Preparation method of copper based sliding plate material
A sliding plate, copper-based technology, applied in the field of material science, can solve the problems of high material density of pantograph sliding plates, inability to achieve one step, inconvenient practical application, etc., to achieve excellent arc resistance and mechanical properties, low cost, material composition less effect
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Embodiment 1
[0033] A. After carbon nanotubes, graphite, and titanium silicon carbon are pretreated by wet chemical methods, electroless copper plating is performed. Then, together with the electrolytic copper powder, it is vacuum-dried, agate-milled, and sieved through a No. 9 Pharmacopoeia inspection sieve for use. The weight percentages of raw material components are: electrolytic copper powder 65%, copper-coated carbon nanotubes 10%, copper-coated graphite 10%, copper-coated Ti 3 SiC 2 Powder 15%. Then adopt horizontal ball mill ball mill to make it mix evenly for 3 hours;
[0034] B. Put the above-mentioned uniformly mixed powder into a high-temperature and high-pressure resistant graphite mold, pressurize to a pressure of 80MPa in a vacuum hot-pressing sintering furnace, and simultaneously raise the temperature to 800°C, hold the pressure and keep the temperature for 2 hours;
[0035] C.B Step pressure holding and heat preservation are over, release the pressure immediately, and c...
Embodiment 2
[0054] The method of this example is basically the same as that of Example 1, the difference is only:
[0055] The weight percent of the material combination in the step A is: electrolytic copper powder 5%, copper-plated carbon nanotube 90%, copper-plated graphite 2.5%, copper-plated titanium silicon carbon 2.5%. The milling time is 24 hours.
[0056] The vacuum hot pressing sintering pressure in step B is 120MPa, the temperature is 200°C, and the pressure holding and holding time are 24 hours.
[0057] The heat preservation temperature after pressure relief in step C is 250° C., and the heat preservation time is 24 hours.
Embodiment 3
[0059] The method of this example is basically the same as that of Example 1, the difference is only:
[0060] The weight percent of the material combination in step A is: electrolytic copper powder 90%, copper-plated carbon nanotube 2.5%, copper-plated graphite 2.5%, copper-plated titanium silicon carbon 5%. Ball milling time is 1 hour.
[0061] The vacuum hot pressing sintering pressure in step B is 20MPa, the temperature is 1200°C, and the pressure holding and holding time are 0.5 hours.
[0062] The heat preservation temperature after pressure relief in step C is 1250° C., and the heat preservation time is 0.5 hour.
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