Resin matching fluid used for metal foil laminated board

Abstract

The invention discloses a resin matching fluid, comprising the following components: epoxy resin, a curing agent, a curing accelerator, a solvent, an inorganic crystal whisker and a surface coupling agent; the surface coupling agent is one or mixture of two or more than two selected form triethanolamine borate, diethanolamine n-butanol-borate, diethanolamine sec-butanol-borate or diethanolamine t-butanol-borate; due to the use of borate ester surface coupling agent, the resin matching fluid improves the compatibility of inorganic crystal whisker and thermosetting resin, thus obtaining the metal foil laminated board with high rigidity, low coefficient of thermal expansion and high cohesiveness; and a printed circuit board of the metal foil laminated board has high circuit processability in manufacture, thus being capable of meeting the requirements of thin multi-layer printed circuit boards and being applicable to HDI boards and IC package substrates.

Description

technical field [0001] The invention relates to a resin compounding solution required for the preparation of metal foil laminated boards, and is specifically designed and applied to the resin compounding liquid in the field of preparing high-density interconnect multilayer boards or IC packaging. Background technique [0002] In recent years, electronic products have been miniaturized and multi-functional, making printed circuit boards develop in the direction of fineness, thinness, and multi-layers. More and more high-end products use high-density interconnect (HDI) multi-layer boards; Due to the increasingly complex production and use processes, higher requirements are put forward for the performance of PCB substrate materials, requiring the board to have high thermal mechanical strength, low thermal expansion rate, and glass transition temperature; at the same time, because the substrate material for packaging is thinner, more Due to the pursuit of narrower spacing and mu...

AI Technical Summary

Problems solved by technology

However, the cross-linking density is high, the cured product is brittle, and the toughness and impact resistance are poor, which affects the drilling processability of printed circuit boards.

[0006] In the traditional resin compounding solution, aluminum hydroxide, silicon dioxide and other inorganic fillers are generally added to improve the rigidity and thermal expansion properties of the sheet, and are used in the fields of high-density interconnection (HDI) and IC packaging, but metal foil and traditional Poor adhesion and heat resistance between resins affect product quality

[0007] Japanese patents with publication numbers Hei 11-207868, Hei 09-254313, 2001-316563 and 2001-316564 disclose a copper-clad laminate (referred to as copper-clad laminate), which is thin, stable, and low in production cost; The insulating layer in the copper-clad laminate is composed of thermosetting resin and insulating inorganic whiskers; wherein, the inorganic whiskers are treated with a surface treatment agent, and the surface treatment agent is selected from: silane-based coupling agents, titanium-based coupling agents, aluminum It is one of coupling agent, phosphorus coupling agent, amino acid coupling agent or boron coupling agent; but, the compatibility between the whiskers and the resin in the above-mentioned patents is poor, and the whiskers are not fully developed. The role in the resin, thus affecting the overall performance of the cured resin