Low-content modified rosin halogen-free soldering flux for lead-free solder wires

A lead-free soldering technology with low content, applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., to achieve good air tightness, improve solderability, and overcome adverse phenomena

Inactive Publication Date: 2012-02-22
苏州之侨新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problems of residual halogen ions need to be cleaned after welding and too much residue after welding due to excessive rosin content, and provide a kind of soldering agent with strong wettability, large spreading area, good solderability, bright and full solder joints, and solderable solder joints. Less residue after soldering, no corrosion on the copper mirror after soldering, low-content modified rosin halogen-free flux for lead-free solder wire that does not require post-soldering cleaning

Method used

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  • Low-content modified rosin halogen-free soldering flux for lead-free solder wires

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] The low-content modified rosin-type halogen-free flux for lead-free solder wire of the present embodiment has components and weight percentages as follows:

[0031] DL malic acid 2.25%

[0032] Succinic Acid 4.5%

[0033] Glutaric acid 2.25%

[0034] Tween 20 2%

[0035] Span 60 3%

[0036] Benzotriazole 0.01%

[0037] Hydroquinone 0.1%

[0038] Ethylene bis stearamide 4%

[0039] Water white rosin 3%

[0040] Polymerized Rosin 2%

[0041] Absolute Ethanol 12.8%

[0042] Nitroethane 25.6%

[0043] Tetrahydrofurfuryl alcohol 25.67%

[0044] Diethylene glycol monoethyl ether 12.82%

[0045] Specific preparation method:

[0046] Weigh each component by weight percentage, put the organic solvent in a reaction kettle with a stirrer at room temperature, heat it slowly to 30°C, add modified rosin while stirring until it is completely dissolved, then add activator, surface Active agent, corrosion inhibitor, antioxidant and film-forming agent are continuously stirre...

Embodiment 2

[0049] The low-content modified rosin-type halogen-free flux for lead-free solder wire of the present embodiment has components and weight percentages as follows:

[0050] DL malic acid 2%

[0051] Succinic acid 2%

[0052] Adipic acid 8%

[0053] Tween 60 1%

[0054] Span 60 3%

[0055] Benzotriazole 0.01%

[0056] Triethylamine 0.02%

[0057] tert-butylhydroquinone 0.25%

[0058] Ethylene bis stearic acid amide 1%

[0059] Polyacrylamide 3000000 1%

[0060] Water white rosin 3%

[0061] Lead-free Rosin 3%

[0062] Absolute Ethanol 12.61%

[0063] Tetrahydrofurfuryl alcohol 37.87%

[0064] Diethylene glycol monoethyl ether 25.24%

[0065] Specific preparation method:

[0066]Weigh each component by weight percentage, first place the organic solvent in a reaction kettle with a stirrer at normal temperature, and slowly heat to 35° C., and the rest are the same as in Example 1.

[0067] The test results of various performance parameters are shown in Example 2 in...

Embodiment 3

[0069] The low-content modified rosin-type halogen-free flux for lead-free solder wire of the present embodiment has components and weight percentages as follows:

[0070] DL malic acid 4.5%

[0071] Succinic Acid 4.5%

[0072] Adipic acid 9%

[0073] Span 20 2%

[0074] Span 60 1%

[0075] Benzotriazole 0.1%

[0076] Triethylamine 0.1%

[0077] 2,5-tert-Butylhydroquinone 0.15%

[0078] Polyethylene glycol 2000 2%

[0079] Polymerized Rosin 4%

[0080] Disproportionated Rosin 4%

[0081] Absolute Ethanol 17%

[0082] Nitroethane 34.43%

[0083] Tetrahydrofurfuryl alcohol 17.22%

[0084] Specific preparation method:

[0085] Weigh each component by weight percentage, first place the organic solvent in a reaction kettle with a stirrer at normal temperature, and slowly heat to 40° C., and the rest are the same as in Example 1.

[0086] The test results of various performance parameters are shown in Example 3 in Table 1.

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Abstract

The invention discloses a low-content modified rosin halogen-free soldering flux for lead-free solder wires. The low-content modified rosin halogen-free soldering flux comprises the following components in percentage by weight: 9-27% of an organic acid activator, 1-5% of a surfactant, 0.01-1% of a corrosion inhibitor, 0.1-1% of an antioxidant, 2-4% of a film-forming agent, 1-8% of modified rosin and the balance of an organic solvent. The soldering flux for the lead-free solder wires has the advantages of no halogen, good solderability, bright and full welding spots, high spreading rate, a small amount of the modified rosin, fewer post-welding residues and being free from a cleaning procedure, and the surface insulation resistance of a welded substrate is more than 1*10+8 ohms, which meets the requirements of the electronical industry standard; and meanwhile mixed alcohols with different boiling points are used as the organic solvent, which can lower the content of the VOC (volatile organic compound) so as to prevent photochemical smog and air pollutions.

Description

technical field [0001] The invention relates to a flux for lead-free solder wire, especially suitable for tin-silver-copper (SnAgCu) series and tin-copper (SnCu) series lead-free solder wire with low content modified rosin-type halogen-free flux, mainly used in electronics, Soldering and assembly of electronic components such as electricians, printed circuit boards, household appliances, etc. Background technique [0002] With the rapid development of the modern information electronics industry, the market competition for flux products for lead-free solder is becoming increasingly fierce. However, lead-free solders of tin-silver-copper series and tin-copper series have the characteristics of high melting point and easy oxidation compared with traditional tin-lead solders. Most of the improved ones contain halogen and too high rosin content. Although this type of flux has good solderability, it has a large amount of halogen ion residues after soldering and is highly corrosi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/362
Inventor 黄德欢杨欢肖文君赵晓青曹敬煜
Owner 苏州之侨新材料科技有限公司
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