A kind of activation-free cyanide-free chemical copper plating solution and its copper plating process

Abstract

The invention provides an environment-friendly activation-free cyanide-free chemical copper plating solution. Its special feature is that it contains copper sulfate pentahydrate, sodium hypophosphite, sodium citrate, boric acid, nickel sulfate, additives. The additive is one kind of pyridine substance and benzenesulfonic acid substance or a mixture of two kinds in any ratio. The invention also discloses a process for producing copper plating by adopting the environment-friendly activation-free cyanide-free chemical copper plating solution. The cyanide-free electroless copper plating solution of the invention does not contain formaldehyde, cyanide and other components that are harmful to the environment and human body, reduces environmental pollution, and belongs to the environment-friendly plating solution. The cyanide-free chemical copper plating production process eliminates the activation treatment step, and the cyanide-free chemical copper plating production process is simple. The cyanide-free electroless copper plating system is stable, and the processing cost of cyanide-free electroless copper plating is low. The manufactured chemical copper layer has good bonding force with the substrate, the surface of the plating layer is smooth without dendrite growth, and the crystallization is fine and bright.

Description

technical field [0001] The invention relates to a chemical copper plating solution in an activation-free cyanide-free chemical plating system and a copper plating method thereof, and relates to the technical field of metal material surface treatment. Background technique [0002] Electroless copper plating has many good advantages and can be widely used in fields such as printed circuit boards, electromagnetic shielding, radar reflectors, and decorative surface protection of materials. Electroless copper plating technology is mainly used to form conductive coatings on non-metallic surfaces, especially in printed circuit boards, where electroless copper plating plays an important role. Electroless copper plating is a process in which copper ions are reduced and precipitated on the surface of catalytically active substances through the action of a reducing agent. It is an autocatalytic redox reaction. First, the substrate is pretreated in the early stage, and the substrate is...

AI Technical Summary

Problems solved by technology

At present, most of the activation process uses precious metal solution and colloidal catalytic solution, which not only makes the electroless plating process complicated, but also increases the cost.