Method of forming ferrite thin film and ferrite thin film obtained using the same

A ferrite thin film and coating film technology, applied in the application of magnetic film to substrate, liquid application, chemical vapor deposition application, etc., can solve the problem of property degradation, difficult to obtain magnetic film thickness, large tensile stress, etc. problem, to achieve the effect of restraining tensile stress

Inactive Publication Date: 2013-10-23
MITSUBISHI MATERIALS CORP
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0006] However, if the method described in the above-mentioned conventional non-patent document 1 is used, the defect of the sol-gel method, that is, the generation of cracks, is accompanied by the heating condition, so it is difficult to obtain a film of several μm required for a magnetic thin film mounting device. thick
Specifically, under the above-mentioned firing conditions, tensile stress due to shrinkage of the film is generated during firing. However, in the case of a thick film with a film thickness of 1 μm or more, the tensile stress becomes large, and it is considered that torsion may occur. crack
And, the deterioration of characteristics is incurred by applying a large tensile stress to the film

Method used

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  • Method of forming ferrite thin film and ferrite thin film obtained using the same
  • Method of forming ferrite thin film and ferrite thin film obtained using the same
  • Method of forming ferrite thin film and ferrite thin film obtained using the same

Examples

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Effect test

Embodiment 1-1～1-16

[0037] First, as a composition for forming a NiZn ferrite thin film, a metal (Ni, Zn, Fe) nitrate (nickel nitrate hexahydrate, zinc nitrate hexahydrate, iron nitrate nonahydrate), acetonitrile, propylene glycol, A sol-gel solution having a metal oxide concentration of 5% by mass and butanol. In addition, the respective metals (Ni, Zn, Fe) contained in the sol-gel solution were assumed to be (Ni 0.36 Zn 0.64 O) (Fe 2 o 3 ) with the ratio. And prepare Si / SiO 2 substrate. Next, the sol-gel solution was dropped on Si / SiO 2 On the substrate, spin coating was performed at 3000 rpm for 15 seconds to form a coating film. Then, the substrate with the coating film was mounted on a hot plate heated under the conditions shown in Table 1 below, and pre-sintered to thermally decompose the precursor. This operation is repeated 5 to 15 times to obtain an amorphous substrate with a pre-sintered film having a desired film thickness. Next, put the obtained amorphous substrate with a pre...

Embodiment 2-1～2-16

[0039] First, as a composition for forming a CuZn ferrite thin film, a concentration of a metal oxide composed of copper nitrate trihydrate, zinc acetate dihydrate, iron nitrate nonahydrate, acetonitrile, propylene glycol, and butanol was prepared at a concentration of 5 wt. % of the sol-gel solution. In addition, the respective metals (Cu, Zn, Fe) contained in the sol-gel solution were assumed to be (Cu 0.40 Zn 0.60 O) (Fe 2 o 3 ) with the ratio. And, prepare Si / SiO 2 substrate. Next, the sol-gel solution was dropped on Si / SiO 2 On the substrate, spin coating was performed at 3000 rpm for 15 seconds to form a coating film. Then, the substrate with the coating film was mounted on a hot plate heated under the conditions shown in Table 2 below, and temporarily fired to thermally decompose the precursor. This operation is repeated 5 to 10 times to obtain an amorphous substrate with a pre-sintered film having a desired film thickness. Then, put the obtained amorphous subs...

Embodiment 3-1～3-16

[0041] First, as a composition for forming a NiCuZn ferrite thin film, a metal oxide compound composed of nickel acetate tetrahydrate, copper nitrate trihydrate, zinc acetate dihydrate, iron nitrate nonahydrate, acetonitrile, propylene glycol, and butanol was prepared. The concentration of the substance is a sol-gel solution with a concentration of 5% by mass. In addition, the respective metals (Ni, Cu, Zn, Fe) contained in the sol-gel solution were assumed to have the composition of the formed film as (Ni 0.40 Cu 0.20 Zn 0.40 O) (Fe 2 o 3 ) with the ratio. And, prepare Si / SiO 2 substrate. Next, the sol-gel solution was dropped on Si / SiO 2 On the substrate, spin coating was performed at 3000 rpm for 15 seconds to form a coating film. Then, the substrate with the coating film was mounted on a hot plate heated under the conditions shown in Table 3 below, and pre-sintered to thermally decompose the precursor. This operation is repeated 5 to 15 times to obtain an amorphou...

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Abstract

[Task] To provide a method of forming a ferrite thin film in which it is possible to manufacture a thick film having a film thickness of 1 µm or more using a sol-gel method without causing cracking. [Means for Resolution] A method of forming a ferrite thin film by carrying out a process for forming a coated film by coating a ferrite thin film-forming composition on a heat-resistant substrate and a process for calcining the coated film once or a plurality of times so that the thickness of the calcined film on the substrate becomes a desired thickness, and firing the calcined film formed on the substrate, in which the conditions for firing the calcined film formed on the substrate are under the atmosphere or an oxygen gas or inert gas atmosphere, a temperature-rise rate of 1°C / minute to 50°C / minute, a holding temperature of 500°C to 800°C, and a holding time of 30 minutes to 120 minutes.

Description

technical field [0001] The present invention relates to a method of inexpensively forming a high-performance ferrite thin film on a substrate by using a sol-gel method. Background technique [0002] Ferrite thin films are used as magnetic core materials for high-frequency inductors and transformers because they have high magnetic permeability and high electrical resistance, and have low eddy current loss in the high-frequency range. [0003] Various methods such as sputtering, vapor deposition, electroplating, powder beam, sol-gel, and plasma MOCVD are used to form ferrite thin films. In vacuum process methods such as the sputtering method and the CVD method, it is necessary to introduce expensive equipment, and there is a problem that the initial investment increases. In addition, the rotary spray method using electroless plating has the advantage of being able to form a ferrite film with a relatively inexpensive device, but it is not preferable in terms of environment bec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/26C04B35/622
CPCC23C18/1208H01F41/22H01F10/20H01F41/24C23C18/1254C23C18/1283C23C26/00C23C30/00
Inventor 土井利浩樱井英章中村贤藏五十岚和则曽山信幸
Owner MITSUBISHI MATERIALS CORP
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