A
thyristor assembly with multiple combined chips comprises a shell and a base, the base is provided with at least three groups of chipsets which are combined to form a rectangular shape, and each
chipset comprises a
chip, an
electrode, a first conductive plate, a second conductive plate, a third conductive plate and a fourth conductive plate. The first current-conducting plate, the second current-conducting plate, the third current-conducting plate and the fourth current-conducting plate are spliced to form a rectangular shape. The at least two
chip sets are arranged on the same base in parallel, and the
four current-conducting plates are spliced into the rectangle, so that the internal space of the shell is fully utilized, the whole
assembly is more compact, the tedious procedure of selecting from multiple groups when three or more groups are formed by two chips as one group in the prior art is eliminated, and the production efficiency is improved. Therefore, the installation efficiency and the
assembly consistency are obviously improved. The overall structure is reasonable, the space
utilization rate is high, material waste is reduced, the size of the shell is reduced,
miniaturization design and on-site rapid replacement of equipment are facilitated, and the
system integration degree and operation and maintenance convenience are further improved.