Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A kind of porous low dielectric polyimide film

A polyimide film and polyimide matrix technology, which is applied in the field of organic film preparation, can solve problems such as hindering the development of miniaturization and intelligence of electronic products, signal delay and crosstalk, etc., and achieves easy availability of raw materials and simple raw materials. Effect

Active Publication Date: 2017-12-08
WUXI SHUNXUAN NEW MATERIALS
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In recent years, with the development of ultra-large-scale integrated circuit (ULSL), high-density, high-speed, multi-functional integrated circuits are developing towards small size and high intelligence, but it is easy to cause signal delay and crosstalk, which hinders the development of electronic products to be more miniaturized. Therefore, it is urgent to develop low dielectric constant materials to solve the above problems

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of porous low dielectric polyimide film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] (1) Preparation of calcium carbonate suspension

[0022] Adopt Shanxi Ruicheng Warner Nano Material Co., Ltd. to produce 4.5kg of nano-calcium carbonate with a particle size of 100nm, add the aprotic solvent N, N'-dimethylacetamide (DMAc), under the condition of 40kHz ultrasonic dispersion, stirring speed 2000r / min, fully stirred for 30min to make a stable suspension, ensuring that the mass concentration of the calcium carbonate suspension is 5%.

[0023] (2) Preparation of polyamic acid composite solution

[0024] Add the suspension obtained above into the polyamic acid polymerization reactor, and add a sufficient amount of solvent. Control the temperature at 40°C, add 20kg of ODA, and carry out mechanical stirring. After it is completely dissolved, control the temperature at 60°C, add 21.8kg of PMDA with an equal molar ratio to diamine in batches, and keep stirring to make the two The amine and dianhydride fully react to form a polyamic acid composite solution with ...

Embodiment 2

[0030] (1) Preparation of calcium carbonate and silica suspension

[0031] Adopting Shanxi Ruicheng Warner Nano Material Co., Ltd. to produce 2.5kg of nano-calcium carbonate with a particle diameter of 40nm and 4.5kg of nano-silicon dioxide (produced by West Asia Reagent) with a particle diameter of 40nm, adding the aprotic solvent N, N'-di In methylacetamide (DMAc), under the condition of 60kHz ultrasonic dispersion, the stirring speed is 3000r / min and fully stirred for 60min to make a stable suspension, and the mass concentration of nano-calcium carbonate and silicon dioxide is guaranteed to be 20%.

[0032] (2) Preparation of polyamic acid composite solution

[0033] Add the suspension obtained above into the polyamic acid polymerization reactor, add a sufficient amount of solvent, control the temperature at 10°C, add 20kg of ODA, and carry out mechanical stirring. After it is completely dissolved, control the temperature at 50°C, divide Add 21.8 kg of PMDA in an equimolar...

Embodiment 3

[0039] (1) Preparation of calcium carbonate and silica suspension

[0040] The particle diameter that adopts Shanxi Ruicheng Warner Nano Material Co., Ltd. to produce is 20nm nano-calcium carbonate 1kg, and 10kg particle diameter is the nano-silicon dioxide (produced by West Asia Reagent) of 100nm, add 160kg aprotic solvent N, N'-dimethyl In acetamide (DMAc), under the condition of 100kHz ultrasonic dispersion, the stirring speed is 2000r / min, and the stirring speed is 2000r / min, and it is fully stirred for 60min to make a stable suspension, and the mass concentration of calcium carbonate and silicon dioxide is guaranteed to be 15%.

[0041] (2) Preparation of polyamic acid composite solution

[0042] Add the suspension obtained above into the polyamic acid polymerization reactor, and add a sufficient amount of solvent. Control the temperature at 25°C, add 16kg of ODA and 4kg of MDA, and carry out mechanical stirring. After they are completely dissolved, control the temperatu...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
Login to View More

Abstract

The invention belongs to the field of organic film preparation, and relates to a porous low-dielectric polyimide film. The porous low-dielectric polyimide film is composed of a polyimide matrix and a reinforcing filler, wherein the mass fraction of the polyimide matrix is ​​80-100 wt%, and the mass fraction of the reinforcing filler is 0%-20 wt%. The present invention uses calcium carbonate as the raw material of the pore-forming agent, and removes the calcium carbonate with dilute hydrochloric acid to obtain a porous film. The raw material is simple and easy to obtain, and does not require complicated operations; at the same time, the pore size of the film can be directly controlled by controlling the content and particle size of the calcium carbonate and porosity to prepare a variety of porous low-dielectric polyimide films with excellent properties. The thin film provided by the invention has excellent properties, and can be applied to base materials in the electrical and electronic industries, and is especially suitable for electronic materials in large-scale integrated circuits.

Description

technical field [0001] The invention belongs to the field of organic film preparation, and relates to a porous low-dielectric polyimide film. Background technique [0002] In recent years, with the development of ultra-large-scale integrated circuit (ULSL), high-density, high-speed, multi-functional integrated circuits are developing towards small size and high intelligence, but it is very easy to cause signal delay and crosstalk, which hinders the development of electronic products to be more miniaturized. Therefore, it is urgent to develop low dielectric constant materials to solve the above problems. However, the requirements for the dielectric layer of electronic devices are not only low dielectric constant, but also high hardness, pressure resistance, stability and not easy to decompose, high thermal stability, low thermal expansion coefficient and so on. [0003] Polyimide has outstanding comprehensive properties, and its initial decomposition temperature is generally...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08J9/26C08G73/10C08K3/36C08J5/18
Inventor 宋艳江吕亮刘顺祯
Owner WUXI SHUNXUAN NEW MATERIALS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com