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Cyanate ester resin composition and prepreg prepared from same, laminate and metal foil plated laminate produced by using prepreg

A technology of cyanate ester resin and composition, which is applied in the direction of metal layered products, synthetic resin layered products, circuit substrate materials, etc., which can solve the problems of reduced processability, poor resistance to heat and humidity, and high water absorption of cured products. The effect of good flame retardancy and good heat resistance

Inactive Publication Date: 2013-02-13
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, after the phenolic cyanate resin is cured under general process conditions, the cured product has a large water absorption rate and poor heat and humidity resistance.
Moreover, the flame retardancy of the phenolic cyanate ester resin composition itself is not good. In order to meet the requirements of halogen-free and phosphorus-free flame retardancy, it is necessary to add a larger amount of inorganic fillers to achieve flame retardancy, which leads to a decrease in processability.

Method used

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  • Cyanate ester resin composition and prepreg prepared from same, laminate and metal foil plated laminate produced by using prepreg
  • Cyanate ester resin composition and prepreg prepared from same, laminate and metal foil plated laminate produced by using prepreg
  • Cyanate ester resin composition and prepreg prepared from same, laminate and metal foil plated laminate produced by using prepreg

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example

[0073] Synthesis example: the synthesis of the phenol phenyl aralkyl type cyanate ester resin

[0074] Add 300 g of chloroform and 0.97 mol of cyanogen chloride into the three-necked flask, stir well to make them evenly mixed, and stabilize the temperature at -10°C. 86g (hydroxyl content: 0.49mol) phenol phenyl aralkyl phenolic resin (MEH-7800S, softening point: 76°C, hydroxyl equivalent: 175g / eq, provided by Meiwa Kasei Co., Ltd., the structural formula is shown in formula IV), 0.72 Dissolve 1 mol of triethylamine in 700g of chloroform and mix evenly. Slowly add this solution dropwise to the above cyanogen chloride solution in chloroform at -10°C for more than 120 minutes. After the dropwise addition was completed, the reaction was continued for 3 hours to end the reaction. The salt generated by the reaction was filtered off with a funnel, and the resulting filtrate was washed with 500 milliliters of 0.1 mol / L hydrochloric acid, and then washed five times with deionized water ...

Embodiment 1

[0080] With the phenol phenyl aralkyl type cyanate ester resin that obtains in 70 weight parts synthetic examples, 30 weight parts naphthol naphthyl ether type epoxy resins (EXA-7311, provided by DIC Corporation), 0.02 weight parts zinc octoate Dissolve in methyl ethyl ketone and mix well, then add 100 parts by weight of boehmite (APYRAL AOH30, provided by Nabaltec), 5 parts by weight of silicone powder (KMP-605, provided by Shin-Etsu Chemical), 1 part by weight of epoxy silane Combined agent (Z-6040, provided by Dow Corning), 1 part by weight of dispersant (BYK-W903, provided by BYK), and adjusted to a suitable viscosity with methyl ethyl ketone, stirred and mixed evenly to prepare a glue solution. Use 1078, 2116 glass fiber cloth to impregnate the above glue solution, and then dry to remove the solvent to make a prepreg. The above-mentioned prepregs of 2×1078, 4×2116, and 8×2116 are respectively stacked, and the electrolytic copper foil with a thickness of 18um is laminated ...

Embodiment 2

[0082] 35 parts by weight of the phenol phenyl aralkyl type cyanate ester resin obtained in the synthesis example, 15 parts by weight of the phenol biphenyl aralkyl type epoxy resin (NC-3000-FH, provided by Nippon Kayaku Co., Ltd.) , 50 parts by weight of naphthol naphthyl ether type epoxy resin (EXA-7311, provided by DIC Co., Ltd.), 0.02 parts by weight of zinc octylate dissolved in butanone and mixed uniformly, then added 80 parts by weight of boehmite (APYRAL AOH30, provided by Nabaltec), 1 part by weight of epoxy silane coupling agent (Z-6040, provided by Dow Corning), 1 part by weight of dispersant (BYK-W903, provided by BYK), and adjusted to a suitable viscosity with methyl ethyl ketone, stirring and mixing Evenly, the glue solution is prepared. According to the same manufacturing process as in Example 1, copper-clad laminates with thicknesses of 0.1, 0.4, and 0.8 mm were obtained.

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Abstract

The invention relates to a cyanate ester resin composition, a prepeg prepared from the same, a laminate and a metal foil plated laminate produced by using the prepreg. The cyanate ester resin composition comprises a cyanate ester resin, a halogen-free epoxy resin and an inorganic filler, wherein the structural formula I of the cyanate ester resin is shown in the description. In the formula, n is an integer selected from 1 to 50. The cyanate ester resin composition disclosed by the invention has high heat resistance and fire retardance. The laminate and metal foil plated laminate, which are produced by using the prepeg prepared from the cyanate ester resin composition, have high fire retardance without using fire retardants such as halide and phosphide and have low X-axis and Y-axis expansion coefficient; therefore, the laminates are suitable for making high-density substrates for printed circuit boards.

Description

technical field [0001] The invention relates to a resin composition, in particular to a cyanate ester resin composition and prepregs, laminated materials and metal foil-clad laminated materials made by using the same. Background technique [0002] With the development of high performance, high functionality and networking of computers, electronics and information communication equipment, higher requirements are put forward for printed circuit boards: high wiring density and high integration. This requires that the metal-clad laminates used to make printed circuit boards have more excellent heat resistance, heat and humidity resistance, reliability, and the like. [0003] Cyanate resin has excellent dielectric properties, heat resistance, mechanical properties and processability, and it is a commonly used matrix resin in the production of metal foil-clad laminates for high-end printed circuit boards. In recent years, prepregs and laminates made of resin compositions containi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L61/14C08L63/00C08L63/04B32B27/04B32B15/092B32B15/098H05K1/03
CPCC08L79/04C08G73/0655C09D165/02C08L63/00C08J2363/00C08J5/24B32B15/09C08K3/013Y10T428/31786Y10T428/31681C08J5/244C08J5/249
Inventor 唐军旗
Owner GUANGDONG SHENGYI SCI TECH