Low warpage liquid crystal polymer composition and preparation method thereof

Abstract

The invention relates to a low warpage liquid crystal polymer composition and a preparation method thereof; the composition comprises the following components by weight percentage: 20wt% to 80wt% of thermotropic liquid crystalline polymer with a melting point of at least 290 DEG C, 5wt% to 20 wt% of thermoplastic polyphenylene sulfide with a melting temperature of from 280 DEG C to 290 DEG C, 10 wt% to 70 wt% of reinforcing material and 0 wt% to 10 wt% of other additives. The preparation method comprises the steps: LCP and PPS resin are respectively dried at the temperature of 160 DEG C and 140 DEG C for 4-6 hours; a lubricating agent and a compatilizer to be added are uniformly mixed in a high speed blender and then are dried at the temperature of 80 DEG C for 4 to 6 hours; polyester resin to be added is dried for 4 to 6 hours at the temperature of 120 DEG C; the dried materials are uniformly mixed in the high speed blender and put into a main feeding hopper of a double-screw extruder; the reinforcing material is added from a side feeding opening of the double-screw extruder; and the materials are melted, squeezed out and pelleted. The preparation method has the advantages that the addition of polyphenylene sulfide can obviously reduce the warping degree; the fiber reinforcing material and lubricating material can be matched with polyphenylene sulfide so as to lead the mechanical property of the polyphenylene sulfide in the components to be reinforced.

Description

technical field

[0001] The present invention relates to a liquid crystal polymer, in particular a liquid crystal polymer composition having improved warpage. The invention also relates to a preparation method of liquid crystal polymer. Background technique

[0002] Liquid crystal polymer (LCP) is a polymer substance composed of rigid molecular chains, which can appear in a state of anisotropic physical properties such as liquid fluidity and crystal under certain physical conditions. LCP is widely used in electrical and electronic components such as printed circuit boards, semiconductors, connectors, relays, and switches because of its good heat resistance, mechanical properties, chemical resistance, and dimensional stability.

[0003] With the development of information technology, the integration of electronic components is getting higher and higher, which requires the use of smaller, thinner and smaller parts. The problem brought about by the thinning of electronic compo...