Latent-curing conductive paste and method of forming electrode on substrate thereby

A conductive paste, curing technology, applied in the direction of conductive materials, circuits, electrical components, etc. dispersed in non-conductive inorganic materials, can solve the problems of affecting printing quality, circuit deformation, poor temperature resistance, etc., to achieve excellent anti-corrosion Sagginess, convenient storage and transportation, and the effect of overcoming high environmental temperature sensitivity

Active Publication Date: 2013-03-27
JIANGSU RUIDE NEW ENERGY TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the disadvantages of this type of hot-melt conductor paste composition are: due to the low melting point and poor temperature resistance of the thermoplastic polymer contained in it, the printed circuit has high environmental temperature sensitivity before final sintering, that is, it is covered with this type. Hot-melt conductor paste but unsintered silicon substrates are easily affected by ambient temperature after production and storage. The ambient temperature varies from 25 to 25 due to climatic reasons or accidental factors. o C increased to 35-40 o C or higher, the printed circuit will be deformed, which will affect the quality of printing; for the silver paste on the front side of the solar cell, this will also cause the printed grid line to sag, reduce the aspect ratio of the grid line, and then reduce the solar energy. The photoelectric conversion efficiency of the battery

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] The invention is a latent curing conductive paste, which contains low melting point thermoplastic polymer, silver powder, glass powder, auxiliary agent, curing reaction agent and curing catalyst; the weight percentage of each component is: 30% low melting point thermoplastic polymer , 45% silver powder, 4% glass powder, 5% auxiliary agent, 15% curing reaction agent, 1% curing catalyst, wherein, the low melting point thermoplastic polymer is a long straight chain primary alcohol containing 15 carbons, the curing Reactant is the polyvinyl alcohol containing double-end epoxy group; Described curing catalyst is triethylamine; Described auxiliary agent is the mixture of stearic acid and ethyl cellulose by weight ratio 1: 9; Described silver powder is Tap density greater than 5 g / cm 3 1. Spherical silver powder with an average particle size of 0.1-2 μm; the glass powder is a general-purpose glass powder for solar cell electronic paste.

[0020] The method of using the latent...

Embodiment 2

[0022] A latent curing type conductive paste, which contains low melting point thermoplastic polymer, aluminum powder, glass powder, auxiliary agent, curing reaction agent and curing catalyst; the weight percentage of each component is: 10% low melting point thermoplastic polymer, 70% % aluminum powder, 10% glass powder, 4.99% auxiliary agent, 5% curing reaction agent, 0.01% curing catalyst, wherein, the low melting point thermoplastic polymer is a long linear primary alcohol containing 20 carbons; the curing reaction The agent is polyvinyl alcohol containing two-terminal epoxy groups; the curing catalyst is tripropylamine; the auxiliary agent is a mixture of stearic acid and acrylic resin in a weight ratio of 1: 4; the aluminum powder is a tap density Greater than 1.3 g / cm 3 1. Spherical aluminum powder with an average particle size of 0.1-2.0 μm; the glass powder is a general-purpose glass powder for solar cell electronic paste.

[0023] The method of using the latent curin...

Embodiment 3

[0025] A latent curing type conductive paste, which contains low melting point thermoplastic polymer, silver powder, glass powder, auxiliary agent, curing reaction agent and curing catalyst; the weight percentage of each component is: 40% low melting point thermoplastic polymer, 30% Silver powder, 1% glass powder, 8% auxiliary agent, 20% curing reaction agent, 1% curing catalyst, wherein, the low-melting thermoplastic polymer is a long linear primary alcohol containing 16 carbons; the curing reaction agent is The polyvinyl alcohol of two-terminal epoxy group; The curing catalyst is tripropylamine; The auxiliary agent is the mixture of stearic acid, methyl cellulose ether and acrylic resin in a weight ratio of 1: 5: 4; The silver powder The tap density is greater than 4.5 g / cm 3 , flaky silver powder with an average particle size of 0.1-1.0 μm and a tap density greater than 5 g / cm 31. A mixture of spherical silver powder with an average particle size of 0.1-2 μm at a weight ra...

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Abstract

The invention relates to latent-curing conductive paste and a method of forming an electrode on a substrate thereby. The latent-curing conductive paste comprises low-melting-point thermoplastic polymer, conductive particle, glass powder, curing reaction agent, curing catalyst and auxiliaries. The low-melting-point thermoplastic polymer is solid or jelly at room temperature, melts into liquid at 35-85 DEG C, and starts curing reaction with the curing reaction agent under the action of the curing catalyst in the temperature range of from 85 DEG C to 160 DEG C. To form the electrode on the substrate by the latent-curing conductive paste, post-printing low-temperature curing is needed. Compared with the prior art, the latent-curing conductive paste is well resistant to medium temperature after printing and curing, so that environmental temperature sensitivity of the conventional hot-melt conductive paste after printing is effectively overcome and printed pattern can be well kept. The latent-curing conductive paste is especially suitable for solar cells.

Description

technical field [0001] The invention relates to a conductive paste, in particular to a latent curable conductive paste and a method for forming a circuit or an electrode on a substrate. The latent curable conductive paste is especially suitable as a conductive paste in a solar cell. Especially the silver paste on the front side of solar cells. Background technique [0002] A solar cell is a semiconductor device that converts solar energy into electricity. Structurally, it includes a back electrode, a pn junction, an anti-reflection film and a front electrode. Among them, the metal electrodes on the front and the metal electrodes on the back are used to output current to the outside. The quality and process performance of the conductive paste used to make the front and back electrodes of solar cells directly affects the photoelectric conversion efficiency and process performance of solar cells, and affects the production cost and efficiency of solar cells. It constitutes a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B1/16H01B13/00H01L31/0224H01L31/18
Inventor 戈士勇
Owner JIANGSU RUIDE NEW ENERGY TECH
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