Modified resin composition, preparation method thereof and application thereof

Abstract

The invention discloses a modified resin composition. The composition is prepared with 35-95% resin matrix, 0-60% additive and 5-15% laser sensitive additive, wherein the laser sensitive additive is preferably made of copper-manganese (iron) and / or copper-manganese (zinc iron). In the preparation process of the modified resin, the laser sensitive additive does not resolve, the resin matrix does not resolve either, non-laser sensitive additive can release copper metallic element to form a active center under the function of a laser, however no poisonous metal generates, and thus the modified resin is safe and environmental. According to the modified resin composition, a preparation method thereof and an application thereof, doping modification technique is applied in the laser sensitive additive for the first time, and thus the performance of a modified resin composition deposited metal film is improved.

Description

technical field [0001] The invention relates to a modified resin composition, in particular to a modified resin composition capable of selectively depositing a metal film in chemical liquid after laser ablation, a preparation method and application thereof. Background technique [0002] Selectively depositing a metal film on the resin matrix can not only maintain the insulation of the resin matrix, but also make the part have the conductivity of the metal film at the same time. [0003] There are two ways to achieve the above purpose: the first solution is to press the metal patch of the formed circuit on the resin matrix to make a part by stamping; the second solution is to first add the resin with laser-sensitive additives Injection molded into parts, and then through the laser forming process and electroless electroless plating, the metal in the chemical potion is selectively deposited on the area scanned by the laser to form a circuit metal film with conductive function....

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Problems solved by technology

[0007] Chinese patent 200910106506.X discloses a three-dimensional circuit manufacturing process and a composite component and manufacturing method of laser plastic raw materials. The copper complex is a modified copper oxalate complex, which belongs to the organic category, and does not explicitly mention this complex. The physical characteristics, decomposition temperature and definite chemical structure of the compound

[0008] Chinese patent ZL 03802302.4 discloses a volatile copper (II) complex that deposits a copper film by atomic layer deposition. The materials are copper, silicon wafer and silicon dioxide with barrier layer, and there is no special mention that this process has the function of selectively depositing copper film

[0013] Through the above analysis, it can be seen that in the laser direct structuring process, laser sensitive additives play an important role. Copper-containing organic laser sensitive additives have limited heat resistance temperature and are not suitable for high temperature resistant resin processing. For example, high temperature resistant nylon, the processing temperature is 320-340 ℃, the processing temperature of liquid crystal polymer LCP is as high as 350 ℃; inorganic laser sensitive additives containing copper and chromium can withstand high temperature, but will produce toxic hexavalent metal chromium ions under the action of laser

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