A kind of preparation method of gold-boron alloy target material

Abstract

The invention provides a method for preparing a gold-boron alloy target material. The method comprises the following steps: 1, uniformly mixing gold powder with boron powder, and pressing to obtain a pressed powder blank, wherein the atomic percentage content of boron in the pressed powder blank is 20-60%, and the balance is gold; 2, performing vacuum electric arc melting on the pressed powder blank twice to obtain an ingot blank; 3, crushing the ingot blank, and subsequently performing high-energy ball-milling on the crushed ingot blank to obtain gold-boron alloy powder; and 4, performing vacuum hot pressed sintering on the gold-boron alloy powder so as to obtain the gold-boron alloy target material. The method is simple and feasible, the prepared gold-boron alloy target material is high in quality purity, low in impurity content, stable in component, uniform in texture and high in density, and the use requirements of a high-quality plating film can be met.

Description

technical field [0001] The invention belongs to the technical field of gold-boron alloy material processing, and in particular relates to a preparation method of a gold-boron alloy target. Background technique [0002] In the field of vacuum coating, there are two technical approaches for the preparation of gold-boron film layers, namely co-deposition of gold and boron single substance targets and single gold-boron alloy target deposition. For the co-deposition of gold and boron single substance targets, the advantage is that the power of the two targets can be adjusted conveniently to achieve the composition ratio of gold and boron, and there is no need to develop a gold-boron alloy target. The disadvantage is that the product yield is low, boron is non-metallic and the target content is high, the internal stress is large during the coating process, and the film adhesion is small, causing the film to wrinkle and peel off; the boron target sputtering process is not easy to s...

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Problems solved by technology

The disadvantage is that the product yield is low, boron is non-metallic and the target content is high, the internal stress is large during the coating process, and the film adhesion is small, causing the film to wrinkle and peel off; the boron target sputtering process is not easy to stabilize, resulting in The boron content is unstable, which is reflected in two aspects. The atomic ratio of gold and boron in different batches of film layers varies greatly, and the process is not easy to reproduce. Different positions of the same film layer have incomplete distances from gold and boron sputtering targets. Consistently, the atomic ratio of gold and boron is also very different, and the low yield and the difficulty of precise control and instability of the composition have brought great difficulties to the coating

However, the single gold-boron alloy target deposition technology has only been mentioned in some sensitive fields abroad, but no detailed reports have been seen, and there is no public information about the composition and preparation methods of the gold-boron alloy target.

At present, gold-boron alloy targets are being initially developed in China. However, due to the large difference in the melting point and density of gold and boron atoms, the composition of the alloy target cannot be precisely controlled by the traditional smelting process, and the prepared target has uneven structure and composition. Severe segregation and low density cannot meet the requirements of high-quality coating

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