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Laser direct structuring PC/ABScomposite material, preparation method and application thereof

A technology of laser direct forming and composite materials, applied in the field of PC/ABS composite materials and their preparation, can solve the problems of thermal oxidation aging of polymer materials, affecting the service life of products, affecting the effect of electroless plating, etc., and achieves good dispersibility. , Improve the service life and reduce the effect of thermal oxidation aging reaction

Active Publication Date: 2014-07-16
GUANGZHOU SUPER DRAGON ENG PLASTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, on the one hand, because these metal copper compounds are prone to decomposition during processing, the resulting elemental copper is enriched on the surface of the product, which seriously affects the effect of electroless electroless plating; Thermal Oxidative Aging (Degradation and Stabilization of Polymer, Applied Science and Publishers LTD London, 1975, 90-92)
In the above composite material formula, there is direct contact between the metal copper element and the polymer substrate, so that the polymer substrate is prone to thermal oxygen aging reaction under the catalysis of the copper compound, which affects the service life of the product

Method used

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  • Laser direct structuring PC/ABScomposite material, preparation method and application thereof
  • Laser direct structuring PC/ABScomposite material, preparation method and application thereof
  • Laser direct structuring PC/ABScomposite material, preparation method and application thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] Embodiment 1: the preparation of the PC / ABS composite material of laser direct forming

[0048] PC / ABS alloy 74wt%, halogen-free flame retardant selection Reofos TPP (triphenylphosphine compound) 10wt%, laser activated particles 5wt%; glass fiber 10wt%; antioxidant (tri[2,4-di-tert-butyl ] phenyl phosphite) 0.5wt%, compatibilizer (ABS-g-MAH) 0.5wt%.

[0049] The preparation of the laser-activated particles: under a nitrogen atmosphere, add the configured acrylate monomer (methyl methacrylate) / 1 L of positive microemulsion composed of dodecyltrimethylammonium bromide / water, wherein the mass ratio of acrylate monomer / dodecyltrimethylammonium bromide / water is 30:5:100. Under the condition of vigorous stirring at room temperature, slowly add nano-copper powder with a concentration of 30wt% (3% of the mass of the acrylate monomer), an initiator (azoisobutyronitrile, 1% of the mass of the acrylate monomer), silane Coupling agent (isobutyl triethoxy silicon, 1% of the mass ...

Embodiment 2

[0051] Embodiment 2: the preparation of the PC / ABS composite material of laser direct molding

[0052] PC / ABS alloy 69wt%, halogen-free flame retardant selection Reofos TPP (triphenylphosphine compound) 10wt%, laser activated particles 10wt%; glass fiber 10wt%; antioxidant (tri[2,4-di-tert-butyl ] phenyl phosphite) 0.5wt%, compatibilizer (ABS-g-MAH) 0.5wt%.

[0053] The preparation of the laser-activated particles: under a nitrogen atmosphere, add the configured acrylate monomer (methyl methacrylate) / 1 L of positive microemulsion composed of dodecyltrimethylammonium bromide / water, wherein the mass ratio of acrylate monomer / dodecyltrimethylammonium bromide / water is 30:5:100. Under the condition of vigorous stirring at room temperature, slowly add nano-copper powder with a concentration of 20wt% (1% of the mass of the acrylate monomer), an initiator (azoisobutyronitrile, 1% of the mass of the acrylate monomer), silane Coupling agent (isobutyl triethoxy silicon, 1% of the mass...

Embodiment 3

[0055] Embodiment 3: the preparation of the PC / ABS composite material of laser direct forming

[0056] PC / ABS alloy 64wt%, halogen-free flame retardant selection Reofos TPP (Dahu Company) 10wt%, laser activated particles 15wt%; glass fiber 10wt%; antioxidant (tris[2,4-di-tert-butyl]phenyl Phosphite) 0.5wt%, compatibilizer (ABS-g-MAH) 0.5wt%.

[0057] Preparation of the laser-activated particles: under a nitrogen atmosphere, add the configured acrylate monomer (propyl methacrylate) / 1 L of positive microemulsion composed of dodecyltrimethylammonium bromide / water, wherein the mass ratio of acrylate monomer / dodecyltrimethylammonium bromide / water is 30:5:100. Under the condition of vigorous stirring at room temperature, the concentration of nano-copper powder is 20wt% (5% of the mass of the acrylate monomer), the initiator (azoisobutyronitrile, 2% of the mass of the acrylate monomer), silane Coupling agent (isobutyl triethoxy silicon, 5% of the mass of acrylate monomer) in isopr...

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Abstract

The invention belongs to the field of laser direct structuring composite materials and discloses a laser direct structuring PC / ABS composite material with an excellent thermo-oxidative aging resistance, as well as a preparation method and application thereof. The composite material comprises the following components in percentage by weight: 60-80% of a PC / ABS base material, 5-15% of a halogen-free flame retardant, 5-15% of laser activated particles, 0-10% of heat conductive inorganic filler and 0-5% of other additives. The preparation method of the laser activated particles comprises the following steps: dropwise adding an alcohol solution of nano copper powder, an imitator and a silane coupling agent into a positive microemulsion consisting of acrylate monomer, dodecyltrimethylammonium bromide and water; and heating for reaction, filtering and drying to obtain the laser activated particles. Metal copper is modified by a micro-emulsion polymerization method to obtain the laser direct structuring PC / ABS composite material which has good laser-induced electroplating performance and excellent thermo-oxidative aging resistance.

Description

technical field [0001] The invention belongs to the technical field of laser direct forming composite materials, and in particular relates to a PC / ABS composite material capable of direct laser forming and having excellent heat-oxidative aging resistance and its preparation method and application. Background technique [0002] 3D-molded interconnect device (Three-dimensional molded interconnect device, 3D-MID) is a circuit pattern made on an injection-molded plastic substrate, so that the electrical interconnection, support and protection functions of ordinary circuit boards Realized on one device, it forms a three-dimensional circuit carrier integrating electromechanical functions. Compared with the traditional circuit board production technology, the 3D-molded interconnect device production process has the characteristics of faster production speed, simpler process, more controllable cost and wider application fields. For example, for sensors manufactured by laser direct ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L69/00C08L55/02C08K13/06C08K9/04C08K9/06C08K3/08C08F292/00
Inventor 郝源增邓爵安袁海兵唐海涛谯盛元吴磊王雷范木良
Owner GUANGZHOU SUPER DRAGON ENG PLASTICS
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