Method for preparing metal mask resistant to corrosion of hydrofluoric acid corrosive liquid
A metal mask and corrosion solution technology, which is applied in the field of anti-corrosion metal mask preparation, can solve the problems of local warping, mask corrosion drilling holes, peeling, etc., to improve adhesion, reduce pinhole drilling, Enhance the effect of mechanical locking
Image
Examples
Embodiment 1
[0035] Processing flow such as figure 1 Shown:
[0036] a. Cleaning: Use hydrofluoric acid hydrogen peroxide mixed solution to corrode and soak the quartz crystal at 60-120°C for 5-10 minutes, then use megasonic cleaning for 5-15 minutes.
[0037] b. Coating: (1) Place the cleaned quartz substrate in a magnetron coating machine, firstly bombard the surface of the substrate with Ar ions for 5-10 minutes, and the ion bombardment power is 70-90w; (2) at a temperature of 100- Under the conditions of 220°C, sputtering pressure of 0.3-0.8Pa, and sputtering power of 1.9-2.5Kw, the surface of the substrate is sequentially plated with a Cr film with a thickness of 30nm and a Cu film with a thickness of 300nm; (3) Repeat step (2) again on the substrate The surface is plated with a Cr film with a thickness of 30nm and a Cu film with a thickness of 300nm to form a double-layer Cr / Cu metal mask. It can also be repeated for more layers of metal masking as needed. The thickness of the fil...
Embodiment 2
[0040] a. Cleaning: put sulfuric acid into the hydrogen peroxide mixture, soak and corrode the 7740 glass substrate at 80-120°C for about 8-10 minutes, then use megasonic cleaning for 5-10 minutes.
[0041] b. Coating: (1) Place the cleaned glass substrate in a magnetron coating machine, and first bombard the surface of the glass substrate with Ar ions for 5-7 minutes, with ion bombardment power of 70-80w; (2) at 100- Under the conditions of 150°C, 0.4-0.8Pa, and 1.9-2.3Kw power conditions, the surface of the substrate is sequentially plated with a Cr film with a thickness of 30nm and a Pt film with a thickness of 300nm; A Cr film and a 300nm Pt film form a double-layer Cr / Pt metal mask.
[0042] c. After naturally cooling to room temperature, take out the substrate and place it in a vacuum annealing furnace for annealing.
Embodiment 3
[0044] a. Cleaning: use sulfuric acid and hydrogen peroxide mixture to soak and corrode the 7740 glass substrate at 100-120°C for 5-7 minutes, then use megasonic cleaning for 5-8 minutes.
[0045]b. Coating: (1) Place the cleaned glass substrate in a magnetron coating machine, and first bombard the surface of the substrate with Ar ions for 5-6 minutes, with ion bombardment power of 70-80w; (2) at 120-150 Under the conditions of ℃, 0.6~0.8Pa, 1.9~2.2Kw power conditions, the surface of the substrate is successively plated with a Cr film with a thickness of 30nm and an Au film with a thickness of 300nm; (3) Repeat step (2) to plate a Cr film with a thickness of 30nm on the substrate surface film and a 300nm Au film to form a double-layer Cr / Au metal mask.
[0046] c. After naturally cooling to room temperature, take out the substrate and place it in a vacuum annealing furnace for annealing.
[0047] The method adopts cleaning measures to remove the surface processing metamorphic...
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- IPC
- C03C15/00
- Inventors
- 唐琼; 杨军