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Preparation method of TiSi-GrAl-N nanometer coating

A nano-coating and workpiece technology, applied in the field of nano-coating production, can solve the problems of high vapor deposition deposition temperature, limited types of substrate materials, and intergranular corrosion of substrates, and achieve low cost, high production efficiency, and improved durability. The effect of high temperature

Inactive Publication Date: 2015-10-28
合为真空纳米(苏州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The currently used TiN coating cannot meet the hardness requirements of the existing process due to its low hardness. The most important method at present is to use vapor phase deposition. However, the deposition temperature of vapor phase deposition is high, and the types of substrate materials that can be used are limited. , Vapor deposition uses chloride as raw material, chlorine enters the base material at high temperature, causing intergranular corrosion of the base material, making the workpiece brittle

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] 1. Pretreatment, firstly, grind, polish and degrease the surface of the workpiece to be coated;

[0018] 2. Cleaning, put the pretreated workpiece into the reaction furnace, and evacuate to a vacuum degree of 1×10 -3 Pa and pass argon gas to ensure that the pressure of argon gas is 3Pa, and the negative bias voltage of 600V is connected to the workpiece, and the electric field action time is 30min;

[0019] 3. Ion nitriding, feed nitrogen, adjust the flow ratio of nitrogen and argon to 3, control the total pressure in the reaction furnace to 0.3Pa and temperature to 400°C, the negative bias voltage of the workpiece to 600V, and the nitriding time to 4 hours;

[0020] 4. Prepare the transition layer, perform Ti bombardment cleaning on the workpiece after nitriding treatment, the time is 8min, then turn on the Ti target, the Ti target current is 60A, deposit the gradient TiN transition layer, and the process of depositing the gradient TiN transition layer is: first, nitro...

Embodiment 2

[0023] 1. Pretreatment, firstly, grind, polish and degrease the surface of the workpiece to be coated;

[0024] 2. Cleaning, put the pretreated workpiece into the reaction furnace, and evacuate to a vacuum degree of 1×10 -3 Pa and pass argon gas to ensure that the pressure of argon gas is 4Pa, and the negative bias voltage of 700V is connected to the workpiece, and the electric field action time is 30min;

[0025] 3. Ion nitriding, feed nitrogen, adjust the flow ratio of nitrogen and argon to 4, control the total pressure in the reaction furnace to 0.4Pa, temperature to 500°C, workpiece negative bias to 700V, and nitriding time to 4.5 hours;

[0026] 4. Prepare the transition layer, perform Ti bombardment cleaning on the workpiece after nitriding treatment, the time is 9min, then turn on the Ti target, the Ti target current is 80A, and deposit the gradient TiN transition layer. The process of depositing the gradient TiN transition layer is: first, nitrogen The flow ratio of n...

Embodiment 3

[0029] 1. Pretreatment, firstly, grind, polish and degrease the surface of the workpiece to be coated;

[0030] 2. Cleaning, put the pretreated workpiece into the reaction furnace, and evacuate to a vacuum degree of 1×10 -3 Pa and pass argon gas to ensure that the pressure of argon gas is 5Pa, and the negative bias voltage of 900V is connected to the workpiece, and the electric field action time is 30min;

[0031] 3. Ion nitriding, feed nitrogen, adjust the flow ratio of nitrogen and argon to 4:1, control the total pressure in the reaction furnace to 0.5Pa and temperature to 500°C, the negative bias voltage of the workpiece to 900V, and the nitriding time to 5 hours ;

[0032] 4. Prepare the transition layer, perform Ti bombardment cleaning on the workpiece after nitriding treatment, the time is 10min, then turn on the Ti target, the Ti target current is 100A, deposit the gradient TiN transition layer, the process of depositing the gradient TiN transition layer is: first, nit...

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Abstract

The invention relates to a preparation method of a TiSi-GrAl-N nanometer coating. The method comprises the first step of preprocessing, the second step of washing, the third step of ion nitriding, the fourth step of transition layer preparing and the fifth step of surface layer preparing. By means of the method, the bonding strength between the nanometer coating and a matrix can be improved through nitriding treatment, TiSi adopted in the nanometer coating is used for improving the corrosion resistance and the abrasion resistance of the nanometer coating, GrAl is used for improving the high-temperature-resistance of the nanometer coating, guaranteeing the bonding tightness of the nanometer coating, improving the rigidity of a workpiece and reducing the brittleness of the workpiece. According to the method, the production efficiency is high, and cost is low.

Description

technical field [0001] The invention relates to the field of nano-coating production, in particular to a preparation method of a TiSi-GrAl-N nano-coating. Background technique [0002] Nano-coating is to use the existing technology, add appropriate nano-materials according to the required performance, and make corresponding adjustments to the coating process. The production methods of nano-coating mainly include vapor deposition, various spraying (including normal temperature spraying, Flame spraying and plasma spraying, etc.), plating (including electroplating and chemical plating) and other methods. In the existing technology, in order to meet the requirements of high precision, automation, multi-function, high productivity, and environmental protection, special workpieces are required to have the characteristics of high temperature resistance, wear resistance, and corrosion resistance, and nano-coatings have the above advantages. , the use of nano-coating will become mor...

Claims

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Application Information

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IPC IPC(8): C23C8/36C23C14/34C23C14/06C23C28/00
Inventor 张建坡李亚军
Owner 合为真空纳米(苏州)有限公司
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