Halogen-free lead-free soldering paste and preparation method thereof

A technology of halogen-free lead-free solder paste and lead-free solder, which is applied in the field of halogen-free lead-free solder paste and its preparation, can solve the problems of storage, short service life, poor welding of solder paste, and reduced insulation resistance, etc., and achieve long storage life , Improve solderability, improve wettability effect

Inactive Publication Date: 2010-04-21
东莞市特尔佳电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the residual halide after soldering will undergo electromigration, which will cause a decrease in insulation resistance, and even corrode the substrate, resulting in a decrease in product reliability. Therefore, halogen-free is another major technical barrier in the lead-free process.
At present, among various lead-free solder pastes, Sn / Ag / Cu alloy is the most widely accepted solder component in the industry, but its performance in various aspects is not ideal, such as poor soldering of solder paste, storage, use Defects such as short life

Method used

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  • Halogen-free lead-free soldering paste and preparation method thereof

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Embodiment 1

[0035] Flux raw materials: polymerized rosin 25g, hydrogenated rosin 20g, modified hydrogenated castor oil 4g, hydrogenated castor oil wax 2g, methyl succinic acid 4g, stearic acid amide 1g, triethanolamine 1.3g, phytic acid 0.7g combination and terpineol 42g.

[0036] Preparation method: first mix 1.3g of triethanolamine and 0.7g of phytic acid and stir for 5 minutes until the reaction is complete, then cool at room temperature for use. Mix 25g of polymerized rosin, 20g of hydrogenated rosin and 42g of terpineol and dissolve at a temperature of 150°C, then add 4g of modified hydrogenated castor oil, 2g of hydrogenated castor oil wax, and then add 4g of methyl succinic acid after completely dissolving, After the above materials are completely dissolved, cool them down. When cooling to 80±10°C, add stearic acid amide 1g, triethanolamine 1.3g and phytic acid 0.7g composition, and continue cooling to room temperature to obtain flux. 12g is mixed with 88g of Sn / Ag3 / Cu0.5 solder a...

Embodiment 2

[0038] Flux raw materials: polymerized rosin 30g, hydrogenated rosin 20g, modified hydrogenated castor oil 3g, hydrogenated castor oil wax 3g, succinic anhydride 3g, methyl succinic acid 2g, stearic acid amide 1g, N,N-dimethyl Cetylamine 1.9g, phytic acid 1.1g, diethylene glycol monobutyl ether 20g and ethylene glycol hexyl ether 15g.

[0039] Preparation method: first mix 1.9g of N,N-dimethylhexadecylamine and 1.1g of phytic acid and stir for 5 minutes until the reaction is complete, then cool at room temperature for use. 30 g of polymerized rosin, 20 g of hydrogenated rosin, 20 g of diethylene glycol monobutyl ether, and 15 g of ethylene glycol hexyl ether are mixed together and dissolved at a temperature of 150° C., and then 3 g of modified hydrogenated castor oil and 3 g of hydrogenated castor oil wax are added, completely After dissolving, add 3g of succinic anhydride and 2g of methylsuccinic acid. After the above materials are completely dissolved, cool down. When coolin...

Embodiment 3

[0041] Flux raw materials: polymerized rosin 40g, hydrogenated rosin 10g, modified hydrogenated castor oil 1g, hydrogenated castor oil wax 4g, succinic anhydride 4g, stearic acid amide 2g, triethanolamine 2.2g, phytic acid 1.8g and diethyl Diol monobutyl ether 35g.

[0042] Preparation method: first mix 2.2g of triethanolamine and 1.8g of phytic acid and stir for 5 minutes until the reaction is complete, then cool at room temperature for use. Mix 40g of polymerized rosin, 10g of hydrogenated rosin and 35g of diethylene glycol monobutyl ether to dissolve together at a temperature of 150°C, then add 1g of modified hydrogenated castor oil, 4g of hydrogenated castor oil wax, and then add succinic anhydride after completely dissolving 4g, the above materials are completely dissolved and then cooled, and when cooled to 80±10°C, add 2g of stearic acid amide, 2.2g of triethanolamine and 1.8g of phytic acid, and continue to cool to room temperature to obtain flux. Mix 11g of flux with...

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Abstract

The invention relates to the technical field of soldering pastes, in particular to a halogen-free lead-free soldering paste for soldering an electronic device and a preparation method thereof. The halogen-free lead-free soldering paste consists of a soldering flux and tin-based alloy powder distributed in the soldering flux, wherein the soldering flux consists of the following components in percentage by weight: 25 to 45 percent of polymerized rosin, 5 to 20 percent of hydrogenated rosin, 1 to 4 percent of modified hydrogenated castor oil, 1 to 4 percent of hydrogenated castor oil wax, 3 to 5 percent of activating agent, 1 to 2 percent of stearic amide, 2 to 4 percent of amine and phosphate, and an organic solvent. Because the soldering paste is added with a composition of the amine and the phosphate, not only the solderability of the soldering paste is much better than that of the soldering paste without the composition, but also the soldering paste added with the composition of the amine and the phosphate almost has no tin sweats and particularly can be stored for a long time at normal temperature to keep a good state.

Description

technical field [0001] The invention relates to the technical field of solder paste, in particular to a halogen-free lead-free solder paste for electronic equipment welding and a preparation method thereof. Background technique [0002] In recent years, the problem of environmental pollution has attracted great attention from people all over the world. The products used around us are not only required to have a high degree of safety and zero pollution, but also require them to have high reliability. In the traditional solder paste process, halide is the active ingredient in the solder paste material, which has the effect of surface purification, not only protects the solder from oxidation during soldering, but also removes the oxide film on the metal surface. However, the residual halides after soldering will undergo electromigration to cause a decrease in insulation resistance, and even corrode the substrate, resulting in a decrease in product reliability. Therefore, haloge...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/362B23K35/40
Inventor 陈东明郑伟民周华涛
Owner 东莞市特尔佳电子有限公司
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