Tungsten powder surface copper plating method

A tungsten powder and copper plating technology, applied in liquid chemical plating, coating, metal material coating process and other directions, can solve the problems of slow copper plating, uneven plating, and not firm, and improve the plating performance, reduction of coating brittleness and stress, effect of accelerating deposition rate

Active Publication Date: 2015-08-12
KUNMING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This method solves the problems of slow copper plating speed, uneven plating layer, non-dense, not firm and other problems in the process of copper-coated powder in the prior art, and the present invention is realized through the following technical solutions

Method used

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  • Tungsten powder surface copper plating method

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Experimental program
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Effect test

Embodiment 1

[0029] The method for copper plating on the surface of the tungsten powder comprises the following steps:

[0030] Step 1. First, carry out surface pretreatment on the tungsten powder. The particle size of the tungsten powder is 7 μm. Ultrasonic waves are applied during the pretreatment process. The frequency of the ultrasonic waves is 20KHz, and the unit power factor range is 0.5W / cm 2 , the specific operation of tungsten powder surface pretreatment is as follows:

[0031] (1) Degreasing: put the tungsten powder in 10wt.% sodium hydroxide solution and boil for 10 minutes according to the liquid-solid ratio of 1:30l / g, so that the oil and alkali can fully undergo saponification reaction, filter and wash twice with distilled water;

[0032] (2) Coarsening: Boil the degreased tungsten powder in 30wt.% nitric acid for 20 minutes according to the liquid-solid ratio of 1:30l / g, and wash it twice with distilled water after filtering;

[0033] (3) Sensitization: SnCl 2 2H 2 O and ...

Embodiment 2

[0040] The method for copper plating on the surface of the tungsten powder comprises the following steps:

[0041] Step 1. First, carry out surface pretreatment on the tungsten powder. The particle size of the tungsten powder is 10 μm. Ultrasonic waves are applied during the pretreatment process. The frequency of the ultrasonic waves is 40KHz, and the unit power factor range is 2W / cm 2 , the specific operation of tungsten powder surface pretreatment is as follows:

[0042] (1) Degreasing: put the tungsten powder in 10wt.% sodium hydroxide solution and boil for 10 minutes according to the liquid-solid ratio of 1:100l / g, so that the oil and alkali can fully saponify, filter and wash with distilled water for 3 times;

[0043] (2) Coarsening: Boil the degreased tungsten powder in 30wt.% nitric acid for 30 minutes according to the liquid-solid ratio of 1:100l / g, filter and wash with distilled water for 3 times;

[0044] (3) Sensitization: SnCl 2 2H 2 O and HCl solution are mixed...

Embodiment 3

[0051] The method for copper plating on the surface of the tungsten powder comprises the following steps:

[0052] Step 1. First, carry out surface pretreatment on the tungsten powder. The particle size of the tungsten powder is 8 μm. Ultrasonic waves are applied during the pretreatment process. The frequency of the ultrasonic waves is 30KHz, and the unit power factor range is 1.5W / cm 2 , the specific operation of tungsten powder surface pretreatment is as follows:

[0053] (1) Degreasing: put the tungsten powder in 10wt.% sodium hydroxide solution and boil for 10 minutes according to the liquid-solid ratio of 1:60l / g, so that the oil and alkali can fully saponify, filter and wash twice with distilled water;

[0054] (2) Coarsening: Boil the degreased tungsten powder in 30wt.% nitric acid for 20 minutes according to the liquid-solid ratio of 1:60l / g, and wash it twice with distilled water after filtering;

[0055] (3) Sensitization: SnCl 2 2H 2 O and HCl solution are mixed ...

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Abstract

The present invention relates to a tungsten powder surface copper plating method, and belongs to the technical field of ultrasonic wave applications and tungsten powder surface plating treatment. The method comprises: carrying out a surface pretreatment on tungsten powder, preparing a mixed solution of a copper sulfate pentahydrate solution, potassium sodium tartrate, and disodium ethylenediaminetetraacetate, adjusting the pH value to 11-13 with a 10 wt.% sodium hydroxide solution, adding sodium thiosulfate to control the sodium thiosulfate concentration at 9-15 mg / L to obtain a chemical electroplating solution, adding the surface pretreated tungsten powder to the chemical electroplating solution to carry out plating, and drying in a vacuum drying oven at a temperature of 90-100 DEG C to obtain the dried and pure copper-plated tungsten powder. With the method of the present invention, the problems of slow copper plating, non-uniform, non-compact and non-solid plating layer, and the like during the powder copper plating process in the prior art are solved.

Description

technical field [0001] The invention relates to a method for copper plating on the surface of tungsten powder, which belongs to the technical field of ultrasonic application and surface plating treatment of tungsten powder. Background technique [0002] With the research of new materials, especially the development of the electronic industry, the copper plating process has been deeply studied and widely used. In the electronics industry, it is widely used in the additive manufacturing of printed circuit boards and multi-layer plate hole metallization. In the research of new materials, it is widely used in the electroplating of non-metallic materials such as plastics and the surface copper plating of powder metallurgy pressed parts. [0003] Tungsten powder has the characteristics of high melting point, high density, high hardness, low saturated vapor pressure, small thermal expansion coefficient, etc., especially tungsten-copper material has excellent resistance to arc ablat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/18C23C18/38B22F1/00B22F1/02
Inventor 许磊顾全超张利波彭金辉夏仡
Owner KUNMING UNIV OF SCI & TECH
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