Preparation method of n-type crystalline silicon
A crystalline silicon, n-type technology, applied in the field of crystalline silicon growth, can solve problems such as reducing the comprehensive electrical properties of silicon wafers, and achieve the effects of improving yield, reducing manufacturing costs, and reducing deviation range
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Embodiment 1
[0030] The n-type polycrystalline silicon ingot is prepared by directional solidification under the action of a DC electric field, see Figure 3, and the following steps are used to realize:
[0031] 1) Calculate the doping concentration required for the corresponding silicon material according to the electrical performance requirements of the silicon wafer, and prepare the dopant.
[0032] 2) An anode 14 is arranged at the bottom of the crucible 1, silicon material and dopant are put into the crucible according to a certain ratio, then a cathode 13 is arranged above the silicon material, and the anode 14 is connected to the positive pole of the DC power supply 11 with a wire 12, and the cathode 13 Connect to the negative pole. When arranging the electrodes, pay attention to make the direction of the electric field parallel to the growth direction of the crystal. The anode 14 and the cathode 13 are made of high-purity graphite, and the wire 12 is made of high-purity molybdenum ...
Embodiment 2
[0038] Under the action of a DC electric field, the n-type single crystal silicon rod is drawn by the CZ method, see Figure 4, and the following steps are used to achieve:
[0039] 1) Calculate the doping concentration required for the corresponding silicon material according to the electrical performance requirements of the silicon wafer, and prepare the dopant.
[0040] 2) The crucible 1 made of high-purity graphite is used as the cathode, and is connected to the negative electrode of the power supply 11 with a wire 12; the silicon material and the dopant are put into the crucible 1 according to a certain ratio, heated to melt the silicon material, and the temperature control system is adjusted Pulling is started, and after the necking and shouldering growth is completed and the equal-diameter growth stage is entered, the growing crystal 3 is used as the anode and connected to the positive electrode of the power supply 11 .
[0041] 3) Start to apply a DC electric field to t...
Embodiment 3
[0046] Under the action of a DC electric field, the n-type single crystal silicon rod is manufactured by the FZ method, see Figure 5, and the following steps are used to realize:
[0047] 1) Calculate the doping concentration required for the corresponding silicon material according to the electrical performance requirements of the silicon wafer. The dopant can be pre-added in the silicon rod 5 to be melted or added during the zone melting process.
[0048] 2) Assuming that the induction coil 20 moves from bottom to top, with the growing crystal 3 as the anode and the crystal to be melted 5 as the cathode, connect them to the positive pole and the negative pole of the power supply 11 with wires 12 respectively.
[0049] 3) Increase the power of the induction coil 20 to heat and melt the part of the silicon rod 5 to be melted, and then start to apply a DC electric field to the silicon liquid 2. The voltage between the electrodes is 0.1-10V or the current density is 0.1-10A / cm 2...
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