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High-refractive-index heat-resistant bisphenol S epoxy (methyl) acrylic ester and synthetic method for same

A technology of acrylates and synthetic methods, applied in chemical instruments and methods, non-polymer organic compound adhesives, preparation of organic compounds, etc.

Inactive Publication Date: 2012-08-01
BEIJING UNIV OF CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, in the field of light curing, the epoxy acrylate with the largest amount is bisphenol A epoxy acrylate, but it is far from satisfactory in some special coatings and adhesive applications, so the synthesis of high refractive index heat-resistant ring Oxyacrylate, it is of great significance to upgrade the product

Method used

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  • High-refractive-index heat-resistant bisphenol S epoxy (methyl) acrylic ester and synthetic method for same
  • High-refractive-index heat-resistant bisphenol S epoxy (methyl) acrylic ester and synthetic method for same
  • High-refractive-index heat-resistant bisphenol S epoxy (methyl) acrylic ester and synthetic method for same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] In the reaction of 25g bisphenol S and 150g epichlorohydrin in the four-necked flask that mechanical stirring paddle, thermometer, condenser tube and constant pressure funnel are housed, stir under nitrogen protection to make bisphenol S dissolve completely in epichlorohydrin, After heating up to 80°C, 1.75g ​​of tetramethylammonium bromide was added, and etherification reaction was carried out at 80°C for 200min under the protection of nitrogen. Then 8 g of 50% NaOH aqueous solution was added dropwise, and the alkali addition time was 200 min to obtain the product 2. The second step reaction is the reaction of intermediate product 2 dissolved in 100ml of 1,4-dioxane and 7g of methacrylic acid; the temperature is raised to 60°C, and 0.357g of benzyltrimethylammonium chloride is added to inhibit the polymerization. The agent is that the addition of p-hydroxyanisole is 0.0331g, and the reaction terminal situation is monitored by infrared. When the epoxy group is 915cm -1...

Embodiment 2

[0027] In the reaction of 25g bisphenol S and 75g epichlorohydrin in the four-necked flask that mechanical stirring paddle, thermometer, condenser and constant pressure funnel are housed, stir under nitrogen protection and bisphenol S is dissolved in epichlorohydrin completely, After heating up to 100°C, 1.65g of tetraethylammonium bromide was added, and etherification reaction was carried out at 100°C for 70min under the protection of nitrogen. Then 8 g of 50% NaOH aqueous solution was added dropwise, and the alkali addition time was 200 min to obtain the product 2. The second step reaction is the reaction of intermediate product 2 dissolved in 100mL of N,N dimethylformamide and 6.1g of methacrylic acid; The polymerizing agent is hydroquinone in an amount of 0.0331 g, and the reaction end point is monitored by infrared. When the infrared characteristic peak of the epoxy group disappears, the product 3 is obtained by rotary evaporation.

[0028] The cured film was tested and ...

Embodiment 3

[0030] In the reaction of 25g bisphenol S and 150g epichlorohydrin in the four-necked flask that mechanical stirring paddle, thermometer, condenser tube and constant pressure funnel are housed, stir under nitrogen protection to make bisphenol S dissolve completely in epichlorohydrin, After heating up to 80°C, 1.75g ​​of tetramethylammonium bromide was added, and etherification reaction was carried out at 80°C for 60min under the protection of nitrogen. Then 8 g of 50% NaOH aqueous solution was added dropwise, and the alkali addition time was 200 min to obtain the product 2. The second step reaction is the reaction of the intermediate product 2 dissolved in 100mL of 1,4-dioxane and 6.7g of acrylic acid; the temperature is raised to 60°C, and the catalyst 0.327g of benzyltrimethylammonium chloride, polymerization inhibitor The amount of p-hydroxyanisole added is 0.0301g, and the reaction end point is monitored by infrared. When the infrared characteristic peak of the epoxy group...

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Abstract

The invention relates to high-refractive-index heat-resistant bisphenol S epoxy (methyl) acrylic ester and a synthetic method for the same, which belong to the field of photo-curing low polymer. The method includes the steps: carrying out a reaction between bisphenol S and ethylene carbonate or propylene carbonate with K2CO3, Na2CO3, BaCO3 or MgCO3 serving as catalyst in the nitrogen atmosphere to obtain a product 1; carrying out a reaction between the bisphenol S or the product 1 and epoxy chloropropane; dropwise adding NaOH aqueous solution after etherification to obtain a product 2; dissolving the product 2 into 1, 4 dioxane or N, N dimethyl formamide to react with acrylic acid or methacrylic acid; monitoring reaction end point condition by means of infrared, and completing the reaction when epoxide group infrared characteristic peak disappears. The refractive index and heat resistance can be improved by means of introduction of a high-refractive-index heat-resistant rigid structure.

Description

technical field [0001] The invention relates to the preparation of a novel high-refractive-index heat-resistant bisphenol S epoxy (meth)acrylate resin, belonging to the field of photocurable oligomers. Background technique [0002] Photocuring technology is the process of using light as an energy source to trigger a rapid transformation of a photoreactive liquid substance into a solid state. As an energy-saving and environmentally friendly new technology, it has the advantages of high efficiency, wide adaptability, economy, energy saving and environmental friendliness. [0003] The photocuring system is mainly composed of oligomers, reactive diluents and photoinitiators, and the properties of the oligomers determine the properties of the cured coating film, such as refractive index, thermal stability and mechanical strength. Epoxy acrylate is an important light-curing oligomer. Its characteristics are: fast light-curing reaction rate, high hardness and tensile strength afte...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C07C317/22C07C315/04C07F7/18C09D4/02C09J4/02
Inventor 聂俊李春光
Owner BEIJING UNIV OF CHEM TECH