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A kind of TPU hot-melt adhesive film with low melting point and high adhesive strength and preparation method thereof

A hot-melt adhesive film and raw material technology, which is applied in the direction of polymer adhesive additives, non-polymer adhesive additives, adhesives, etc., can solve the problems of poor bonding strength and high melting point, and achieve long-lasting bonding and good adhesion. Simple process, high moisture permeability and high hydrostatic pressure resistance

Active Publication Date: 2016-12-07
DONGGUAN XIONGLIN NEW MATERIAL TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it has been found in actual production that the bonding strength of this TPU film attached to fabrics, shoe materials and bags by using an environmentally friendly hot-melt method is poor, and the melting point is high.

Method used

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  • A kind of TPU hot-melt adhesive film with low melting point and high adhesive strength and preparation method thereof
  • A kind of TPU hot-melt adhesive film with low melting point and high adhesive strength and preparation method thereof
  • A kind of TPU hot-melt adhesive film with low melting point and high adhesive strength and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] A TPU hot-melt adhesive film with low melting point and high adhesive strength, which is mainly prepared from the following raw materials in parts by weight:

[0035]

[0036] The tackifier is petroleum resin.

[0037] The filler is kaolin.

[0038] The thickness of the adhesive film is 0.03-2mm, and the thickness of the adhesive film is uniform, which can be changed according to the bonding needs of the thickness of the composite board.

[0039] The preparation method of TPU hot-melt adhesive film with low melting point and high adhesive strength as described above, said method comprises the steps:

[0040] (1) Drying each raw material of the formulation amount at 80-100°C;

[0041] (2) Extrude the dried raw material, cool it, take it up, pack it, and obtain the TPU hot-melt adhesive film.

[0042] Among them, extruder is used for extrusion, and the barrel temperature of the extruder is: 120°C, 127°C, 155°C, 155°C, 147°C and 140°C, and the die head temperature is...

Embodiment 2

[0044] A TPU hot-melt adhesive film with low melting point and high adhesive strength, which is mainly prepared from the following raw materials in parts by weight:

[0045]

[0046] The tackifier is petroleum resin and rosin resin.

[0047] The filler is polytetrafluoroethylene powder.

[0048] The thickness of the adhesive film is 0.03-2mm, and the thickness of the adhesive film is uniform, which can be changed according to the bonding needs of the thickness of the composite board.

[0049] The preparation method of TPU hot-melt adhesive film with low melting point and high adhesive strength as described above, said method comprises the steps:

[0050] (1) Drying each raw material of the formulation amount at 80-100°C;

[0051] (2) Extrude the dried raw material, cool it, take it up, pack it, and obtain the TPU hot-melt adhesive film.

[0052] Among them, extruder is used for extrusion, and the barrel temperature of the extruder is: 120°C, 127°C, 155°C, 155°C, 147°C an...

Embodiment 3

[0054] A TPU hot-melt adhesive film with low melting point and high adhesive strength, which is mainly prepared from the following raw materials in parts by weight:

[0055]

[0056]

[0057] The tackifier is acrylic modified rosin, terpene resin, phenolic resin, terpene-phenolic resin and terpene phenolic resin.

[0058]The filler is an organic filler and an inorganic filler, the inorganic filler is selected from calcium carbonate and kaolin, and the organic filler is selected from polytetrafluoroethylene powder, polyphenylene sulfide and polyethersulfone powder.

[0059] The thickness of the adhesive film is 0.03-2mm, and the thickness of the adhesive film is uniform, which can be changed according to the bonding needs of the thickness of the composite board.

[0060] The preparation method of TPU hot-melt adhesive film with low melting point and high adhesive strength as described above, said method comprises the steps:

[0061] (1) Drying each raw material of the fo...

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Abstract

The invention provides a TPU hot-melt adhesive film, which is mainly prepared from the following raw materials in parts by weight: 100 parts of thermoplastic polyurethane, 30-50 parts of thermoplastic polyester with a melting point of 90-105°C, and 10-30 parts of tackifier 5-25 parts of fillers and 5-30 parts of functional additives. The hot-melt adhesive film prepared by the invention is a thermoplastic adhesive with uniform thickness and simple bonding process, which is suitable for automatic production line bonding and high production efficiency; the peeling strength after bonding is large, and it can withstand water in harsh outdoor environments. , heat resistance, salt spray aging resistance, long-lasting bonding, which significantly improves the bonding strength attached to the fabric.

Description

technical field [0001] The invention relates to a TPU hot-melt adhesive film with a low melting point and high bonding strength and a preparation method thereof. Background technique [0002] Hot melt adhesives currently used in the market include ethylene-vinyl acetate copolymer (EVA), polyamide (PA), copolyester (PET), polyethylene (PE) and polyurethane (PU). Melt adhesive pellets, hot melt adhesive powder, hot melt adhesive sticks and hot melt adhesive films, these hot melt adhesive products are widely used in industries such as automobiles, electronics, construction, light industry and textiles. For the bonding between materials in the form of large-scale lamination, hot-melt adhesive films are widely used due to their high efficiency and convenient construction. [0003] Polyurethane hot-melt adhesive film has the advantages of convenient positioning and high peel strength. It is a hot-melt adhesive with excellent adhesion and sealing performance. It has developed rapi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/00C09J175/04C09J167/00C09J11/08C09J11/04
Inventor 王一良何建雄
Owner DONGGUAN XIONGLIN NEW MATERIAL TECH
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