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Polyamide hot melt adhesive for adhering nonpolar materials and preparation method thereof

A polyamide hot-melt adhesive and non-polar material technology, applied in the direction of adhesives, etc., can solve the problems of poor low temperature resistance, low elongation, high water absorption, etc., and achieve high bonding reliability, low high temperature melt viscosity, Excellent effect of low temperature resistance

Inactive Publication Date: 2012-03-21
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the disadvantages of existing polyamide hot melt adhesives, such as low softening point, poor low temperature resistance, low elongation and high water absorption, the present invention provides a polyamide hot melt adhesive for bonding non-polar materials and The preparation method, the prepared polyamide hot-melt adhesive contains ester-amide groups, has a high softening point, excellent low temperature resistance, and significantly improved elongation, and can be used for bonding non-polar polymer materials. Low-pressure injection molding process meets the high-end market demand for polyamide hot-melt adhesives

Method used

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  • Polyamide hot melt adhesive for adhering nonpolar materials and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Add C to a 1000ml reaction flask equipped with a thermometer, mechanical stirrer, condenser and nitrogen 18Dimerized linoleic acid 227.2g, sebacic acid 121.7g, polyether glycol PEG-400 and PEG-2000 total 180g, ethylene glycol 12.4g, piperazine 17.2g, stearic acid 6.0g, hypophosphorous acid 0.5g 12.1g of ethylenediamine was put into a 100ml constant pressure dropping tube, nitrogen gas was introduced to prevent oxidation, and the temperature was raised while stirring. When the temperature in the reaction bottle reached 140°C, ethylenediamine was added dropwise, and the temperature was controlled at 140°C. , after the dropwise addition, start to slowly raise the temperature to about 220°C, water will distill out during the heating process, when the reaction temperature reaches 220°C, use a vacuum pump to vacuumize and depressurize, the vacuum degree is <100Pa, keep the stirring rate at a certain value After 3 hours of reaction, the vacuum was released to end the reaction,...

Embodiment 2

[0032] Add C to a 1000ml reaction flask equipped with a thermometer, mechanical stirrer, condenser and nitrogen 18 Dimerized oleic acid 283.9g, suberic acid 87.0g, polyether glycol PEG-400 and PEG-2000 total 200g, ethylene glycol 12.4g, piperazine 8.6g, stearic acid 6.0g, hypophosphorous acid 0.5g, Put 24.2g of ethylenediamine into a 1000ml constant pressure dropping tube, pass nitrogen gas to prevent oxidation, heat up while stirring, when the temperature in the reaction bottle reaches 140°C, start adding ethylenediamine dropwise, and control the temperature at 140°C. After the dropwise addition, start to raise the temperature slowly to about 220°C. During the heating process, water distills out. When the reaction temperature reaches 220°C, use a vacuum pump to vacuumize and reduce pressure. The vacuum degree is <100Pa, and the stirring rate is kept at a certain value. After 3 hours of reaction, the vacuum was released to end the reaction, and the molten polyamide resin was p...

Embodiment 3

[0034] Add C to a 1000ml reaction flask equipped with a thermometer, mechanical stirrer, condenser and nitrogen 18 340.8g of dimerized oleic acid, 69.6g of suberic acid, 168g of polyether glycol PEG-400 and PEG-2000, 6.2g of ethylene glycol, 14.4g of cyclohexyl p-dimethylamine, 6.0g of stearic acid, Phosphoric acid 0.5g, ethylenediamine 36.4g was put into a 1000ml constant-pressure dropper, nitrogen gas was introduced to prevent oxidation, and the temperature was raised while stirring. At 140°C, after the dropwise addition, start to slowly heat up to about 220°C, water distills out during the heating process, when the reaction temperature reaches 220°C, use a vacuum pump to evacuate and depressurize, the vacuum degree is <100Pa, keep the stirring rate at After a certain value, after 3 hours of reaction, the vacuum was released to end the reaction, and the molten polyamide resin was poured on a perchlorethylene plate to obtain a yellow rubber strip, which was dried at 50°C for ...

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Abstract

The invention relates to a polyamide hot melt adhesive for adhering nonpolar materials and a preparation method thereof. The hot melt adhesive is formed by components A and B respectively in a mole ratio of 1:1. The component A comprises, in a mole ratio, 40% to 80% of unsaturated aliphatic dimeric acid and 20% to 60% of aliphatic dicarboxylic acid. The component B comprises, in a mole ratio, 20% to 80% of aliphatic diamine, 0% to 20% of heterocyclic diamine and 20% to 60% of dihydric alcohol. The polyamide hot melt adhesive is high in softening point, good in low temperature resistance, long in sizing opening time, low in high-temperature melting viscosity, high in T- peel strength and shearing strength, suitable for a low pressure injection molding process, high in adhering reliability and particularly suitable for adhesion of nonpolar high polymer materials.

Description

technical field [0001] The invention relates to a hot-melt adhesive and a preparation method thereof, in particular to a polyamide hot-melt adhesive for bonding non-polar materials and a preparation method thereof, belonging to the field of adhesives. Background technique [0002] There are two types of polyamide hot melt adhesives: one is high molecular weight PA hot melt adhesive (commonly known as nylon hot melt adhesive), which is mainly used in clothing, spinning and other industries; the other is low molecular weight PA hot melt adhesive (commonly known as nylon hot melt adhesive). Dimer acid type PA hot melt adhesive), which is formed by polycondensation of dimer acid and diamine or polyamine, has narrow melting point range, high softening point, non-toxic, good oil and chemical resistance, excellent wear resistance, and polar High bonding strength and good low temperature flexibility. Dimer acid type PA hot melt adhesive has high added value. In recent years, the ma...

Claims

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Application Information

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IPC IPC(8): C09J177/12C08G69/44
Inventor 周宏福王建斌陈田安
Owner YANTAI DARBOND TECH
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