Low-viscosity dimer acid type polyamine hot melt adhesive and preparation method thereof

A technology of polyamide hot melt adhesive and dimer acid type, which is applied in adhesives, non-polymer adhesive additives, adhesive additives, etc. It can solve the problems of high temperature viscosity, unfavorable molding, volatile diamine, and low temperature resistance. Poor and other problems, to achieve good high and low temperature resistance and mechanical properties, low amine volatilization, low water absorption effect

Inactive Publication Date: 2011-02-02
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, ordinary polyamide hot melt adhesives have poor low temperature resistance, low softening point, high temperature viscosity is not conducive to molding, and cannot meet the special requirements of electronics, automobiles and other industries.
[0003] The patent with publication number CN109887 provides a kind of synthesis method of dimer acid type polyamide resin, through the initial stage of the reaction, the method of adding an appropriate amount of organic inert solvent to the reaction system solves the sho

Method used

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  • Low-viscosity dimer acid type polyamine hot melt adhesive and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Add 150.00g of hydrogenated dimer acid, 25.50g of sebacic acid, 18.12g of polyetheramine D-230, 39.40g of polyetheramine D-2000 into a 500mL four-necked flask equipped with a thermometer, stirrer, condensing reflux and nitrogen tube , 15.00g of water, 1.8g of tetrakis [β-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate] pentaerythritol ester, 1.20g of propionic acid, and 17.70g of ethylenediamine into the constant pressure In the dropping funnel, put in nitrogen gas and stir to start heating, raise the temperature to 120°C within 30 minutes, and slowly add ethylenediamine dropwise at this temperature, complete the dropwise addition within 40 minutes, then the temperature rises to 130°C, Form salt at this temperature for 2 hours, then slowly increase the temperature, during which water will evaporate, and the temperature will rise to 240°C within 3 hours, keep at this temperature for 2 hours, and then use a vacuum pump to evacuate for 2 hours to a pressure of 100 Pa, and f...

Embodiment 2

[0033] Add 161.10g of dimer acid, 25.40g of adipic acid, 17.20g of polyetheramine D-230, and 28.00g of polyetheramine D-2000 into a 500mL four-necked flask with a thermometer, stirrer, condenser and nitrogen tube , 12.00g water, 1.0g tetrakis[β-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate] pentaerythritol ester, 0.6g tris(2,4-di-tert-butylphenyl) phosphite Esters, 2.20g of n-hexanoic acid, and 22.70g of ethylenediamine were put into a constant pressure dropping funnel, and nitrogen gas was introduced to stir and start heating, and the temperature was raised to 120°C within 60 minutes, and slowly added dropwise at this temperature Ethylenediamine, the dropwise addition is completed within 60 minutes. At this time, the temperature rises to 130°C and forms a salt at this temperature for 2 hours, and then slowly raises the temperature. During this process, water will evaporate, and the temperature rises to within 3 hours. 280°C, kept at this temperature for 5 hours, then evacuat...

Embodiment 3

[0035] Add 148.60g of dimer acid, 12.00g of sebacic acid, 11.30g of polyetheramine D-230, 65.63g of polyetheramine D-2000 into a 500mL four-neck flask equipped with a thermometer, stirrer, condenser and nitrogen tube , 12.00g water, 1.2g tetrakis[β-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate] pentaerythritol ester, 0.3g hypophosphorous acid, 4.2g stearic acid, and 18.24g propylene glycol Put the amine into the constant pressure dropping funnel, feed in nitrogen gas and stir to start heating, raise the temperature to 110°C within 50 minutes, and slowly add propylenediamine dropwise at this temperature, and complete the dropwise addition within 70 minutes, at this time Raise the temperature to 130°C, and form salt at this temperature for 2 hours, and then slowly raise the temperature, during which water will evaporate, and the temperature will rise to 220°C within 2 hours, keep at this temperature for 1 hour, and then use The vacuum pump was evacuated for 3 hours to a pressur...

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Abstract

The invention relates to a low-viscosity dimer acid type polyamine hot melt adhesive and a preparation method thereof. The hot melt adhesive consists of the following raw materials in percentage by mole: 55 to 95 percent of dimer acid, 5 to 45 percent of aliphatic dibasic acid, 60 to 95 percent of aliphatic diamine, 5 to 40 percent of polyoxypropylene polyamine, 0.1 to 5 percent of molecular weight regulator, and the balance of water and antioxidant, wherein the dosage of the water accounts for 1 to 30 percent of the total mass of the acide and the amine; and the dosage of the antioxidant accounts for 0.1 to 2 percent of total mass of the acid and the amine. The preparation method comprises the following steps: salifying in the protection of nitrogen by using the dimer acid, the aliphatic dibasic acid and the diamine, the antioxidant and the molecular weight regulator as raw materials and introducing proper water at early stage; and heating and polycondensating. The polyamine hot melt adhesive has high and low temperature resistance, low high-temperature viscosity and simple molding process, and is mainly applied in automobile and electronic industries.

Description

technical field [0001] The invention relates to a low-viscosity dimer acid type polyamide hot-melt adhesive and a preparation method thereof, belonging to the field of hot-melt adhesives. Background technique [0002] Dimer acid type polyamide hot melt adhesive is formed by condensation of dimer acid and diamine or polyamine. It has good bonding performance to various polar substrates, has good flexibility, and has a wide range of applications. , environmental protection and solvent-free, good chemical resistance and excellent molding properties, etc., can be widely used in electronic appliances, automobiles, packaging, machinery and other industries. However, ordinary polyamide hot-melt adhesives have poor low-temperature resistance, low softening point, high-temperature viscosity is not conducive to molding, and cannot meet the special requirements of electronics, automobiles and other industries. [0003] The patent with publication number CN109887 provides a kind of syn...

Claims

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Application Information

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IPC IPC(8): C09J177/06C09J11/06C09J177/08C08G69/26C08G69/34
Inventor 白战争王建斌陈田安
Owner YANTAI DARBOND TECH
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