a role in protecting glass micro-fluidic chips in etching process. The method comprises the steps of plating a glass substrate with a chromium sacrificial layer, smearing glue, baking the glue, performing UV exposure, developing, removing the chromium sacrificial layer, performing wet etching, removing the glue, removing the chromium sacrificial layer and sealing at high temperature when a glass micro-fluidic chip is conventionally manufactured. The method is characterized in that positive photoresist containing linear phenolic resin is taken as a basis; after the developing step and before the follow-up step of removing the chromium sacrificial layer, by taking a formaldehyde monomer aqueous solution or a glutaraldehyde aqueous solution with a certain concentration and pH value as a cross-linking agent, formaldehyde or glutaraldehyde and the linear phenolic resin in the positive photoresist containing the linear phenolic resin are subjected to cross-linking reaction; and the photoresist is cross-linked to be the protective film of which the body type is in a network structure so as to enable the photoresist protective film to prolong the time of tolerating the corrosion of hydrofluoric acid glass etching liquid and increase the etching depth of micro-fluidic channels. The method is applicable to the glasssubstrates plated with other metal sacrificial layers.

Description

technical field [0001] The invention relates to a protective film for etching glass microfluidic chips with high-depth channels or other glass microfluidic devices, in particular to etching glass microfluidic chips and other glass microfluidic devices. In the process of glass microfluidic devices, a method for preparing a protective film that protects glass microfluidic chips during etching is proposed by increasing the crosslinking degree of positive photoresist containing novolac resin. Background technique [0002] Glass has good electroosmotic properties and excellent optical properties. The background fluorescence generated during detection is much smaller than that of high molecular polymers. Its surface properties, such as wettability, surface adsorption and surface reactivity, are conducive to the use of different chemicals. The method is to modify its surface, and it is easy to form microchannels on the glass surface by hydrofluoric acid etching, and the microchanne...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81C1/00
Inventor 陈义王海
Owner INST OF CHEM CHINESE ACAD OF SCI
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