Preparation method of crystal silicon photovoltaic cell with deep energy level impurities
A photovoltaic cell and deep energy level technology, applied in circuits, electrical components, semiconductor devices, etc., can solve problems such as low photoelectric conversion efficiency, achieve the effect of enhancing absorption and improving photovoltaic efficiency
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[0048] Based on the above realization principles, the present invention provides a method for preparing a crystalline silicon photovoltaic cell with a deep energy level of impurities, such as figure 1 As shown, the method includes:
[0049] Step 1: In weak n-type (n - ) The surface of the Si substrate is textured to form a textured surface;
[0050] Step 2: preparing an n-type Si layer with deep energy levels of impurities on the textured surface;
[0051] Step 3: Cover the p-type semiconductor film on the n-type Si layer with impurity deep energy level, and form a pn junction with the n-type Si layer;
[0052] Step 4: Perform high-temperature annealing treatment on the doped Si sheet forming the pn junction to activate the impurities;
[0053] Step 5: Prepare a p-electrode on the p-type semiconductor film, prepare an n-electrode on the n-type Si layer, and prepare an n-electrode on the lower surface of the weak n-type Si substrate.
[0054] Wherein, the step 1 includes: u...
Embodiment
[0062] with NaOH and C 2 h 5 OH mixed alkaline solvent corrodes the Si surface, because it has different corrosion rates for each (hkl) crystal plane of Si, so it can form a textured surface with a pyramidal surface structure; or use a pulse width less than 100 picoseconds, a frequency less than 5kHz, and an energy density About 4kJ / m 2 The ultrafast laser scans the Si surface in the atmosphere of sulfur (S), selenium (Se) and tellurium (Te) elements, so that it forms a textured surface of micron-sized crystal cones;
[0063] Ion implantation is adopted, that is, the ionized elements are separated by a mass spectrometer, and a single element of sulfur (S), selenium (Se), and tellurium (Te) is uniformly implanted into the Si surface layer after vertical high-voltage acceleration and lateral bias scanning. ; or adopt thermal diffusion, that is, uniformly dope the above single element into the Si surface layer through a uniform high-temperature furnace body and a continuously i...
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