Photovoltaic solder strip manufacturing method

A manufacturing method, photovoltaic ribbon technology, applied in the manufacturing field of ribbon, can solve problems such as low production efficiency, cracked silicon wafers, pinhole defects, etc., and achieve the effects of improving quality, reducing fragmentation rate, and uniform coating

Inactive Publication Date: 2012-10-24
江苏金苇电气科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Chinese patent literature discloses a manufacturing method of photovoltaic ribbon, the patent name is "a method of manufacturing ultra-soft photovoltaic ribbon", the patent number is "200910181579.5", the manufacturing method includes the following steps: 1. The copper wire is fine-rolled and annealed in a continuous tube; 2. Ultrasonic cleaning is performed on the annealed oxygen-free copper wire with clean water; 3. The cleaned copper strip is soaked with flux, and then enters a tin furnace to coat tin; 4. An automatic adjustment induced draft fan is installed at the exit of the tin furnace. After the tin-coated copper strip comes out of the tin furnace, it first passes through the induced draft fan, and then goes through the automatic drawing machine and the automatic winding machine to complete the finished ribbon. The processing technology of the photovoltaic ribbon exists There are three disadvantages: 1. Strict requirements on pre-plating treatment. A series of surface pretreatments such as degreasing and decontamination, removal of oxide layer on copper strip surface, cleaning, drying, and flux coating are required, otherwise pinhole defects will easily appear. That is, partial missing plating; 2. To ensure the formation of the copper-tin alloy layer, the time of the copper strip in the molten metal should not be too short. In order to control the thickness of the tin layer, the speed of the tape should not be too fast. Generally, the speed of the tape should not exceed 8m / min, otherwise the tin liquid brought out by the copper strip will increase, resulting in an ultra-thick coating, so the production efficiency will be low; 3. During the continuous tin coating process, the surface of the molten tin liquid will oxidize with the oxygen in the air to form tin oxide, Tin oxide continuously penetrates into the tin liquid, and the accumulated tin oxide in the tin liquid will form tin clusters, which will adhere to the copper strip to form tin slag, and silicon wafers will easily break during welding.

Method used

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Embodiment 1

[0032] The copper strip is heated in the first stage at a temperature of 550 degrees in the furnace, and the heating time is 2 hours; then, the temperature in the furnace is raised to 700 degrees to carry out the heating in the second stage, and the heating time is 3 hours; Inner temperature rises to 900 degrees to carry out the heating of the third stage, and the heating time is 4 hours; The copper strip processed through step 2 is forged, the initial temperature of forging is 900 degrees, the termination temperature is 600 degrees, and the forging ratio is 3- 6. Heat-treat the copper strip by normalizing or annealing process; clean the copper strip through a cleaning agent at a speed of 10m / min. The cleaning agent can be a chemical agent such as alcohol or dilute hydrochloric acid, and then sandwich the copper strip between Sponge or wool felt and other materials, so that the flux is evenly coated on the periphery of the solder strip, and the flux is not limited. NCF can be u...

Embodiment 2

[0035] The copper strip is heated in the first stage at a temperature of 550 degrees in the furnace, and the heating time is 2 hours; then, the temperature in the furnace is raised to 700 degrees to carry out the heating in the second stage, and the heating time is 3 hours; Inner temperature rises to 900 degrees to carry out the heating of the third stage, and the heating time is 4 hours; The copper strip processed through step 2 is forged, the initial temperature of forging is 900 degrees, the termination temperature is 600 degrees, and the forging ratio is 3- 6. Heat-treat the copper strip through normalizing or annealing process; clean the copper strip through a cleaning agent at a speed of 20m / min. The cleaning agent can be a chemical agent such as alcohol or dilute hydrochloric acid, and then sandwich the copper strip between Sponge or wool felt and other materials, so that the flux is evenly coated on the periphery of the solder strip, and the flux is not limited. NCF can...

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PUM

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Abstract

The invention provides a manufacturing method of a photovoltaic solder strip. According to the invention, a copper strip is subjected to simple pre-treatments, tin coating, and rewinding. The copper strip is subjected to the pre-treatments including heating, forging, and heat treatments, such that the density of copper strip is increased. Because the copper strip is forged, the density of the copper strip is increased, deformation amount of the copper strip is increased, and excessive oxidation speed during the copper tin-coating process is avoided. Therefore, the quality of the solder strip is improved, and a qualification rate of the solder strip is higher than 99.9%.

Description

technical field [0001] The invention relates to a method for manufacturing a welding strip, in particular to a method for manufacturing a tin-coated welding strip used for connecting and conducting solar photovoltaic modules, and belongs to the technical field of photovoltaic welding strip processing methods. Background technique [0002] With the development of society, the photovoltaic industry based on solar energy has developed rapidly at home and abroad in recent years. Photovoltaic ribbon is a key component in solar photovoltaic modules in the photovoltaic industry. It is crucial to the energy efficiency and service life of solar photovoltaic modules. Therefore, the quality and performance of photovoltaic ribbons are very high. [0003] Chinese patent literature discloses a manufacturing method of photovoltaic ribbon, the patent name is "a method of manufacturing ultra-soft photovoltaic ribbon", the patent number is "200910181579.5", the manufacturing method includes t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C2/02C23C2/08C23C2/40C22F1/08B21J5/00B08B3/08B08B1/02
Inventor 陆廷柏
Owner 江苏金苇电气科技有限公司
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