Fine pasting glue and preparing process thereof

A mass ratio, emulsifier technology, applied in the direction of adhesive type, amide/imide polymer adhesive, hydrocarbon copolymer adhesive, etc., can solve the problem of decreased strength of lamination film, slow drying speed, and Problems such as production speed, to achieve fast leveling and coating, excellent bonding strength, and good stain removal and cleaning performance

Active Publication Date: 2012-07-11
上海奇想青晨新材料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Corn starch glue mostly adds a large amount of alkaline substances in the formula. The presence of such alkaline substances can easily change the ink and affect the performance of other subsequent processing, especially for laminating products, resulting in a decrease in the strength of the laminating film.
The solid content of corn starch glue is low, and a large amount of water needs to be volatilized when used, so the

Method used

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  • Fine pasting glue and preparing process thereof
  • Fine pasting glue and preparing process thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] With 280 parts by weight of deionized water, 16 parts by weight of emulsifier (sulfosuccinate and phenol ether sulfate are compounded in a weight ratio of 2:5), soft monomers of 600 parts by weight (450 parts by weight of acrylic acid butyl ester and 150 parts by weight of ethyl acrylate compound), the hard monomer of 360 parts by weight (84.6 parts by weight of styrene and the compound of methyl methacrylate of 275.4 parts by weight), join in the pre-emulsification tank and stir ( Rotating speed is 720rpm) 55 minutes, after being made into pre-emulsion, take the pre-emulsion of 29.16 weight parts as the bottom seed reaction solution for subsequent use;

[0043] With 500 parts by weight of deionized water, 145 parts by weight of functional monomers (hydroxyethyl acrylate and N-methylol acrylamide compounded in a weight ratio of 5.5: 1.5), 45 parts by weight of buffering agent (bicarbonate Ammonium and sodium bicarbonate are compounded in a weight ratio of 2.5:7.5), 90 p...

Embodiment 2

[0047] With the deionized water of 280 weight parts, the emulsifier of 16 weight parts (sulfosuccinate and phenol ether sulfate are compounded by the weight ratio of 2:5), the soft monomer of 650 weight parts (the acrylic acid of 487 weight parts butyl ester and 163 parts by weight of ethyl acrylate compound), the hard monomer of 400 parts by weight (the styrene of 96 parts by weight and the methyl methacrylate compound of 304 parts by weight), join in the pre-emulsification tank and stir ( Rotating speed is 680rpm) 55 minutes, after being made into pre-emulsion, take by weighing the pre-emulsion of 107 parts by weight as the bottom seed reaction solution for subsequent use;

[0048]With 500 parts by weight of deionized water, 155 parts by weight of functional monomers (hydroxyethyl acrylate and N-methylol acrylamide compounded in a weight ratio of 5.5: 1.5), 40 parts by weight of buffering agent (bicarbonate Ammonium and sodium bicarbonate are compounded by weight ratio of 2....

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Abstract

The invention relates to fine pasting glue, which is polymerized by the following raw materials of a hard monomer, a soft monomer, a functional monomer, an initiating agent, an emulsifying agent, a buffering agent, a functional auxiliary agent, a viscosity regulator and deionized water. The fine pasting glue and a preparing process thereof also provides a process for preparing the fine pasting glue. The fine pasting glue and the preparing process thereof have the advantages in that the fine pasting glue is of green environmental protection and good for health and contains no bad odor and harmful substances such as phthalic acid esters plasticizer, heavy metals and the like; as the fine pasting glue has high solid content and high tenacity, products pasted are wrinkle-free and uneasy to deform under the normal temperature, and the fine pasting glue is rapid in drying, high in yielding efficiency, and good in scouring and cleaning. The adhesive residue on the facing can be easily cleaned by a wet cloth so that an attractive appearance of a substrate facing is kept; the coating is good in performance so that the glue can achieve rapid leveling and coating on the substrate; and finally the pasted products have a good bonding strength and can keep the glue-bonded surface solid and durable.

Description

technical field [0001] The invention is applied to an adhesive used for bonding between various papers, especially between cardboard and corrugated paper, and particularly relates to a water-based fine mounting glue and a preparation method thereof. Background technique [0002] Fine mounting glue refers to the glue used for bonding between various types of paper, especially the bonding between cardboard and corrugated paper. Fast drying, strong adhesion, no influence on the ink, no discoloration, etc. are required. It can be divided into machine type and manual type. [0003] Due to historical reasons, traditional fine mounting glues are mostly corn starch glues and polyvinyl alcohols. [0004] Corn starch glue mostly adds a large amount of alkaline substances in the formula. The presence of such alkaline substances can easily change the ink and affect the performance of other subsequent processing, especially for laminating products, resulting in a decrease in the streng...

Claims

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Application Information

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IPC IPC(8): C09J133/08C09J133/12C09J125/06C09J133/14C09J133/24
Inventor 吴斐雷
Owner 上海奇想青晨新材料科技股份有限公司
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