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Ultraviolet curing adhesive

A technology of ultraviolet light and adhesives, applied in the direction of adhesives, adhesive types, polyurea/polyurethane adhesives, etc., can solve the problems of industrial implementation difficulties, decreased adhesion, complicated operation, etc., and achieve good UV resistance Destructive ability, reduction of internal stress damage, good film flexibility

Active Publication Date: 2011-06-01
LUCKY HUAGUANG GRAPHICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] 3. The problem of initial adhesion: during the production of flexographic plates, there must be a certain initial adhesion between the unexposed plate, the elastomer and the substrate, so as to ensure that the plate is in the process of cutting, plate inspection, packaging, transportation, etc. Deformation, falling off and other problems occur
[0010] 6. The problem of high temperature resistance of the adhesive: when the flexographic plate is produced, the elastomer mixing temperature is 100-130 degrees, and the adhesive should solve the problem of high temperature resistance
[0011] 7. Coating process issues: In order to reduce the variable factors of flexographic plate production, the adhesive should be pre-coated on the substrate for later use. The softening point of the adhesive should be much higher than room temperature, and it will not stick to hands after drying. Roll storage, with pressure resistance and non-adhesion ability
[0012] 8. Stability issues: substrate pre-coating and production plates should have 18-month quality stability
[0013] In order to solve this problem, Mitsui Chemicals JP01115 / 2000 introduced a kind of thermosetting polyurethane resin, but the flexibility is too poor, and it is easy to crack and cause the elastomer and the base material to fall off; Adhesive bonding, complex operation; U.S. Patent US4917990 discloses coating an adhesive layer containing chlorosulfonated polyethylene, but the adhesive force will decrease with the increase of exposure
A moisture-curing layer is introduced in JP-A-2000-155410, which is difficult to industrialize; European Patent EP1209524A1 discloses that a solution containing polyol and diisocyanate is coated on a substrate, but the curing time is long and industrial implementation is difficult; WO2004 / 092841 discloses a direct The method of using double-sided adhesive bonding, but the error is large and the operation is difficult

Method used

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  • Ultraviolet curing adhesive

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0093] Synthesis example 1 (synthesis of R resin: R-1﹟)

[0094] Add 90 ml of DMF (N,N-dimethylformamide) and 70.83 g (0.27 mol) of HMDI (dicyclohexylmethane) to a 500 ml four-necked flask with a reflux device and a drying tube. Diisocyanate), 11.77g (0.07mol) HDI (hexamethylene diisocyanate), stir well and add TEG (triethylene glycol) 12.01g (0.08mol), DMPA (2,2-bismethylol propionic acid) 34.87g (0.26mol), after the dissolution is complete, add 0.5g of dibutyltin dilaurate, raise the temperature to 60°C, keep warm for 2 hours, add DMF110ml, continue the reaction, add dibutyltin dilaurate after 5.5 hours 0.1 g, and 3.20 g (0.10 mol) of methanol as an end-blocking agent. Half an hour later, the reaction of the synthetic matrix resin RM was completed.

[0095] Add 160 ml of DMF, 5.60 g of BTMA (benzyltrimethylammonium chloride), 2.1 g of TPP (triphenylphosphine), and 1.4 g of ZJ-701 (nitroxyl piperidinol) to the above-mentioned matrix resin RM reaction solution. g, CMA (3,4-e...

Synthetic example 2

[0097] Synthesis example 2 (synthesis of R resin: R-2﹟)

[0098] Add 90 ml of DMF (N,N-dimethylformamide) and 70.83 g (0.27 mol) of HMDI (dicyclohexylmethane) to a 500 ml four-necked flask with a reflux device and a drying tube. Diisocyanate), 11.77g (0.07mol) HDI (hexamethylene diisocyanate), stir well and add TEG (triethylene glycol) 12.01g (0.08mol), DMPA (2,2-bismethylol propionic acid) 34.87g (0.26mol), after the dissolution is complete, add 0.5g of dibutyltin dilaurate, raise the temperature to 60°C, keep warm for 2 hours, add DMF110ml, continue the reaction, add dibutyltin dilaurate after 5.5 hours 0.1 g, and 3.20 g (0.10 mol) of methanol as an end-blocking agent. Half an hour later, the reaction of the synthetic matrix resin RM was completed.

[0099] Add 160 ml of DMF, 5.60 g of BTMA (benzyltrimethylammonium chloride), 2.1 g of TPP (triphenylphosphine), and 1.4 g of ZJ-701 (nitroxyl piperidinol) to the above-mentioned matrix resin RM reaction solution. g. GMA (glyci...

Synthetic example 3

[0101] Synthesis example 3 (synthesis of R resin: R-3﹟)

[0102] Add 81.33g (0.31mol) of HMDI (dicyclohexylmethane diisocyanate) and 6.73g (0.04mol) of HDI (hexamethylene diisocyanate) to a 500 ml four-necked flask with a reflux device and a drying tube. Add 10g (0.01mol) of PPG-1000 (polyoxypropylene glycol, molecular weight 1000±70, hydroxyl value 105-117)) which has been removed under reduced pressure and stir evenly, then add 0.5g of dibutyltin dilaurate and heat up to After 1.5 hours of bulk reaction at 80°C, cool down to 60°C, add 90 ml of DMF (N,N-dimethylformamide), DMPA (2,2-bismethylolpropane) dried over anhydrous sodium sulfate Acid) 45.60g (0.34mol), add DMF110ml after reaction for one hour, add 0.1g of dibutyltin dilaurate and end-blocker methanol 3.20g (0.10mol) after continuing reaction for 4 hours, synthesize matrix resin after half an hour The RM reaction is complete.

[0103] Add DMF160 ml, BTMA (benzyltrimethylammonium chloride) 7.11g, TPP (triphenylphosph...

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Abstract

The invention discloses an ultraviolet curing adhesive comprising a resin main body, a dissolvent, an ultraviolet light initiator and an addition agent, wherein the resin main body is composed of a resin R and a resin H; the R resin is an active polyurethane acrylic resin with a main chain containing a polyether structure and a branch chain containing a vinyl optical active group as well as with a lower molecular weight; and the H resin is an inert polyurethane acrylic resin with a main chain containing a polydiene and aryloxide structure and with a relatively higher molecular weight. The adhesive contains no monomer or prepolymer, has high softening point, can be precoated on a base material, has super strong cohesive force on a high-oilness contact surface and has characteristics of high-temperature resistance, small internal stress and good flexibility.

Description

technical field [0001] The invention belongs to the technical field of flexible resin plates, and in particular relates to an ultraviolet light curing adhesive. Background technique [0002] In recent years, flexible photosensitive resin plates have been widely used in the printing of cartons, flexible packaging, labels and other deformable or soft substrates due to the advantages of water-based inks, environmental protection, wide range of printing materials, high printing durability, and simple and easy combination of printing machines. At present, foreign flexible photosensitive resin plate technology has matured, and many large foreign companies such as DuPont, Asahi Kasei, Medellin, Flint, etc. have launched products. In China, only Lucky Erjiao has launched products and has mass-produced them. The development of flexible photosensitive resin plates has always been a hot spot in the development of printing plates in the world. [0003] Usually, the structure of the fle...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/14C08G18/67G03F7/11
Inventor 宋小伟高英新王国才张萌李志勇
Owner LUCKY HUAGUANG GRAPHICS
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