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Low-temperature sintered low-dielectric glass ceramic composite substrate material and preparation method thereof

A glass-ceramic and composite substrate technology, which is applied in the field of low-temperature sintered low-kilometer glass-ceramic composite substrate materials and its preparation, can solve the problems of high slurry viscosity, high cost, and high sintering temperature, and achieve improved transmission speed, wiring density, and temperature The effect of stable coefficient and lower sintering temperature

Inactive Publication Date: 2015-09-30
UNIV OF ELECTRONIC SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, pure Al 2 o 3 The sintering temperature of ceramics is relatively high (1400-1500°C), so it cannot be directly co-fired with low melting point metals such as Ag and Cu.
In order to reduce the sintering temperature, one of the traditional methods is to add low melting point oxides, such as B 2 o 3 and V 2 o 5 , while the free B 2 o 3 and V 2 o 5 In the late casting process, it is easy to cause the viscosity of the slurry to be too large and unstable, which limits its practical application; another method is Al 2 o 3 -Crystalized glass, that is, a small amount of ceramics are added to the crystallized glass as a nucleating agent, and the final performance of the product depends on the degree of crystallization of the sample
However, this method requires a large amount of crystallized glass, resulting in high cost, which greatly limits the development of glass-ceramic composite substrate materials.

Method used

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  • Low-temperature sintered low-dielectric glass ceramic composite substrate material and preparation method thereof
  • Low-temperature sintered low-dielectric glass ceramic composite substrate material and preparation method thereof
  • Low-temperature sintered low-dielectric glass ceramic composite substrate material and preparation method thereof

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preparation example Construction

[0030] As mentioned above, the preparation method of low-temperature sintering low dielectric glass-ceramic composite substrate material includes the following steps:

[0031] a, according to the component distribution ratio of the MKBS glass, the Mg(OH) 2 、K 2 CO 3 , SiO 2 and H 3 BO 3 powder mixing;

[0032] b. Mix the mixed powder prepared in step a with deionized water as solvent, mix by wet ball milling, and then dry;

[0033] c. The dried powder is melted at a high temperature in the atmosphere at 1500°C, and formed into MKBS glass cullets after cooling;

[0034] d. Using deionized water as a solvent, wet ball mill the MKBS glass pieces obtained above, and then dry them at 100°C to obtain MKBS glass powder;

[0035] e, the above-mentioned MKBS glass powder and the Al that accounts for 60~150% by weight 2 o 3 Mixing, using deionized water as a solvent, mixing by wet ball milling, after drying, the acrylic acid solution with an additive amount of 2 to 5% of the to...

Embodiment 1

[0048] a. Mg(OH) 2 、K 2 CO 3 , SiO 2 and H 3 BO 3 Mixed powders, the masses of which are 0.0375g, 0.4175g, 26g and 21.05g respectively;

[0049] b. Mix the above prepared powder with deionized water as a solvent, wet ball mill for 6 hours, and then dry;

[0050] c. Melt the dried powder in the atmosphere at 1500°C for 1 hour at high temperature, and form MKBS glass cullets after cooling;

[0051] d. The above-mentioned MKBS glass pieces were wet ball milled with deionized water as a solvent for 6 hours, and then dried at 100°C to obtain MKBS glass powder;

[0052] e, the above-mentioned MKBS glass powder and 52.5g Al 2 o 3 Mixing, using deionized water as a solvent, mixing by wet ball milling for 8 hours, after drying, an acrylic acid solution with an additive amount of 2 to 5% of the total mass of raw materials is used as a binder for granulation;

[0053] f. The granules obtained by the above-mentioned granulation are dry-pressed and formed, and the forming pressure...

Embodiment 2

[0056] a. Mg(OH) 2 、K 2 CO 3 , SiO 2 and H 3 BO 3 The powders are mixed, and their masses are 0.075g, 0.375g, 26g and 21.05g respectively;

[0057] b. Mix the powder prepared in step a with deionized water as a solvent, wet ball mill and mix for 6 hours, and then dry;

[0058] c. Melt the dried powder in the atmosphere at 1500°C for 1 hour at high temperature, and form MKBS glass cullets after cooling;

[0059] d. The above-mentioned MKBS glass pieces were wet ball milled with deionized water as a solvent for 6 hours, and then dried at 100°C to obtain MKBS glass powder;

[0060] e, the above-mentioned MKBS glass powder and 52.5g Al 2 o 3 Mixing, using deionized water as a solvent, mixing by wet ball milling for 8 hours, after drying, an acrylic acid solution with an additive amount of 2 to 5% of the total mass of raw materials is used as a binder for granulation;

[0061] f. The granules obtained by the above-mentioned granulation are dry-pressed and formed, and the f...

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Abstract

The invention discloses a low-temperature sintered low-dielectric glass ceramic composite substrate material and a preparation method thereof. The low-temperature sintered low-dielectric glass ceramic composite substrate material comprises the following components: 40-62.5wt% of MKBS glass and 37.5-60wt% of Al2O3, wherein a mole ratio of the MKBS glass is that MgO:K2O:B2O3:SiO2 is equal to w:x:y:z; w is greater than 0.001 and less than 0.003; x is greater than 0.002 and less than 0.004; y is greater than 0.2 and less than 0.3; z is greater than 0.5 and less than 0.6; and Al2O3 is alpha-type Al2O3. A formula of the material is free of a heavy metal component, so that the material can be applied in a high-frequency field product, and is green, environment-friendly and pollution-free; the sintering temperature in the preparation method of the material is reduced to below 900 DEG C from the traditional sintering process above 1200 DEG C, so that the preparation method has an energy-saving advantage; the property of the material is excellent; a dielectric constant is less than 5; the loss is low (tan delta is less than 4*10<-3>); a temperature coefficient of resonance frequency is stable; and the mechanical strength is high (maximum exceeding 110MPa).

Description

technical field [0001] The invention belongs to the field of dielectric glass-ceramic composite substrate materials, in particular to a low-temperature sintered low-dielectric glass-ceramic composite substrate material and a preparation method thereof. Background technique [0002] The rapid development of the modern semiconductor industry has put forward higher requirements for electronic packaging, and multilayer substrate technology has emerged as the times require. The application of low-temperature co-fired glass-ceramic (LTCC) multilayer substrate improves the signal transmission speed and wiring density, and can meet the requirements of VLSI high-density packaging. It is the key basic material of modern communication technology. It is used in portable mobile phones, TV satellite reception Devices and military radars have very important applications, and are playing an increasingly important role in the miniaturization and integration of modern communication tools. Th...

Claims

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Application Information

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IPC IPC(8): C03C10/00
Inventor 周晓华杨新石张玉芹孙成礼张树人
Owner UNIV OF ELECTRONIC SCI & TECH OF CHINA