Method for manufacturing electrode for solar cell, substrate for solar cell manufactured by the same, and solar cell manufactured by the same
A technology of solar cells and manufacturing methods, applied in circuits, electrical components, photovoltaic power generation, etc., can solve the problems of low crystal defect density, low price, high price, etc., and achieve high productivity, improve efficiency, and reduce surface resistance.
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Embodiment 1
[0060]First, gravure offset printing was performed using a paste composition for offset printing (silver powder 68%, glass frit 17%, binder 10%, dilution solvent 3%, dispersant and others 2%). Use the scraper pressure and angle of the initial gravure roll to check the doctoring status, and adjust the off pressure and set by adjusting the off nip and set nip of the Blanket Roll. ) to adjust the pressure to the best state. After filling 20g of paste between the gravure roller and the doctor blade, doctoring is performed at a rotation speed of about 7 rpm. After scraping more than 3 times, let the paste off on the rubber of the guide roller at a speed of 7rpm, and then drive the guide roller to rotate one circle. During the rotation of the guide drum, the paste fully absorbed by the rubber is set at a speed of 7rpm. Conductive paste was printed once on a 5" wafer vacuum-fixed on a printing board as described above. After drying the printed substrate, it was fired in an infrared...
Embodiment 2
[0063] Except that the electrolytic copper plating and electroless silver plating are performed in the wet metal gold plating process of the embodiment 1, other steps are the same as the embodiment 1. At this time, the electrolytic copper plating is immersed in an electrolytic copper plating bath composed of 220g / l copper sulfate and 60ml / l sulfuric acid in terms of metal salts. A copper plate is used for the anode. / dm2, gold plating time of 10 minutes under the conditions of electrolytic copper plating film forming operation. Then, it was immersed in the silver plating bath used in the above-mentioned Example 1, and the principle of displacement gold plating method was carried out by the difference in the metal ionization tendency of the copper gold plating layer and the silver plating bath under the situation of no current flow for 5 minutes, and finally completed. The film-forming operation of the electroless silver gold-plated layer.
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