Abrasive and polishing composition
A technology of grinding materials and compositions, which is applied in the direction of abrasive materials, grinding devices, grinding machine tools, etc., and can solve problems such as insufficient satisfaction
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
no. 1 Embodiment approach
[0022] A first embodiment of the present invention will be described below.
[0023] The polishing composition of this embodiment contains an abrasive and water. The abrasive material contains zirconia particles. The polishing composition is suitably used for polishing hard and brittle materials such as sapphire, silicon nitride, silicon carbide, silicon oxide, glass, gallium nitride, gallium arsenide, indium arsenide, and indium phosphide.
[0024] The zirconia particles contained in the abrasive may contain crystalline zirconia such as cubic system, tetragonal system, and monoclinic system, or may contain amorphous zirconia. As the abrasive, tetragonal or monoclinic zirconia is preferable. Zirconia particles may also contain calcium, magnesium, hafnium, yttrium, silicon, and the like. Among them, the purity of the zirconia particles is preferably as high as possible, specifically, preferably 98% by mass or more, more preferably 99% by mass or more, and still more preferab...
no. 2 Embodiment approach
[0067] Next, a second embodiment of the present invention will be described.
[0068] The polishing composition of the second embodiment differs from the polishing composition of the first embodiment in that it contains zirconia particles having an average secondary particle size of 1.0 μm or less. The average secondary particle size of the zirconia particles contained in the polishing composition according to the second embodiment is preferably 0.7 μm or less, more preferably 0.5 μm or less, even more preferably 0.4 μm or less.
[0069] In addition, the value obtained by dividing the average secondary particle diameter of the zirconia particles contained in the polishing composition of the second embodiment by the average primary particle diameter of the same zirconia particles is 1.5 or less.
[0070] Therefore, it is considered that the average primary particle size of the zirconia particles contained in the polishing composition of the second embodiment is relatively large...
Embodiment 1～6、 comparative example 1、2
[0073] Embodiment 1~6, comparative example 1, 2 and reference example 1
[0074] The polishing compositions of Examples 1 to 6 and Comparative Examples 1 and 2 were prepared by mixing monoclinic zirconia particles into water and adjusting pH with phosphorous acid or potassium hydroxide. The polishing composition of Reference Example 1 was prepared by mixing a commercially available cerium oxide abrasive material, CEPOL132 manufactured by Fujimi Incorporated, with water and adjusting the pH with potassium hydroxide. Table 1 shows details of each polishing composition.
[0075] The production method of the zirconia particles used in each polishing composition of Examples 1 to 6 and Comparative Examples 1 and 2 is shown in the column of "Manufacturing method" of Table 1. "ZW" indicates the use of zirconia particles produced by a wet process, "ZD" indicates the use of zirconia particles produced by a dry process using zircon sand as a raw material, and "BD" indicates the use of z...
PUM
| Property | Measurement | Unit |
|---|---|---|
| Specific surface area | aaaaa | aaaaa |
| Specific surface area | aaaaa | aaaaa |
| Particle size | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More