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High-performance heat conduction material

A heat-conducting material and high-performance technology, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems of low thermal conductivity and achieve the effects of high gas permeability, high compressibility, and small viscosity-temperature coefficient

Inactive Publication Date: 2015-04-22
HUIZHOU KINGBALI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

General-purpose thermal conductive materials are easy to process and shape, and the price is low, but the thermal conductivity is low

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] 1. Formula, in parts by weight: 35 parts of silicone resin, 42 parts of hexagonal boron nitride, 14 parts of alumina, 5 parts of graphene, 0.8 parts of platinum catalyst, 1 part of hydrogen-containing silicone oil with a hydrogen content of 0.8%, silane Preparation of 17 parts of coupling agent, 4 parts of organosiloxane surface modifier, 3 parts of silicone oil, 168 7 parts of antioxidant;

[0019] 2. Preparation:

[0020] (1) Heat hexagonal boron nitride and organosiloxane surface modifier to 190°C while stirring;

[0021] (2) Pre-mix half of the alumina and silane coupling agent, and stir in a high-speed disperser at a speed of 1000r / min for 5~10min; then add the mixed material in step (1), continue stirring for 5min, and heat up to 200 ℃, add silicone oil and continue to stir for 5 minutes;

[0022] (3) Dry the graphene at a vacuum of 0.06MPa for 5 minutes, add the remaining silane coupling agent to disperse and stir at a speed of 800r / min for 8 minutes, add silic...

Embodiment 2

[0025] 1. Formula, in parts by weight: 44 parts of silicone resin, 45 parts of hexagonal boron nitride, 16 parts of alumina, 6 parts of graphene, 0.7 parts of platinum catalyst, 2 parts of hydrogen-containing silicone oil with a hydrogen content of 0.5%, silane 21 parts of coupling agent, 5 parts of organosiloxane surface modifier, 3 parts of silicone oil, 8 parts of antioxidant 168;

[0026] 2. Preparation: (1) Heat hexagonal boron nitride and organosiloxane surface modifier to 200°C while stirring and mixing;

[0027] (2) Pre-mix half of the alumina and silane coupling agent, and stir in a high-speed disperser at a speed of 1200r / min for 5~10min; then add the mixed material in step (1), continue stirring for 5min, and heat up to 210 ℃, add silicone oil and continue to stir for 5 minutes;

[0028] (3) Dry the graphene at a vacuum of 0.06MPa for 5 minutes, add the remaining silane coupling agent to disperse and stir at a speed of 1000r / min for 8 minutes, add silicone resin, p...

Embodiment 3

[0031] 1. Formula, in parts by weight: 40 parts of silicone resin, 30 parts of hexagonal boron nitride, 18 parts of aluminum oxide, 3 parts of graphene, 0.2 parts of platinum catalyst, 1 part of hydrogen-containing silicone oil with a hydrogen content of 0.5%, silane 10 parts of coupling agent, 3 parts of organosiloxane surface modifier, 1 part of silicone oil, 5 parts of antioxidant 168;

[0032] 2. Preparation: (1) Heat hexagonal boron nitride and organosiloxane surface modifier to 180°C while stirring and mixing;

[0033] (2) Pre-mix half of the alumina and silane coupling agent, and stir in a high-speed disperser at a speed of 1000r / min for 5~10min; then add the mixed material in step (1), continue stirring for 5min, and heat up to 200 ℃, add silicone oil, and continue to stir for 5 minutes;

[0034] (3) Dry the graphene at a vacuum of 0.06MPa for 5 minutes, add the remaining silane coupling agent to disperse and stir at a speed of 800r / min for 8 minutes, add silicone res...

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Abstract

The invention discloses a high-performance heat conduction material. The high-performance heat conduction material contains organic silicon resin, hexagonal boron nitride, aluminum oxide, graphene, platinum catalyst, hydrogen-containing silicone oil with hydrogen content of 0.5 to 0.8 percent, silane coupling agent, organosiloxane surface modifier, organic silicone oil and antioxidant 168; the organic silicon resin is low in surface tension, small in viscosity-temperature coefficient, high in compressibility and high in gas permeability, and the hexagonal boron nitride is high in precision and excellent in heat conduction performance and heat radiation performance, so that when the hexagonal boron nitride material is used for preparing an LED heat radiator, a high effect of heat resistance transfer and heat radiation for the LED can be realized; the hexagonal boron nitride and the aluminum oxide are used as heat conduction fillers, so that the cost performance is high; the graphene and the heat conduction fillers are combined with organic silicon resin in the formula, so that the reaction performance of the hexagonal boron nitride in the preparation process can be enhanced through the surface modifier, the compatibility and mechanical properties among the materials can be coordinately improved by virtue of the coupling agent, hydrogen-containing silicone oil and other additives, and a product with high quality and high performance can be obtained.

Description

technical field [0001] The invention relates to an organosilicon polymer material and a preparation method thereof, in particular to a high-performance heat-conducting material and a preparation method thereof, and belongs to the technical field of polymer materials. Background technique [0002] Silicone products are based on silicon-oxygen (Si-O) bonds as the main chain structure, so silicone products have the characteristics of high thermal stability, high weather resistance, electrical insulation performance, low surface tension and low surface energy, and physiological inertia. , due to the above-mentioned excellent properties of silicone, its application range is very wide. It is not only used as a special material in aviation, cutting-edge technology, and military technology departments, but also in various sectors of the national economy. Its application range has expanded to: construction, electronics, textiles, automobiles, machinery, leather and paper, chemical in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04C08L83/05C08K13/06C08K9/06C08K3/38C08K3/22C08K3/04C08K5/526C09K5/14
Inventor 杨永佳张彦兵杨小义
Owner HUIZHOU KINGBALI TECH
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