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Pre-wetted modified dust-free cleaning cloth and making method thereof

A technology of dust-free wiping cloth and manufacturing method, which is applied in the direction of cleaning methods and utensils, chemical instruments and methods, cleaning methods using tools, etc., which can solve the problem of inability to effectively obtain and retain dirt, particle adsorption and liquid absorption effect Poor, low surface energy of dust-free wipes, etc., to reduce VOC gas release, improve adsorption and liquid absorption, and improve controllability and reliability

Active Publication Date: 2010-06-09
SHENZHEN SELEN SCI & TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the high crystallinity of chemical fiber filaments and the lack of active chemical groups on the surface, this dust-free wiping cloth has low surface energy, poor particle adsorption and liquid absorption, and cannot effectively capture and retain various dirt.

Method used

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  • Pre-wetted modified dust-free cleaning cloth and making method thereof
  • Pre-wetted modified dust-free cleaning cloth and making method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] Laser cut the all-polyester knitted fabric into a 7-inch-square wiping cloth, put it into an aqueous solution containing 10% modifier ethylene glycol and 0.5% catalyst zinc acetate, and the water-bath ratio is 1:20; after immersing at 90°C for 15 minutes, Wash once with ordinary water, the washing temperature is 50°C, and the washing time is 5min, then use ultrapure water for a second ultra-clean wash, and dry to obtain a dust-free wiping cloth that meets the specifications and cleanliness requirements.

[0042] In a class 10 clean room, soak the modified dust-free wiping cloth with a mixed solution of 30% deionized water and 70% isopropanol, fold and pack it in a resealable packaging bag to obtain a pre-wet modified non-toxic Dust wipes.

[0043] The pre-wet dust-free wiping cloth produced in this embodiment has good particle adsorption performance, and can remove dust particles and metal dust on the wiping surface, as well as polar organic small molecules and polymer ...

Embodiment 2

[0045] Cut 15% spandex and 85% polyester blended knitted fabric into 8-inch square wiping cloths by laser, put them in an aqueous solution containing 1% modifier propylene glycol and 1% catalyst zinc acetate, and the water-bath ratio is 1:5; at 120°C After immersing in (high-pressure hot water) for 10 minutes, wash once with ordinary water, the washing temperature is 25°C, and the washing time is 30 minutes. Dust-free wipes.

[0046] Spray the modified dust-free wiping cloth with a mixed solution of 91% deionized water and 9% isopropanol in a class 10 clean room, fold and pack it in a resealable packaging bag to obtain a pre-wet modified non-toxic Dust wipes.

[0047] The pre-wet dust-free wiping cloth produced in this embodiment has good particle adsorption performance, and can remove dust particles and metal dust on the wiping surface, as well as polar organic small molecules and polymer dirt.

Embodiment 3

[0049] 20% spandex and 80% polyester blended knitted fabric laser cut into 9 inches square wiping cloth, put into the aqueous solution containing 0.1% modifier diethylene glycol and 0.05% catalyst zinc acetate, water-bath ratio 1: 50; After immersing in 170°C (high-pressure hot water) for 1min, wash once with ordinary water at a temperature of 40°C for 15min, then use ultra-pure water for a second ultra-clean wash, and dry to obtain compliance with specifications and cleanliness Dust-free wipes as required.

[0050] Spray wet the modified dust-free wiping cloth with n-hexane in a class 10 clean room, fold and pack it in a resealable packaging bag to obtain a pre-wet modified dust-free wiping cloth.

[0051] The pre-wet dust-free wiping cloth produced in this embodiment has good particle adsorption performance, and can remove dust particles and metal dust on the wiping surface, as well as non-polar organic small molecules and polymer dirt.

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Abstract

The invention relates to a pre-wetted modified dust-free cleaning cloth and making method thereof. The making method of the pre-wetted modified dust-free cleaning cloth includes the following steps: modification: organic compound modifier aqueous solution is adopted for carrying out after finishing on dust-free cleaning cloth, water bath ratio is 1:5-50, the concentration of organic compound modifier is 0.1-10%, the organic compound modifier is provided with a hydroxyl and an active group, the active group is hydroxyl, amidogen or sulfo group, reaction temperature is 90-170 DEG C, reaction time is 1-30min; and pre-wetting: pre-wetting agent is adopted to pre-wet the dust-free cleaning cloth after being modified. The invention utilizes organic compound modifier provided with active group to modify the dust-free cleaning cloth in advance, surface energy of the dust-free cleaning cloth can be obviously improved, absorbability on granule and imbitition effect can be improved, and the function of removing organic molecule or inorganic ion dirt can be realized while realizing dust particle and metal dust capturing.

Description

technical field [0001] The invention relates to the field of clean room consumables, more specifically, to a pre-wet modified dust-free wiping cloth and a manufacturing method thereof. The pre-wet modified dust-free wiping cloth can effectively remove organic dirt, inorganic Dirt, dust particles and metal dust and other functions are mainly used for cleaning semiconductor production line wafers, microelectronic chips and semiconductor assembly lines. In addition, the application of this pre-moistened modified dust-free wiping cloth also involves Display panels, printed circuit boards, precision instruments, optical products, medical equipment, laboratories, dust-free workshops and production lines, etc. Background technique [0002] As the manufacturing of semiconductor integrated circuits is progressing, the density of components is getting higher and higher, and the wire diameter of the corresponding semiconductor manufacturing process is also tending to be miniaturized, a...

Claims

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Application Information

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IPC IPC(8): D06M13/148D06M13/165D06M13/368D06M13/256D06M101/32D06M101/38B08B1/00
Inventor 张原管映亭杜学晓
Owner SHENZHEN SELEN SCI & TECH CO LTD
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