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Acetenyl polyimide modified cyanate ester adhesive and preparation method thereof

An acetylene-based polyimide, acetylene-based polyimide resin technology, applied in the directions of adhesives, non-polymer adhesive additives, adhesive additives, etc., can solve the problems of poor thermal stability and insufficient toughness, and achieve improved Effects of heat resistance and bond strength, good modulus retention, high crosslink density

Active Publication Date: 2015-06-17
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims to solve the problems of poor thermal stability and insufficient toughness in existing cyanate adhesives, and provides an ethynyl polyimide modified cyanate adhesive and a preparation method thereof

Method used

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  • Acetenyl polyimide modified cyanate ester adhesive and preparation method thereof
  • Acetenyl polyimide modified cyanate ester adhesive and preparation method thereof
  • Acetenyl polyimide modified cyanate ester adhesive and preparation method thereof

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specific Embodiment approach 1

[0031] Specific Embodiment 1: The ethynyl polyimide modified cyanate adhesive in this embodiment includes 100 parts by weight of cyanate resin, 1-100 parts of ethynyl polyimide resin and 1-10 parts of inorganic filler Modifier; wherein the cyanate resin is one or several of bisphenol A cyanate, dicyclopentadiene bisphenol cyanate, bisphenol F cyanate, novolac cyanate A mixture composed in any ratio; the inorganic filler modifier is one of hollow ceramic microspheres, fumed silicon dioxide, bentonite, and nano-silicon carbide, or a mixture of several of them composed in an arbitrary ratio.

specific Embodiment approach 2

[0032] Specific embodiment two: the difference between this embodiment and specific embodiment one is: the structural formula of the ethynyl polyimide resin is:

[0033]

[0034] , where the degree of polymerization n is 1-9, Ar 1 for Ar 2 for Others are the same as in the first embodiment.

specific Embodiment approach 3

[0035]Specific embodiment three: the difference between this embodiment and specific embodiment one or two is that: the ethynyl polyimide resin is prepared according to the following steps: add N,N-dimethyl Acetamide, under a nitrogen atmosphere, add aromatic dianhydride to N,N-dimethylacetamide, add aromatic diamine after stirring for 1 hour, and stir for 1 to 5 hours to obtain a mixed solution; add dimethicone to the mixed solution Ethynylaniline, stirred and reacted for 1-5 hours, wherein the molar ratio of aromatic dianhydride, aromatic diamine and m-ethynylaniline is 1:0.5-0.9:0.2-1; then add toluene, heat up to 120-130°C for reflux reaction 1 to 4 hours; after the solution has dropped to room temperature, add it dropwise into absolute ethanol, precipitate for 1 hour and then filter, wash the precipitate with 80°C absolute ethanol for 3 times, and dry at 130°C to 140°C to obtain ethynyl Polyimide resin; wherein the mass ratio of N,N-dimethylacetamide and toluene is 10:3, ...

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Abstract

The invention provides an acetenyl polyimide modified cyanate ester adhesive and a preparation method thereof, and relates to a cyanate ester adhesive and a preparation method thereof, aiming at solving the problems of poor heat stability and insufficient toughness of the existing cyanate ester adhesive. The adhesive comprises cyanate ester resin, acetenyl polyimide resin and an inorganic filler modifier. The method comprises the following steps: 1, heating cyanate ester resin; 2, adding acetenyl polyimide resin to a polar solvent, heating, agitating to dissolve to obtain a mixture, maintaining the temperature and adding the mixture to cyanate ester resin, agitating, and then performing reduced pressure distillation to remove a solvent to obtain a copolymer; and 3, adding the inorganic filler modifier to the copolymer under the agitating state, and then agitating to obtain the adhesive. The adhesive is high in heat stability and toughness, and applicable to the field of adhesives.

Description

technical field [0001] The invention relates to a cyanate adhesive and a preparation method thereof. Background technique [0002] Adhesives have been widely used in various industries, and bonding technology has become one of the three major connection technologies. With the development of research and application technology in aerospace and other industries, the Mach number of high-speed aircraft is increasing year by year, which puts forward new requirements for the temperature resistance level of polymer materials. At the same time, in order to improve the wave-transmitting performance of the airborne radome, higher requirements are put forward for the dielectric properties of polymer materials including adhesives, such as the requirement to display low dielectric constant and low dielectric loss tangent in the GHz band region. Dielectric characteristics. [0003] Since the cyanate resin can generate a triazine ring structure under the action of heat or a catalyst, the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J179/04C09J11/04C08G81/00C08G73/10
Inventor 刘长威王德志曲春艳李洪峰杨海东张扬宿凯冯浩
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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