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Epoxy resin nano composite adhesive film and preparation method thereof

An epoxy resin and nano-composite technology, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of poor heat resistance, low strength, inconvenient use, etc., and achieve excellent thermal stability and preparation The effect of simple process

Active Publication Date: 2013-02-13
HANGZHOU NORMAL UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the nitrile rubber modified epoxy resin in the composition can achieve better toughening effect, but the adhesive film is average, the strength is not high, the heat resistance is poor and the cost is high
Polysulfide rubber toughened epoxy resin adhesive has poor bonding strength and has a strong pungent smell, which is extremely inconvenient to use
Although the strength and toughness of the adhesive synthesized by polyurethane modified epoxy resin have been greatly improved, the improvement of its heat resistance is still not enough, and it is difficult to meet the high temperature resistance, strength and bonding of materials in some high-tech fields at the same time. sexual considerations

Method used

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  • Epoxy resin nano composite adhesive film and preparation method thereof
  • Epoxy resin nano composite adhesive film and preparation method thereof
  • Epoxy resin nano composite adhesive film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Add 450g of epoxy resin, 450g of acrylate rubber, and 100g of curing agent into the acetone solvent, and completely dissolve to obtain a blended solution; use a professional coating tool to coat the blended solution on the PTFE film substrate to control the finished product. The thickness of the adhesive film is 80um; it is placed at room temperature for 24 hours, and then volatilized at room temperature and vacuum for 12 hours to completely remove the acetone and peel off from the substrate to obtain the finished product of the adhesive film.

[0030] The adhesive film was cross-linked and cured in a vacuum environment at 120°C for 4 hours, quenched in a liquid nitrogen environment, and observed with a scanning electron microscope after spraying gold. The fracture surface morphology was as follows: Picture 1-1 As shown, the average diameter of the dispersed phase (epoxy resin-rich phase) is as high as 410 nm. The Young's modulus of the bonding film is 460 MPa, and the ...

Embodiment 2

[0032] Add 425g of epoxy resin, 425g of acrylate rubber, and 50g of curing agent into the acetone solvent, and obtain a blended solution after completely dissolving; add 100g of nano-silica filler into the blended solution, and disperse for 10 minutes to obtain a uniformly dispersed solution; The uniformly dispersed solution is coated on the PTFE film substrate with a professional coating tool, and the thickness of the finished adhesive film is controlled to be 100um; placed at room temperature for 30 hours, and then volatilized at room temperature and vacuum for 15 hours to completely remove acetone and peel off from the substrate Finally, the finished adhesive film is obtained.

[0033] The adhesive film was cross-linked and cured in a vacuum environment at 120°C for 4 h, quenched in a liquid nitrogen environment, and observed by scanning electron microscope after spraying gold. The fracture surface morphology was as follows: diagram 2-1 As shown, the diameter of the disper...

Embodiment 3

[0035] Add 300g of epoxy resin, 600g of acrylate rubber, and 75g of curing agent into the acetone solvent, and obtain a blended solution after completely dissolving; add 25g of nano-silica filler into the blended solution, and disperse for 5 minutes to obtain a uniformly dispersed solution ; Coat the evenly dispersed solution on the polytetrafluoroethylene film substrate with a professional coating tool, and control the thickness of the finished adhesive film to 50um; place it at room temperature for 24 hours, and then volatilize it at room temperature and vacuum for 24 hours to completely remove acetone, from the substrate After peeling off the sheet, the finished adhesive film was obtained.

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Abstract

The invention discloses an epoxy resin nano composite adhesive film and a preparation method of the epoxy resin nano composite adhesive film. In the existing products, the cured epoxy resin has high crosslinking density, excessive internal stress, and limited impact strength, and is brittle. The adhesive film provided by the invention is a thin film of 50-200 mum, and the thin film comprises the following components: 30-60% of epoxy resin, 20-60% of polyacrylate rubber, 7.5-15% of curing agent and 0-15% of nano silicon dioxide fillers. The preparation method comprises the steps: dissolving epoxy resin, polyacrylate rubber and the curing agent in polyacrylate rubber solvent, adding nano silicon dioxide fillers, dispersing for 5min to 15min, coating on a teflon film substrate, controlling the thickness of the adhesive film, standing for 24h to 36h at normal temperature, volatilizing for 12h to 24h at normal temperature and under vacuum condition, and finally stripping from the substrate to obtain the adhesive film. The adhesive film prepared by adopting the method provided by the invention is excellent in bonding property, flexibility, density and thermal stability, and is simple in preparation process.

Description

technical field [0001] The invention belongs to the field of macromolecule materials, and relates to an epoxy resin nanocomposite adhesive film and a preparation method thereof, in particular to an epoxy resin nanocomposite adhesive film excellent in cohesiveness, flexibility, strength and thermal stability and its preparation method. Background technique [0002] Epoxy resin is used as a bonding material in coatings, paints, semiconductor devices and other industries due to its excellent adhesion, low cross-linking shrinkage, chemical stability, electronic insulation, thermal stability, easy processability and low cost. have important applications. However, its high cross-linking density, high internal stress, brittleness and poor impact resistance after cross-linking and curing limit its application to a certain extent. [0003] Around the toughening modification of epoxy resin binder, there are many patent documents at home and abroad. CN20031011182 discloses a fle...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J133/20C09J133/08C09J133/14C09J11/04C09J7/00
Inventor 李勇进水晓雪
Owner HANGZHOU NORMAL UNIVERSITY
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