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A preparation method of three-dimensional microelectrodes for supercapacitors based on carbonization

A technology of supercapacitors and microelectrodes, applied in the field of microelectromechanical systems, can solve the problems of limited capacity space of microsupercapacitors, and achieve the effects of being conducive to integration, increasing the number of mesopores, and large production capacity

Inactive Publication Date: 2018-01-19
TAIYUAN UNIV OF TECH
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Problems solved by technology

[0005] In order to solve the problem of limited capacitance space of the existing micro-supercapacitor, the present invention provides a method for preparing a three-dimensional microelectrode of a supercapacitor based on carbonization

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  • A preparation method of three-dimensional microelectrodes for supercapacitors based on carbonization
  • A preparation method of three-dimensional microelectrodes for supercapacitors based on carbonization

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Embodiment Construction

[0018] A method for preparing a three-dimensional microelectrode of a supercapacitor based on carbonization, comprising the following steps:

[0019] (1) Select the silicon wafer as the substrate, wash the silicon wafer in xylene, acetone, alcohol, sulfuric acid / hydrogen peroxide, ammonia / hydrogen peroxide, hydrochloric acid / hydrogen peroxide solution to remove oil, oxide film and metal ions, and then dry;

[0020] (2) Evenly spin-coat SU-8 photoresist on the surface of the silicon wafer after cleaning and drying, and the thickness of SU-8 photoresist reaches 200-500 μm;

[0021] (3) Pre-baking, exposing, post-baking and developing the SU-8 photoresist to obtain a columnar array structure;

[0022] (4) Put the obtained array structure into a muffle furnace for carbonization. During the carbonization process, the temperature, heating rate and cooling rate are set as follows: First, it takes 240 minutes to raise the temperature from room temperature to 450°C, and the heating rat...

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Abstract

The invention relates to the technical field of micro-electromechanical systems, specifically a method for preparing a three-dimensional micro-electrode of a supercapacitor based on carbonization, comprising the following steps: (1) cleaning and drying the silicon wafer; (2) uniformly spin-coating SU on the surface of the silicon wafer ‑8 photoresist; (3) The photoresist is subjected to a photolithography process to obtain an array structure; (4) The photoetched array structure is put into a muffle furnace for carbonization to obtain a SU‑8 glue carbonized electrode. In this method, from the perspective of process design, the specific surface area of ​​the electrode array structure is increased by increasing the number and quality of mesopores. This method is simple, feasible and easy to operate. Secondly, the use of carbonization technology can not only enhance the stability of the electrode, but also improve the electrical conductivity, which lays the foundation for subsequent integration, packaging and utilization. Finally, the process has high precision, low equipment investment cost, and large production capacity, which can meet the market's large-scale production needs.

Description

technical field [0001] The invention relates to the technical field of micro-electro-mechanical systems, in particular to a method for preparing a three-dimensional micro-electrode of a supercapacitor based on carbonization. Background technique [0002] With the advancement of information technology, high-end electronic equipment is developing in the direction of miniaturization, portability, and long life. Capacitors in electronic equipment are required to have large capacity, high power density, and small size. However, traditional micro batteries have disadvantages such as low charge and discharge efficiency, limited number of cycles, no high-power charge and discharge capability, and poor safety. Therefore, the development of micro-supercapacitors with the characteristics of large pulse discharge power, small size, high efficiency, fast charging speed, and good cycle performance has become a research hotspot at home and abroad, with urgent application needs and broad ma...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G11/34
CPCY02E60/13
Inventor 李刚赵清华胡杰李朋伟张文栋李大维桑胜波菅傲群段倩倩
Owner TAIYUAN UNIV OF TECH
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