Method for preparing high-purity low-chlorine electroplating-grade cupric oxide

Abstract

The invention discloses a method for preparing high-purity low-chlorine electroplating-grade cupric oxide. According to the method, copper, liquid ammonia and high-purity carbon dioxide are taken as raw materials, stronger ammonia water is prepared firstly, carbonated ammonia water is obtained through introducing the high-purity carbon dioxide into the stronger ammonia water and controlling carbonization degree, the carbonated ammonia water reacts with the copper under certain air pressure so as to prepare copper-ammonia complexation liquid, the copper-ammonia complexation liquid is then subjected to heating, ammonia distilling, separating, washing, drying and sieving so as to prepare high-purity heavy basic copper carbonate, and the heavy basic copper carbonate is then subjected to heating calcination and decomposition, thereby preparing the high-purity low-chlorine electroplating-grade cupric oxide. According to the method, the carbon dioxide is directly used as a raw material, so that the problems of the traditional method that impurities, such as heavy metal ions and chloride ions, are introduced by raw materials used in the production of basic copper carbonate are solved, the rate of reaction is increased, the production cycle is shortened, the production efficiency is greatly increased, and products are low in impurity content, high in purity, high in activity and wider in application; and meanwhile, the method is high in yield, low in energy consumption, and low in cost and hardly causes pollution.

Description

technical field [0001] The invention belongs to the field of copper oxide production, in particular to a method for preparing high-purity low-chlorine electroplating-grade copper oxide by using carbon dioxide as a raw material. Background technique [0002] In the PCB manufacturing process, the traditional electroplating process uses a copper plate as the anode plate and supplements the copper source. Due to the complex shape of the electronic components, there are holes, concave-convex surfaces and other shapes. In the holes, the electroplating solution cannot penetrate, so the plating Less than copper, the protruding part has a high current density and a thick coating, while the concave part has a low current density and a thin coating, resulting in unqualified products. [0003] At present, the horizontal electroplating process is common in the PCB manufacturing industry in the market. This process overcomes the shortcomings of the traditional process, but this process...

AI Technical Summary

Problems solved by technology

Regarding the production process of copper oxide, it is also involved in some invention patents disclosed at present. The application number is 01127175.2, which uses copper sulfate and copper material as raw materials, undergoes low-temperature oxidation at 80-85°C, obtains copper sulfate through crystallization, and then mixes it with Sodium hydroxide reaction, and then through ball milling, pressure filtration, washing, drying, and pulverization to obtain active copper oxide. Waste water; Application number is the technique that 200710076208.1 discloses to produce copper oxide through distilling ammonia with alkaline etching waste liquid, owing to be to make by distilling ammonia for a long time under high temperature, strong alkali state with alkaline etching waste liquid, so copper oxide activity is relatively Low; the application number is 200710071896.2, which discloses the reaction of copper nitrate and sodium hydroxide through pressure filtration, drying, and roasting to produce copper oxide, which will produce nitrogen dioxide or nitrogen monoxide waste gas, which will cause certain pollution to the environment; application number is 200810067243.1 The production process of synthesizing basic copper chloride as a precursor, and then reacting with sodium hydroxide to produce monoclinic copper oxide, but its activity has not been verified experimentally

At present, copper oxide for horizontal electroplating is also prepared from basic copper carbonate as raw material, but basic copper carbonate is mostly obtained by traditional technology, with high content of impurities such as iron and lead, low purity and insufficient activity.