Glue for cutting process of solar cell silicon wafer

Abstract

The invention discloses a glue for a cutting process of an environment-friendly solar cell silicon wafer. The glue comprises a component A and a component B, wherein the component A comprises the following ingredients in percent by weight: 25-35 percent of epoxy resin A, 25-35 percent of epoxy resin B, 5-10 percent of flexibilizer, 0.1-0.5 percent of thixotropic agent, 5-10 percent of diluent, 20-40 percent of filler and 0.1-0.5 percent of auxiliary; and the component B comprises the following ingredients in percent by weight: 10-20 percent of aromatic amine, 10-20 percent of alicyclic amine, 5-15 percent of phenolic amine, 3-10 percent of low molecular weight polyamide, 5-15 percent of diluent, 5-10 percent of catalyst A, 5-10 percent of catalyst B, 0.5-1 percent of auxiliary and 30-55 percent of filler. All performance indexes of the glue for the cutting process can reach the performance indexes of slimier products abroad, the dilemma that the glue for the cutting process of most of solar cell silicon wafers at present depends on imported products imported, no special equipment requirement is required for production enterprises, and an important practical significance is provided for reducing the cost and increasing the production efficiency for the production enterprises.

Description

technical field [0001] The invention relates to a process glue, in particular to an environment-friendly glue used in the process of cutting silicon wafers of solar cells, which belongs to the field of chemical industry. Background technique [0002] Due to the rapid development of solar cells in the photovoltaic industry in recent years, the glue used in the slicing process required in the manufacturing process of crystalline silicon wafers in the solar cell industry has also developed rapidly. Its main application field is the cutting process of solar cell silicon wafers Use glue. At present, the adhesive used in the cutting process of solar cell silicon wafers in solar module factories basically adopts imported adhesives. Although some domestic manufacturers can develop adhesives with certain properties that can replace foreign products, but in high use pass rate, Low cost, process ease of operation, environmental protection and other aspects still need to be improved. ...

AI Technical Summary

Problems solved by technology

At present, the adhesive used in the cutting process of solar cell silicon wafers in solar module factories basically adopts imported adhesives. Although some domestic manufacturers can develop adhesives with certain properties that can replace foreign products, but in high use pass rate, Low cost, process ease of operation, environmental protection and other aspects need to be improved