Microwave solidification type bonding agent and microwave solidification method thereof

A microwave curing and adhesive technology, applied in chemical instruments and methods, surface pretreatment bonding methods, adhesives, etc., can solve the problems of shortening curing reaction time, uneven curing, large temperature gradient of the adhesive layer, etc., to achieve Save curing time, simple operation and easy implementation, and reduce the effect of the temperature gradient of the adhesive layer

Inactive Publication Date: 2012-02-15
BEIHANG UNIV
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  • Application Information

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Problems solved by technology

[0005] In order to shorten the curing reaction time and solve the problem of large temperature gradient and uneven curing of the adhesive layer in thermal curing, the present invention introduces microwave radiation into the curing reaction process, and provides a microwave curing adhesive and a microwave curing method

Method used

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  • Microwave solidification type bonding agent and microwave solidification method thereof
  • Microwave solidification type bonding agent and microwave solidification method thereof
  • Microwave solidification type bonding agent and microwave solidification method thereof

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Embodiment Construction

[0016] The present invention will be further described below in conjunction with the embodiments and the accompanying drawings.

[0017] A microwave-curable adhesive of the present invention is prepared by adding 5-20 g of curing agent and 60-120 g of alumina powder into 100 ml of aluminum dihydrogen phosphate solution, and mixing them uniformly at a temperature of 15-40°C .

[0018] In the present invention, the aluminum dihydrogen phosphate solution that uses adopts following preparation method as: (A) add the phosphoric acid solution of 85wt% (mass percentage concentration) and add appropriate amount of deionized water to adjust the phosphoric acid that obtains 60wt% (mass percentage concentration) Solution; (B) heating the phosphoric acid solution of 60wt% (mass percentage concentration) to 110-120°C, and adding aluminum hydroxide powder (the particle size of the aluminum hydroxide powder is less than 50nm) during the heating process, cooling to 15-40°C , to obtain a tran...

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Abstract

The invention discloses a microwave solidification type bonding agent and a microwave solidification method thereof. The bonding agent is prepared by adopting aluminum dihydrogen phosphate solution and phenolic resin as base materials, adopting compounds of two kinds of materials or several kinds of materials from magnesium oxide, zinc oxide, ferric oxide and zirconium oxide as solidification agents, adopting aluminum oxide as fillings and adopting boron carbide micro particles and ultra-fine silicon dioxide powder as modified fillings. All ingredients are mixed according to a certain proportion and are stirred at a high speed for obtaining the bonding agents. After the bonding agent is adopted for bonding devices, the convenient and fast solidification can be carried out under the microwave radiation effect. The bonding agent has excellent heat resistance performance, can be used for bonding ceramics, graphite, plastics, glass, epoxy resin, carbon/carbon composite materials and the like and has the characteristics that the temperature gradient of a solidified glue layer is small, the solidification is uniform, and the solidification time is short.

Description

technical field [0001] The present invention relates to an adhesive, more particularly to a microwave curing adhesive capable of bonding materials in a microwave environment and a microwave curing method thereof. Background technique [0002] Phosphate adhesives have attracted much attention due to their excellent dielectric constant, high temperature resistance, low expansion coefficient, convenient processing, and medium and low temperature curing and high temperature use. They are widely used in the repair of metal, glass, ceramics, epoxy resin and other materials. , production and bonding, high temperature resistant composite materials, coatings and preparation of refractory materials and many other aspects play a very important role. [0003] Phenolic resin is widely used in the field of adhesives due to its good solvent resistance, creep resistance and high bonding strength. However, as an organic polymer material, it is inevitable to pyrolyze at high temperature, and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J1/00C09J161/06C09J11/04C09J5/02C01B25/36
Inventor 杨青林孙颖陈怡炽郭林江雷
Owner BEIHANG UNIV
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