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A kind of polymer composite glue

A high-molecular polymer and composite adhesive technology, which is used in the preparation of non-polymer adhesive additives, polyurea/polyurethane adhesives, animal glue or gelatin, etc. Low damage, shortened drying time, improved bond fastness

Inactive Publication Date: 2016-07-20
广西福宁工贸有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this adhesive will release a large amount of free formaldehyde for a long time during use, thus causing great harm to the health of users.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] A kind of polymer composite glue, is made up of following composition of weight part:

[0030] Polyvinyl alcohol (30%) 65 parts

[0031] 15 parts gelatin

[0032] 15 parts of p-diazodiphenylamine paraformaldehyde condensate

[0033] Polyisocyanate block 5 parts

[0034] Silicone modified polyurethane resin 15 parts

[0035] Trimethylolethane 15 parts

[0036] 3 parts of styryl pyridinium sulfate dimethyl ester salt

[0037] 2 parts n-butyraldehyde

[0038] 8 parts curing agent

[0039] Propylene glycol monomethyl ether acetate 1 part

[0040] 1 part polyvinyl butyral

[0041] 7 parts of ethylamine boron trifluoride salt

[0042] 3 parts benzyldimethylamine

[0043] 8 parts lead molybdate

[0044] 0.2 parts of 4-tert-butylcyclohexanone

[0045] 0.2 parts of 2-heptanone

[0046] Silicone defoamer 2 parts

[0047] 0.05 parts of vitamin A

[0048] 50-parts of solvent.

Embodiment 2

[0050] A kind of polymer composite glue, is made up of following composition of weight part:

[0051] Polyvinyl alcohol (30%) 80 parts

[0052] 20 parts gelatin

[0053] 30 parts of p-diazodiphenylamine paraformaldehyde condensate

[0054] Polyisocyanate block 15 parts

[0055] Silicone modified polyurethane resin 25 parts

[0056] Trimethylolethane 20 parts

[0057] 6 parts of styrylpyridine sulfate dimethyl salt

[0058] 8 parts of n-butyraldehyde

[0059] 12 parts of curing agent

[0060] Propylene glycol monomethyl ether acetate 4 parts

[0061] 4 parts polyvinyl butyral

[0062] 15 parts of ethylamine boron trifluoride salt

[0063] 6 parts of benzyldimethylamine

[0064] 10 parts lead molybdate

[0065] 0.5 parts of 4-tert-butylcyclohexanone

[0066] 0.5 parts of 2-heptanone

[0067] Silicone defoamer 5 parts

[0068] Vitamin A1.0 parts

[0069] 100 parts of solvent.

Embodiment 3

[0071] A kind of polymer composite glue, is made up of following composition of weight part:

[0072] Polyvinyl alcohol (30%) 70 parts

[0073] 16 parts gelatin

[0074] 18 parts of p-diazodiphenylamine paraformaldehyde condensate

[0075] 10 parts of polyisocyanate block

[0076] Silicone modified polyurethane resin 10 parts

[0077] Trimethylolethane 18 parts

[0078] 4 parts of styrylpyridine sulfate dimethyl salt

[0079] 6 parts of n-butyraldehyde

[0080] 10 parts curing agent

[0081] Propylene glycol monomethyl ether acetate 2 parts

[0082] 3 parts polyvinyl butyral

[0083] 9 parts of ethylamine boron trifluoride salt

[0084] 5 parts of benzyldimethylamine

[0085] 9 parts lead molybdate

[0086] 0.4 parts of 4-tert-butylcyclohexanone

[0087] 0.3 parts of 2-heptanone

[0088] Silicone defoamer 23 parts

[0089] 0.5 parts of vitamin A

[0090] 80 parts of solvent.

[0091] The curing agent described in the above Examples 1-3 is low molecular weight p...

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PUM

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Abstract

The invention relates to a high-molecular polymer complex adhesive. The high-molecular polymer complex adhesive is prepared from the following ingredients: polyvinyl alcohol (30%), gelatin, p-diazo diphenylamine paraformaldehyde condensation compound, polyisocyanate block polymer, organic silicon modified polyurethane resin, trimethylolethane, styryl pyridine dimethyl sulfate salt, n-butanal, curing agent, propylene glycol monomethyl ether acetate, polyvinyl butyral, ethylamine boron trifluoride salt, benzyl dimethylamine, lead molybdate, solvent, 4-tert-butylcyclohexanone, silicone defoamer and vitamin A. The high-molecular polymer complex adhesive disclosed by the invention is strong in binding force, and excellent in chemical resistance and rubbing resistance; the tensile property of the complex adhesive is improved and the service life of the complex adhesive is prolonged by adding the organic silicon modified polyurethane resin.

Description

technical field [0001] The invention relates to a high molecular polymer composite glue. Background technique [0002] With the rapid development of the real estate industry and the significant improvement of people's living standards, the amount of adhesives used in the construction and decoration industry has increased significantly. At the same time, producers and users of adhesives have higher and higher requirements for health and environmental protection. Because urea-formaldehyde resin adhesive has low price, good process performance and good cementation performance, it currently occupies a dominant position in the market. However, this adhesive will release a large amount of free formaldehyde for a long time during use, thus causing great harm to the health of users. Therefore, we continue to develop an environmentally friendly adhesive with excellent process performance, cementation performance, and weather resistance, which does not release formaldehyde and has l...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J129/04C09J189/00C09J159/00C09J175/04C09J129/14C09J11/04C09J11/06
Inventor 陈国荣
Owner 广西福宁工贸有限公司