Flexible copper-clad plate

Abstract

The invention discloses provides a flexible copper-clad plate with higher heat resistance, inflammability, electric insulating property, attractive appearance and radiation protection, which comprises an adhesive layer, a polyimide substrate and a copper foil layer, wherein the adhesive layer comprises the following component in part by weight: 30 to 40 parts of solvent type epoxy resin, 10 to 20 parts of solvent type epoxy flexibilizer, 6 to 25 parts of halogen-free flame retardant, 1 to 3 parts of radiation protection agent, 1 to 3 parts of additive and 20 to 40 parts of solvent I; the solvent type epoxy resin is obtained by completely dissolving the halogen-free epoxy resin and a solvent II according to the mass ratio of 100 : (50 to 200), and the solvent type epoxy flexibilizer is obtained by completely dissolving the epoxy flexibilizer and a solvent III according to the mass ratio of 100 : (250 to 700).

Description

Technical field [0001] The invention relates to a soft copper clad laminate. Background technique [0002] Fire prevention is a very important aspect of social security. According to statistics, fires caused by polymer materials account for a very large part of the fire incidence in various countries in the world. The main raw material of copper clad laminates is epoxy resin. The data shows that epoxy resin The limiting oxygen index is 19.8, which shows that epoxy copper clad laminates have high flammability. At present, the flame retardancy of conventional copper clad laminates mainly depends on the halogen elements in the raw material resin. This is because the raw material resin is thermally decomposed during combustion. Oxygen halide is generated, and the free radicals generated during the thermal decomposition of polymer combustion can be consumed by hydrogen halide, which makes the chain reaction during combustion slow or interrupted. Hydrogen halide gas is a flame-retardan...

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Problems solved by technology

[0002] Fire prevention is a very important aspect of social security. According to statistics, fires caused by polymer materials account for a very large part of the fire incidence in various countries in the world. The main raw material of copper clad laminates is epoxy resin. The data shows that epoxy resin The limiting oxygen index of the epoxy copper clad laminate is 19.8. It can be seen that the epoxy copper clad laminate has high flammability. At present, the flame retardancy of the conventional copper clad laminate mainly depends on the halogen elements in the raw material resin. Oxygen halides are produced, and the free radicals produced during thermal decomposition of polymers can be consumed by hydrogen halides, which slows down or interrupts the chain reaction during combustion. The surface of the molecular material forms a barrier to cut off the contact with oxygen and reduce the combustibility of the polymer material. However, in the process, it is easy to generate toxic gases. These toxic gases will pollute the environment and cause harm to the surrounding organisms. Halogen-free is currently the The development direction of copper clad laminates, and, with the continuous development of the circuit board industry, the demand for the necessary copper clad laminates continues to grow, and the requirements for flexible copper clad laminates are also increasing. With the miniaturization and multifunctionality of electronic products More and more requirements for copper clad laminates to have excellent dielectric properties, good mechanical properties, high thermal stability, heat resistance and flame retardancy. At the same time, there are more and more radiation sources in modern society, such as solar infrared and ultraviolet rays. , computer radiation, mobile phone radiation, factory workshop radiation... Excessive radiation can cause dizziness, headache, fatigue, insomnia or nightmares, memory loss, depression, and even decreased immunity, and it is easy to be infected with germs

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