Crystalline silicon solar cell diffusion dead layer removing method
A technology of crystalline silicon solar cells and diffusion dead layer, which is applied in the direction of circuits, photovoltaic power generation, electrical components, etc., can solve the problems of destroying diffusion junctions, unstable efficiency, and difficulty in ensuring uniformity, achieve uniform junction depth, and increase open circuit voltage and the effect of short-circuit current
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0016] Configure the cleaning solution for removing the dead layer: pure water: 98L, NaClO solution with a mass percent content of 10%: 2kg.
[0017] Soak the polysilicon wafer after removing the phosphorus-silicate glass with the above-mentioned cleaning solution for removing the dead layer, the temperature is 10° C., and the soaking time is 200 s.
[0018] The above-mentioned polycrystalline silicon wafer after removing the dead layer was cleaned with 3% by mass HF aqueous solution, the cleaning temperature was 10° C., and the cleaning time was 300 s.
[0019] The test results of Example 1 are shown in Table 1.
[0020] Table 1
[0021] Average sheet resistance open circuit voltage short circuit current Series resistance fill factor conversion efficiency Before going to the dead layer 89Ω / □ 0.6266V 8.6359A 0.0024Ω 78.56% 17.47% After removing the dead layer 93Ω / □ 0.6280V 8.6536A 0.0025Ω 78.70% 17.58%
Embodiment 2
[0023] Configure dead layer cleaning solution: pure water: 99L, NaBrO 4 : 1kg.
[0024] Soak the single-crystal silicon wafer after removing the phosphorous-silicate glass with the cleaning solution for removing the dead layer, the temperature is 30°C, and the soaking time is 5s.
[0025] The above-mentioned single crystal silicon wafer after removing the dead layer was cleaned with 10% by mass HF aqueous solution, the cleaning temperature was 30° C., and the cleaning time was 5 s.
[0026] The test results of Example 2 are shown in Table 2.
[0027] Table 2
[0028] Average sheet resistance open circuit voltage short circuit current Series resistance fill factor conversion efficiency Before going to the dead layer 73Ω / □ 0.6364V 5.7841A 0.0043Ω 79.58% 18.92% After removing the dead layer 79Ω / □ 0.6369V 5.8591A 0.0053Ω 78.80% 18.99%
Embodiment 3
[0030] Configure the cleaning solution for removing the dead layer: pure water: 94L, NaClO solution with a mass percent content of 10%: 6kg.
[0031] Soak the polysilicon wafer after removing the phosphorus-silicate glass with the cleaning solution for removing the dead layer, the temperature is 25°C, and the soaking time is 20s.
[0032] The above-mentioned polycrystalline silicon wafer after the dead layer was removed was cleaned with 7% by mass HF aqueous solution, the cleaning temperature was 20° C., and the cleaning time was 25 s.
[0033] The test result of embodiment 3 is shown in table 3.
[0034] table 3
[0035] Average sheet resistance open circuit voltage short circuit current Series resistance fill factor conversion efficiency Before going to the dead layer 87Ω / □ 0.6266V 8.5832A 0.0022Ω 78.82% 17.42% After removing the dead layer 90Ω / □ 0.6279V 8.6211A 0.0024Ω 78.77% 17.52%
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com