Resin matching fluid used for metal foil laminated board
A technology of resin and epoxy resin, which is applied in the field of resin compounding solution in the field of preparing high-density interconnected multilayer boards or IC packaging, and can solve the problem of poor toughness and impact resistance, high crosslinking density, and poor heat resistance of cured products etc. to achieve low thermal expansion coefficient, high circuit processability, and improved compatibility
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Example Embodiment
[0036] Example one
[0037] (1) Preparation of epoxy resin solution: Weigh 100 parts by weight of bisphenol A Novrak type epoxy resin, 67 parts by weight of phenolic resin, 0.5 parts by weight of 2-ethyl-4-methylimidazole, and add to 100 parts by weight Part of the methyl ethyl ketone solvent is stirred and mixed to prepare a resin compounding liquid.
[0038] (2) Inorganic whisker surface treatment: weigh 72 parts by weight of magnesium borate whiskers (average diameter of 0.8μm, average length of 20μm, elastic modulus greater than 200GPa) and 29 parts by weight of borate coupling agent (borate positive Butanol-diethanolamine ester, n-BE4), and then add 30 parts by weight of methyl ethyl ketone solution, stir and mix well.
[0039] Then add the magnesium borate whisker solution to the resin compounding solution, continue to stir and mix evenly. An epoxy resin compound liquid containing magnesium borate whiskers with a solid content of 60% was obtained.
[0040] (3) 8 pieces of 76...
Example Embodiment
[0042] Experimental example two
[0043] (1) Preparation of epoxy resin solution: Weigh 100 parts by weight of bisphenol A Novrak type epoxy resin, 67 parts by weight of phenolic resin, 0.5 parts by weight of 2-ethyl-4-methylimidazole, and add to 100 parts by weight Part of the methyl ethyl ketone solvent is stirred and mixed to prepare a resin compounding liquid.
[0044] (2) Surface treatment of inorganic whiskers: Weigh 19 parts by weight of magnesium borate whiskers (average diameter of 0.8μm, average length of 20μm, elastic modulus greater than 200GPa) and 7.6 parts by weight of borate coupling agent (borate Butanol-diethanolamine ester, n-BE4), dissolve it with 16.4 parts by weight of solvent, stir and mix well.
[0045] Then add the magnesium borate whisker solution to the resin compounding solution, continue to stir and mix evenly. An epoxy resin compound liquid containing magnesium borate whiskers with a solid content of 60% was obtained.
[0046] Then, the bonding sheet ...
Example Embodiment
[0047] Experimental example three
[0048] (1) Preparation of epoxy resin solution: Weigh 100 parts by weight of bisphenol A Novrak type epoxy resin, 67 parts by weight of phenolic resin, 0.5 parts by weight of 2-ethyl-4-methylimidazole, and add to 100 parts by weight Part of the methyl ethyl ketone solvent is stirred and mixed to prepare a resin compounding liquid.
[0049] (2) Inorganic whisker surface treatment: weigh 251 parts by weight of magnesium borate whiskers (average diameter of 0.8μm, average length of 20μm, elastic modulus greater than 200GPa) and 100 parts by weight of borate coupling agent (borate positive Butanol-diethanolamine ester, n-BE4), dissolve with 79 parts by weight of solvent, stir and mix well.
[0050] Then add the magnesium borate whisker solution to the resin compounding solution, continue to stir and mix evenly. An epoxy resin compound liquid containing magnesium borate whiskers with a solid content of 60% was obtained.
[0051] Then, the bonding she...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap