High-adhesion-property low-linear-expansion-coefficient polyimide film material and preparation method thereof

A technology of polyimide film and linear expansion coefficient, which is applied in the field of polymer material synthesis, can solve the problems of poor adhesion, oligoimide, and can only be reached, and achieves improved adhesion performance and low thermal expansion coefficient. , the effect of good dimensional stability

Inactive Publication Date: 2015-01-14
JILIN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the application process of polyimide, it is often encountered that polyimide falls off from the surface of the substrate (substrate), and situations such as poor bonding occur, which seriously affects the service life of the polyimide material, and Some unnecessary economic losses have been caused. In order to solve such problems, heteroatoms such as O, S, N, P, etc. can be introduced into the polyimide main chain; cyano group; it can also appropriately increase the proportion of flexible groups in the main chain of polyimide to properly improve the adhesion problem, while ensuring other excellent properties of polyimide, such as thermal stability, chemical stability, mechanical performance etc. is not compromised
[0004] In recent years, polyimide has begun to show its potential and wide application value in the field of flexible printed circuit board (FPC) and self-adhesive tape (TAB) technolog

Method used

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  • High-adhesion-property low-linear-expansion-coefficient polyimide film material and preparation method thereof
  • High-adhesion-property low-linear-expansion-coefficient polyimide film material and preparation method thereof
  • High-adhesion-property low-linear-expansion-coefficient polyimide film material and preparation method thereof

Examples

Experimental program
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Example Embodiment

[0052] Example 1

[0053] 1) Preparation of nitro compounds

[0054] In a 500ml three-necked flask equipped with an electric stirring device, a condenser, a water device, and a nitrogen protection device, 18.6207g (0.1mol) of biphenol and 38.3384g of 2-chloro-5-nitrobenzonitrile ( 0.21mol), anhydrous K2CO 3 16.5847g (0.12mol), 141ml DMF (the percentage of the total weight of the raw material monomer to the weight of the whole material is 30%, that is, the solid content) and 20ml of toluene, the initial reaction temperature is 135~140℃, with water for 2~3h, gradually heating up When the reaction temperature is 150~155℃, continue the reaction for 4~6h, filter while hot and discharge into ice ethanol to obtain a large amount of bright yellow precipitate. After filtering, wash the crude product in deionized water 3~4 times until the filtrate is basically Until clarification, reflux in hot ethanol for 2 to 3 hours to remove organic impurities, recrystallize in DMSO solvent, filter, coo...

Example Embodiment

[0060] Example 2

[0061] According to the operation of preparing the nitro compound in Example 1, the anhydrous K 2 CO 3 The input amount increased to 20.7g (0.15mol), and the other conditions remained unchanged, the product 1,4-bis(4-nitro-2cyanophenoxy)biphenyl was obtained. The characterization results of the product were the same as those of the nitro compound in Example 1. The characterization results are consistent.

Example Embodiment

[0062] Example 3

[0063] According to the operation of preparing the nitro compound in Example 1, only the amount of DMF added was changed to 112ml (the solid content of the system was increased from 30% to 35%) to obtain the product 1,4-bis(4-nitro-2 cyano The characterization result of phenoxy)biphenyl is consistent with the characterization result of the nitro compound in Example 1.

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Abstract

The invention relates to a high-adhesion-property low-linear-expansion-coefficient polyimide film material and a preparation method thereof, belonging to the technical field of high polymer material synthesis. The main chain of the polyimide contains cyano group, and is a homopolymerized or copolymerized polyimide polymer of a rigid chain; and thus, the polyimide has higher adhesion property and low linear expansion coefficient. The preparation method comprises the following steps: synthesizing cyano-introduced amino monomer containing rigid structure; and carrying out polycondensation on the synthesized amino monomer or with other diamine monomers containing rigid structure and acid anhydride monomer to obtain the polyimide film. The polyimide film material has higher adhesion property and lower linear expansion coefficient, so that the adhesion property and linear expansion coefficient are optimal, and the mechanical property and heat stability of the polyimide are obviously improved. The polyimide film material can be used in field of high-adhesion-property materials and provide low linear expansion coefficient.

Description

technical field [0001] The invention belongs to the technical field of polymer material synthesis, and in particular relates to the preparation of polyimide with high adhesion and low coefficient of linear expansion. Background technique [0002] Polyimide is a promising polymer material. After decades of development, it has a wide variety and various forms. Compared with other heterocyclic compounds, polyimide has a wide range of raw material sources and diverse synthetic routes. , more comprehensive functions, etc., and because of its outstanding thermal properties, polyimide meets the needs of aerospace technology for high temperature resistant, lightweight structural materials, in addition, polyimide also has excellent mechanical properties , good chemical stability, extremely low temperature resistance, good film-forming properties, various synthesis methods, safety, and non-toxic properties. These properties make polyimides have a wide range of applications, involving ...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08G73/10
CPCC08G73/1003C08J5/18C08J2379/08C08L79/08C08L2201/08C08L2203/16
Inventor 刘佰军沈艳超井丽巍姜振华
Owner JILIN UNIV
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