Diamond cutting blade and preparation method thereof

A diamond cutting and diamond particle technology is applied in the field of ultra-thin metal-based diamond cutting sheets and their preparation, which can solve the problems of being unsuitable for manufacturing ultra-thin diamond cutting sheets, common metal powders with low strength and hardness, and being unable to meet industrial production requirements, and the like. To achieve the effect of long service life, simple preparation method, and avoidance of broken knives

Active Publication Date: 2015-07-15
苏州赛尔科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Ordinary metal powder has low strength and hardness, is easy to deform when preparing ultra-thin diamond cutting discs, has a very low pass rate, and is easy to break when used. It is not suitable for manufacturing ultra-thin diamond cutting discs below 50 microns, and cannot meet the requirements of industrial production.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] (1) Mixing: add the required metal-based tire raw materials into the vortex mixer according to the above ratio and stir for 2 hours, then add the diamond particles that have been screened and descaled, and stir for 3 hours to obtain the mixture;

[0037] The mass ratio of each component in the metal base tire raw material is:

[0038] Nano copper (Cu) powder 45%

[0039] Nano tin (Sn) powder 30%

[0040] Nickel (Ni) powder 3%

[0041] Cobalt (Co) powder 4%

[0042] Silver (Ag) powder 11%

[0043] Silicon carbide (SiC) powder 7%

[0044] The mass ratio of diamond particles to metal base tire is 1:37;

[0045] (2) Forming: Slowly put the above-mentioned mixture into the mold, fill it evenly, scrape it flat, and place it on the hydraulic press console to cold press the workpiece to obtain a workpiece with a cold pressing pressure of 400KN;

[0046] (3) Sintering: move the mold together with the workpiece into the sintering furnace as a whole, and sinter to obtain the...

Embodiment 2

[0051] (1) Mixing: add the required metal-based tire raw materials into the vortex mixer according to the above ratio and stir for 4 hours, then add the sieved and descaled diamond particles, and stir for 2 hours to obtain the mixture.

[0052] The mass ratio of each component in the metal base tire raw material is:

[0053] Nano copper (Cu) powder 50%

[0054] Nano tin (Sn) powder 30%

[0055] Nickel (Ni) powder 2%

[0056] Cobalt (Co) powder 3%

[0057] Silver (Ag) powder 5%

[0058] Silicon carbide (SiC) powder 10%

[0059] The mass ratio of diamond particles to metal base tire is 1:18;

[0060] (2) Forming: Slowly put the above-mentioned mixture into the mold, fill it evenly, scrape it flat, place it on the hydraulic press console and cold press it to obtain a workpiece, and the cold pressing pressure is 500KN.

[0061](3) Sintering: Move the mold together with the workpiece into the sintering furnace as a whole, and sinter to obtain the blank. The process condition...

Embodiment 3

[0066] (1) Mixing: add the required metal-based tire raw materials into the vortex mixer according to the above ratio and stir for 3 hours, then add the diamond particles that have been screened and descaled, and stir for 4 hours to obtain the mixture;

[0067] The mass ratio of each component in the metal base tire raw material is:

[0068] Nano copper (Cu) powder 47%

[0069] Nano tin (Sn) powder 31%

[0070] Nickel (Ni) powder 1%

[0071] Cobalt (Co) powder 2%

[0072] Silver (Ag) powder 5%

[0073] Silicon carbide (SiC) powder 14%

[0074] The mass ratio of diamond particles to metal base tire is 1:35;

[0075] (2) Forming: Slowly put the above-mentioned mixture into the mold, fill it evenly, scrape it flat, place it on the hydraulic press console and cold press it to obtain a workpiece, and the cold pressing pressure is 500KN;

[0076] (3) Sintering: move the mold together with the workpiece into the sintering furnace as a whole, and sinter to obtain the blank; the ...

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Abstract

The invention discloses a diamond cutting blade and a preparation method thereof. The diamond cutting blade comprises a metal base body and diamond particles. The concentration of the diamond particles in the diamond cutting blade is 16-28%, and the particle size of the diamond particles is 12-45 microns. The metal base body comprises: by mass, 45-67% of nanometer copper powder, 15-45% of nanometer tin powder, 5-16% of silver powder, 2-15% of cobalt powder, 1-8% of nickel powder and 10-15% of silicon carbide powder. The diamond cutting blade is obtained by a mixing-molding-sintering-processing-grinding course, has high strength and hardness and low sintering temperature, solves the cutting deviation problem caused by bad heat transmission and has a long service life. The diamond cutting blade can accord with the thin thickness and high strength requirements of semiconductor industry on cutting blades, has the advantages of simple preparation method and wide raw material source, and is suitable for industrialized production.

Description

technical field [0001] The invention relates to a diamond cutting sheet, in particular to an ultra-thin metal-based diamond cutting sheet that can be used in the semiconductor industry and a preparation method thereof. Background technique [0002] Due to the characteristics of diamond (high hardness, high compressive strength, and good wear resistance), it becomes an ideal tool for cutting hard and brittle materials and cemented carbide in cutting processing. It not only has high efficiency, high precision, and roughness Good quality, less consumption of abrasive tools, long service life, and can improve working conditions at the same time, so it is widely used in hard materials that are difficult to process with ordinary cutting discs. Diamond cutting discs are made by mixing metal powder or resin powder matrix with artificial diamond particles, grinding, blanking and sintering. In the prior art, the resin-based diamond cutting discs prepared with resin powder as the matr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C26/00B22F1/00B23P15/28
Inventor 冉隆光李威
Owner 苏州赛尔科技有限公司
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