Adhesive having rapid fixing structure, and preparation method thereof

A positioning structure and adhesive technology, applied in the direction of adhesives, polyether adhesives, adhesive types, etc., can solve problems such as large internal stress, warpage, and large shrinkage of adhesive parts

Active Publication Date: 2013-09-18
塔威新材料科技(上海)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it has the disadvantages of poor moisture and heat aging resistance, large shrinkage rate, and large internal stress of the bonded parts, causing warpage and deformation.

Method used

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  • Adhesive having rapid fixing structure, and preparation method thereof
  • Adhesive having rapid fixing structure, and preparation method thereof
  • Adhesive having rapid fixing structure, and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Take 25Kg (meth)tetrahydrofuryl acrylate, 15Kg (meth)isobornyl acrylate, 12Kg hydroxyethyl methacrylate, 0.05Kg hydroquinone and 0.05Kg edetate disodium salt and stir for 15-30 minutes Mix evenly, control the temperature not to exceed 50°C; slowly add 5Kg nitrile rubber, 12Kg acrylonitrile-butadiene-styrene block copolymer during the stirring process, and stir until the nitrile rubber, acrylonitrile-butadiene - The styrene block copolymer is completely dissolved, and the temperature is controlled not to exceed 50°C; then add 28Kg E-51 epoxy resin, 0.5Kg silane coupling agent and stir for 15-30 minutes, the temperature is not higher than 50°C; cool down to 35°C Next, add 2.4Kg cumene hydrogen peroxide and stir for 15-30 minutes, the temperature is not higher than 35°C; cool down to below 30°C and vacuum to remove air bubbles to obtain component A, which can be stored at room temperature.

[0039] Take 25Kg tetrahydrofuryl methacrylate, 15Kg isobornyl methacrylate, 12.48K...

Embodiment 2

[0042] Take 19.99Kg N,N dimethylacrylamide, 2.5Kg multifunctional (meth)acrylate, 0.01Kg p-benzoquinone and 0.5Kg nitrilotriacetic acid and stir for 15-30 minutes to mix evenly, and control the temperature not to exceed 50°C ;After 5Kg of thermoplastic acrylate elastomer, stir until the thermoplastic acrylate elastomer is completely dissolved, and control the temperature not to exceed 50°C; add 50Kg of E-44 epoxy resin, 20Kg of polyurethane (meth)acrylate, and 1Kg of silane coupling agent, 1Kg defoamer, stir for 15-30 minutes, the temperature is not higher than 50°C; cool down to below 35°C, add 5Kg of benzoyl peroxide and stir for 15-30 minutes, the temperature is not higher than 35°C; cool to below 30°C Vacuumize to remove air bubbles to obtain component A, which can be stored at room temperature.

[0043]Take 19.5Kg N, N dimethylacrylamide and 6.5Kg multifunctional (meth)acrylate and stir for 15-30 minutes to mix evenly, and control the temperature not to exceed 50°C; then ...

Embodiment 3

[0046] Take 25Kg polyethylene glycol diacrylate, 26.39Kg ethoxylated bisphenol A diacrylate, 1Kg2,6-di-tert-butyl-4-methylphenol and 0.01Kg diethylenetriaminepentaacetic acid and stir for 15-30 minutes Mix evenly, control the temperature not to exceed 50°C; slowly add 8Kg chloroprene rubber and 3Kg styrene-butadiene block copolymer during the stirring process, and stir until the neoprene and styrene-butadiene block copolymerization The substance is completely dissolved, and the temperature is controlled not to exceed 50°C; then add 26Kg E-20 epoxy resin, 10Kg polyether (meth)acrylate, 0.05Kg silane coupling agent, 0.05Kg adhesion promoter and stir for 15-30 minutes. The temperature is not higher than 50°C; cool down to below 35°C, add 0.5Kg methyl ethyl ketone peroxide and stir for 15-30 minutes, the temperature is not higher than 35°C; cool down to below 30°C and vacuumize to remove air bubbles to obtain component A, group A Portions can be stored at room temperature.

[004...

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PUM

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Abstract

The invention discloses an adhesive having a rapid fixing structure. The adhesive comprises a component A and a component B, the component A comprises 20-50 parts of an epoxy resin, 5-52 parts of a (methyl) acrylate monomer, 5-20 parts of an elastomer, 0.5-5 parts of a peroxide radical initiator, 0.01-1 part of a free radical polymerization inhibitor, 0.01-0.5 parts of a metal ion complexing agent, and 0.1-2 parts of an assistant, and the component B comprises 5-50 parts of an epoxy resin room-temperature curing agent , 1-5 parts of an epoxy resin curing promoter, 5-52 parts of the (methyl) acrylate monomer, 5-20 parts of the elastomer, 0.1-5.0 parts of a reducing agent, 0.001-0.5 parts of a promoter, and 0.1-2 parts of the assistant. The adhesive having a rapid fixing structure prepared by using the above components and the preparation method effectively solves the disadvantages of long fixing time, long complete curing time, bad damp-heat aging resistance and the like of the prior art.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to a rapid positioning structural adhesive. At the same time, the invention also discloses a preparation method of the adhesive. Background technique [0002] Epoxy resin adhesives have many advantages such as high bonding strength to metal substrates, low shrinkage, excellent aging resistance, and excellent electrical properties. They are widely used in aerospace, automotive, electronics, machinery and other fields, but epoxy resin adhesives are also There are some disadvantages, such as: slow curing speed, long positioning time, low bonding strength to plastic substrates. Among them, the one-component epoxy resin adhesive needs to be heated to at least 80°C to be cured, and the fast-curing two-component epoxy resin adhesive also needs at least about 10 minutes to be positioned. These defects and deficiencies have seriously affected the application of epoxy resin adhesives in fa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/02C09J4/06C09J171/08
Inventor 柳成良林江滨范建军
Owner 塔威新材料科技(上海)有限公司
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