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Electrochemical method for preparing super-hydrophobic surface on copper substrate

A superhydrophobic surface, copper matrix technology, applied in the field of electrochemistry, to achieve the effect of simple method, good hydrophobic performance and high efficiency

Inactive Publication Date: 2012-07-04
XIAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, only by changing the surface energy on a smooth surface, the contact angle can usually only be increased to a maximum of 120°, while the contact angle on a surface with a finely rough structure can exceed 150°

Method used

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  • Electrochemical method for preparing super-hydrophobic surface on copper substrate
  • Electrochemical method for preparing super-hydrophobic surface on copper substrate
  • Electrochemical method for preparing super-hydrophobic surface on copper substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Step 1. Grind two pieces of copper substrates with a size of 50mm×25mm×1.5mm in turn with water sandpaper of 800 grit and 1200 grit to remove the oxide layer on the surface of the copper substrate, and then wash the polished copper substrate with distilled water and anhydrous Rinse with ethanol, then dry with a hair dryer for later use;

[0026] Step 2: Add 7g of potassium hydroxide and 1.78g of potassium persulfate to absolute ethanol, set the volume to 150mL, and stir evenly to obtain a solution with a concentration of potassium hydroxide of 0.83mol / L and a concentration of potassium persulfate of 0.044mol / L A;

[0027] Step 3: Add 0.5 mL of fluorosilane dropwise into 30 mL of absolute ethanol, and stir until the fluorosilane is completely dissolved to obtain solution B;

[0028] Step 4. Place the solution A in the step 2 in the electrolytic cell as the electrolyte, and connect the two copper substrates dried in the step 1 as the anode and the cathode to the positive...

Embodiment 2

[0033] This example is the same as Example 1, except that the low surface energy material used is myristic acid, stearic acid or lauric acid.

Embodiment 3

[0035] Step 1. Grind two pieces of copper substrates with a size of 50mm×25mm×1.5mm in turn with water sandpaper of 800 grit and 1200 grit to remove the oxide layer on the surface of the copper substrate, and then wash the polished copper substrate with distilled water and anhydrous Rinse with ethanol, then dry with a hair dryer for later use;

[0036] Step 2: Add 6.3g of potassium hydroxide and 1.78g of potassium persulfate into absolute ethanol, set the volume to 150mL, and stir evenly to obtain a product with a concentration of potassium hydroxide of 0.75mol / L and a concentration of potassium persulfate of 0.044mol / L. Solution A;

[0037] Step 3: Add 0.5 mL of stearic acid dropwise into 30 mL of absolute ethanol, and stir until the stearic acid is completely dissolved to obtain solution B;

[0038] Step 4. Place the solution A in the step 2 in the electrolytic cell as the electrolyte, and connect the two copper substrates dried in the step 1 as the anode and the cathode to...

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Abstract

The invention discloses an electrochemical method for preparing a super-hydrophobic surface on a copper substrate. The electrochemical method comprises the following steps: 1) polishing copper substrates by using 800 particle-size and 1200 particle-size waterproof abrasive paper in turn, washing the copper substrates with distilled water and absolute ethyl alcohol in turn, drying the copper substrates by using an electric blower, and standing by; 2) adding potassium hydroxide and potassium peroxydisulfate into the absolute ethyl alcohol, thereby obtaining a solution A; 3) dropwise adding a material with low surface energy into the absolute ethyl alcohol, thereby obtaining a solution B; 4) placing the solution A as electrolyte into an electrolyzer, respectively taking the two dried copper substrates as an anode and a cathode, and electrolyzing; 5) washing the anode copper substrate after being electrolyzed with absolute ethyl alcohol and clean water in turn, and then placing the cleaned anode copper substrate into the distilled water and soaking for more than 2 hours; and 6) uniformly coating the solution B on the soaked anode copper substrate, and then drying in the air, thereby obtaining the copper substrate with the super-hydrophobic surface. A contact angle of the super-hydrophobic surface prepared according to the method provided by the invention is above 162 degrees.

Description

technical field [0001] The invention belongs to the technical field of materials, and in particular relates to an electrochemical method for preparing a superhydrophobic surface on a copper substrate. Background technique [0002] The wettability of a solid surface is a very important indicator and mainly depends on the chemical composition and microstructure. Many plants in nature, such as lotus leaves, exhibit extraordinary superhydrophobic properties. The surfaces of these leaves usually have micro / nano-scale composite structures, so they have low rolling angles and contact angles as high as 150°. At present, the methods for preparing superhydrophobic materials mainly include anodic oxidation, electrodeposition, chemical corrosion, plasma etching, laser treatment, electrospinning, chemical vapor deposition, sol-gel, etc. However, these methods still have some shortcomings, such as Expensive materials, complex process control, and the need to use templates all seriously h...

Claims

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Application Information

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IPC IPC(8): C25D11/02
Inventor 郝丽梅赵省贵庞绍芳王瑞平
Owner XIAN UNIV OF SCI & TECH
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