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Preparation method of electronic packaging silicon carbide reinforced aluminum-based composite material

A composite material and reinforced aluminum-based technology, applied in metal material coating process, liquid chemical plating, coating, etc., can solve problems such as failure and overheating, achieve compact structure, improve application prospects, and improve wettability Effect

Inactive Publication Date: 2015-03-25
NANCHANG HANGKONG UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The purpose of the present invention is to propose a method for preparing a silicon carbide reinforced aluminum matrix composite material for electronic packaging, so as to solve the problem of failure caused by overheating in current electronic packaging products

Method used

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  • Preparation method of electronic packaging silicon carbide reinforced aluminum-based composite material
  • Preparation method of electronic packaging silicon carbide reinforced aluminum-based composite material

Examples

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Embodiment 1

[0022] (1) SiCp particles with a particle size of about 100 μm are selected as raw materials. First, roughen the SiCp particles, pickle the surface of the particles with an aqueous solution of HF acid with a volume fraction of 20%; then perform sensitization treatment, the formula of the sensitization solution is: 20g / l stannous chloride, 38% concentrated hydrochloric acid The volume fraction is 4%, and the solvent is distilled water. Take the preparation of 500ml sensitizing solution as an example, add 10g of stannous chloride to 20ml of 37% concentrated hydrochloric acid, then add it to distilled water for dilution, and keep stirring to obtain a clear solution. After the sensitization solution was prepared, the coarsened SiCp particles were added and stirred for 10 min. Then carry out activation treatment, the activation solution formula is: 5g / l silver nitrate, appropriate amount of ammonia water (adjust the solution to be clear), and the solvent is distilled water. Take ...

Embodiment 2

[0028](1) SiCp particles with a particle size of about 150 μm are selected as raw materials and pretreated. First, roughen the SiCp particles, pickle the surface of the particles with an aqueous solution of HF acid with a volume fraction of 20%, and then perform sensitization treatment. The formula of the sensitization solution is: stannous chloride 15g / l, 38% concentrated hydrochloric acid The volume fraction is 6%, and the solvent is distilled water. Taking the preparation of 500ml sensitizing solution as an example, add 7.5g of stannous chloride to 30ml of 37% concentrated hydrochloric acid, then add it to distilled water for dilution, and keep stirring to obtain a clear solution. After the sensitization solution was prepared, the coarsened SiCp particles were added and stirred for 12 minutes. Then carry out activation treatment, the activation solution formula is: 6g / l silver nitrate, appropriate amount of ammonia water (adjust the solution to be clear), and the solvent i...

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Abstract

Disclosed is a preparation method of an electronic packaging silicon carbide reinforced aluminum-based composite material. The method comprises, firstly, performing pretreatment of coarsening, sensitization, activation, dispergation and drying on the surface of silicon carbide particles (SiCp); secondly, plating copper onto the surface of the SiCp at a PH value of 11-12.5 and a temperature of 35-47 DEG C with a plating solution composed of 5-12.5 g / l copper sulfate, 10-20 g / l EDTA (ethylene diamine tetraacetic acid), 5-15 g / l potassium sodium tartrate, formaldehyde with a volume fraction of 1.2-1.5% and methanol with a volume fraction of 0.7-0.9%; thirdly, preparing the aluminum-based composite material with a volume fraction of the SiCp of 50-55% through pressure-free infiltration. The preparation method of the electronic packaging silicon carbide reinforced aluminum-based composite material is simple in process and environmentally friendly; the prepared electronic packaging silicon carbide reinforced aluminum-based composite material is high in specific strength, specific stiffness and abrasive resistance and low in thermal expansion coefficients and greatly improves the thermal conductivity, thereby well solving the problem that electronic packaging materials are too high in temperature to result in effect failure of electronic elements.

Description

technical field [0001] The invention relates to the preparation of a metal-based composite material, in particular to a method for preparing a silicon carbide-reinforced aluminum-based composite material for electronic packaging, and the method belongs to the technical field of metal materials. Background technique [0002] Silicon carbide reinforced aluminum matrix composite (SiCp / Al) is a kind of ceramic particle reinforced metal matrix composite material, which has the excellent properties of both metal and ceramic. The main advantages of SiCp / Al are high specific strength, specific stiffness, wear resistance, low expansion, high thermal conductivity, and it has been widely used in many different fields. Due to its high wear resistance, SiCp / Al composite materials are used in the manufacture of automobile brake discs, brake rotors, engine pistons, etc. in the automotive industry; due to their high specific strength and specific stiffness, they are used in the aerospace fi...

Claims

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Application Information

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IPC IPC(8): C22C1/10C22C1/02C22C21/00C23C18/38C25D3/38
Inventor 李多生郜友彬周贤良左敦稳华小珍俞应炜邹爱华叶志国董应虎陈庆军
Owner NANCHANG HANGKONG UNIVERSITY
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