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A kind of chip bga package reinforcement method

A chip and reinforcing glue technology, used in semiconductor/solid-state device manufacturing, electrical components, inorganic adhesives, etc., can solve the problems of different heating temperatures, single glue removal methods, damage to peripheral components, etc., to improve strength, guarantee Reinforcement effect, effect of increasing internal bonding force

Active Publication Date: 2018-03-02
SUZHOU QITAI ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing BGA package reinforcement glue can only be removed by heating method, but depending on the glue material, the heating temperature is very different, and sometimes the temperature is too high will cause irreversible damage to the surrounding components, the single method of glue removal makes the original PCB that can be reworked The work board has become a "tasteless" "tasteless"

Method used

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  • A kind of chip bga package reinforcement method
  • A kind of chip bga package reinforcement method
  • A kind of chip bga package reinforcement method

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0041] Synthesis Example 1 Synthesis of monofunctional acrylate monomer

[0042] Add 12mL of hydroxyacrylic acid, 5ml of dimethylsilanediol, 100ml of absolute ethanol and 1g of sulfamic acid into the three-necked flask, reflux and stir for 3 hours, cool, and filter to obtain the liquid; then add 2ml of 85% phosphoric acid, 50ml of Dehydrated alcohol, reflux, stirring reaction for 10 hours, through silica gel column chromatography, developing agent is dichloromethane, obtain light yellow liquid, be monofunctional acrylate monomer, 1 H NMR (400 MHz, CDCl 3 ) δ 5.58 (s, -C=CH 2 , 1H), 6.11 (s, -C= CH 2 , 1H), 1.85(s, CH 3 , 3H); 31 P-NMR (ppm): 1.11.

Embodiment 1

[0043] Example 1: Preparation of thermosetting acrylic resin prepolymer

[0044] According to the composition molar ratio and reaction parameters in Table 1, first add benzoyl peroxide (3% of the mass of acrylic acid monomer) and dioxane into the reactor, heat to reflux, and then add monofunctional acrylate monomer , nitrogen-containing vinyl monomer, reflux reaction, then lower the temperature to 60 ° C, remove the solvent in vacuum, and finally add alcohol amine (5% of the mass of the acrylic acid monomer), and obtain a thermosetting acrylic resin prepolymer by column chromatography, which is a water-soluble Properties, molecular weight and molecular weight distribution are shown in Table 1.

[0045] Table 1 Composition of acrylic acid monomer and product molecular weight

[0046]

[0047] The structural formulas of monofunctional acrylate monomer and nitrogen-containing vinyl monomer are respectively: , .

Embodiment 2

[0048] Embodiment two: the preparation of reinforcing glue

[0049] According to the mass parts in Table 2, pour the silica sol into container A and keep the temperature at 25°C; put the thermosetting acrylic resin prepolymer into container B, stir at 80°C for 1h, then add the thermosetting acrylic resin prepolymer In the silica sol, stir for 0.5h; then add the water-based polyurethane compound into container A, and continue stirring for 2h; finally, add paraffin wax into container A, stir for 0.5h to obtain a BGA packaging reinforcement that can be cured at room temperature; out of the container for packaging.

[0050] Table 2 Reinforcing glue composition (mass parts)

[0051] group

[0052] Among them, 30(A) represents 30 parts of thermosetting acrylic resin prepolymer, which is the thermosetting acrylic resin prepolymer of Group A in Example 1.

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Abstract

The invention discloses a chip BGA encapsulation and reinforcement method, which comprises the following steps: after the chip is mounted on a PCB board by BGA, BGA encapsulation reinforcement glue is filled between the chip and the PCB board, and cured at room temperature for 5-30 minutes to complete the chip alignment. Reinforcement of BGA packages. The BGA package reinforcement method disclosed in the present invention has simple curing conditions, and can be cured by placing it at room temperature, avoiding the chip damage caused by heating and curing in the prior art and the complicated process of ultraviolet curing. The curing is fast during use, but the storage is stable before use. , avoiding the problem of poor storage performance caused by accelerated curing; and the cured glue is easy to remove, and it can be completely removed at room temperature, which overcomes the defect of the prior art that requires heating to remove the glue, and protects the quality of the BGA chip , effectively improve product yield.

Description

technical field [0001] The invention belongs to the technical field of electronic product preparation, and in particular relates to a method for encapsulating and reinforcing a chip BGA, which can complete the encapsulating and reinforcing the chip BGA at normal temperature. Background technique [0002] With the development of integrated circuit technology, the integration degree of silicon single chip has been continuously improved, and the packaging requirements for integrated circuits have become more stringent. In order to meet the needs of development, BGA came into being. Today, BGA once became the high Best choice for density, high performance, multi-pin packages. [0003] Encapsulation glue refers to a type of electronic glue or adhesive that can seal, encapsulate or pott some components. After potting, it can play the role of waterproof, moisture-proof, shockproof, dustproof, heat dissipation, and confidentiality. Common encapsulants mainly include epoxy encapsula...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/56C09J175/04C09J133/00C09J1/00
Inventor 贺晓锋
Owner SUZHOU QITAI ELECTRONICS CO LTD
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