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Novel foam structural adhesive and preparation method thereof

A structural adhesive, a new type of technology, applied in the direction of adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of poor heat resistance, mechanical properties, impact resistance and dielectric properties of foamed structural adhesives

Inactive Publication Date: 2011-01-05
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the poor heat resistance, mechanical properties, impact resistance and dielectric properties of the foamed structural adhesives prepared in the prior art, which cannot meet the technical requirements for foaming adhesives in the current military and electrical equipment manufacturing fields. And provide a kind of novel foaming structural glue and preparation method thereof

Method used

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specific Embodiment approach 1

[0010] Embodiment 1: A new type of foamed structural adhesive in this embodiment is composed of 100 parts by weight of cyanate ester prepolymer, 3 to 8 parts of catalyst, 0.5 to 4 parts of foaming agent, and 2 to 8 parts of catalyst. Modifier, 3-10 parts of toughening agent and 5-30 parts of filler.

specific Embodiment approach 2

[0011] Specific embodiment two: the difference between this embodiment and specific embodiment one is that the cyanate ester prepolymer is a bisphenol A cyanate resin; or a mixture of bisphenol A cyanate resin and polysulfone resin, the bisphenol A The mass fraction ratio of bisphenol A type cyanate resin and polysulfone resin in the mixture of phenol A type cyanate resin and polysulfone resin is 100:0.01-35.

[0012] In this embodiment, the bisphenol A cyanate resin is a white crystalline powder with a molecular weight of 278.31, a melting point Tm=80-82°C, a dielectric constant ε≤3, a dielectric loss tangent tgδ≤0.005, and a glass transition temperature Tg ≥260°C, thermal decomposition temperature Td≥450°C, purity ≥99%; polysulfone resin is a white plastic particle with a relative density of 1.24g / cm 3 , the reduced viscosity η is 0.45-0.80, the heat distortion temperature HDT≥172°C, the dielectric constant ε is 3.0, the dielectric loss tangent tgδ≤0.005, the tensile strengt...

specific Embodiment approach 3

[0014] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that the catalyst is a mixture of nonylphenol and copper acetylacetonate, and the weight ratio of nonylphenol and copper acetylacetonate is 80:2-3. Others are the same as those in Embodiment 1 or 2.

[0015] The nonylphenol used in this embodiment is produced by Nanjing Houwang Chemical Co., Ltd., an industrial product; the copper acetylacetonate is produced by Yangzhou Xingye Auxiliary Co., Ltd., a first-class chemical reagent.

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Abstract

The invention discloses a foam structural adhesive and a preparation method thereof and relates to a foam adhesive and a preparation method thereof, which solves the problems that the foam adhesive prepared by the prior art has low heat resistance, mechanical property, impact insistence and dielectrical property and the like. The high-property structural adhesive is prepared from a cyanate prepolymer, a catalyst, a foaming agent, a thixotropic agent, a toughening agent and a filler. The preparation method of the novel foam structural adhesive comprises the following steps of: 1, preparing the cyanate prepolymer; 2, preparing the catalyst; 3, mixing the cyanate prepolymer, the catalyst, the foaming agent, the thixotropic agent, the toughening agent and the filler to prepare an adhesive block and then press the adhesive block to be an adhesive film to obtain the foam structural adhesive. The novel foam structural adhesive can be applied in the fields of military and civil machines and electric manufacturing.

Description

technical field [0001] The invention relates to a styrofoam and a preparation method thereof. Background technique [0002] In recent years, in the fields of military and civil machinery and electrical manufacturing, the application of foamed structural adhesives for the bonding and filling of metal and non-metal lightweight sandwich structures has become increasingly widespread. The types of resin matrix used in the manufacture of this type of adhesive mainly include rigid polyurethane, thermosetting phenolic resin, epoxy resin containing amine latent curing agent, and epoxy-phenolic resin. The formula system composed of the above-mentioned various materials, the comprehensive performance of the foamed structural adhesive formed after heating and pressurizing to meet the requirements of the corresponding foam material specification BMS 5-90 of the Boeing Aircraft Manufacturing Company of the United States is the best. Basic technical requirements. Various types of styrofo...

Claims

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Application Information

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IPC IPC(8): C09J179/04C09J181/06C09J11/04C09J11/08
Inventor 张恩天魏运召陈维君崔宝军李刚宋军军
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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